1 |
H. Kishi, Y. Mizuno, and H. Chazono, 'Basemetal electrode-multilayer ceramic capacitor: Past, present and future perspectives', Jpn. J. Appl. Phys., Vol. 42, p. 1, 2003
DOI
|
2 |
Y. Mizuno, T. Agiwara, H. Chazono, and H. Kishi, 'Effect of milling process on core-shell microstructure and electrical properties for -based Ni-MLCC', J. Urop. Ceram. Soc., Vol. 21, p. 1649, 2001
DOI
ScienceOn
|
3 |
Q. U. Feng and C. J. Mcconville, 'Dielectric degradation and microstructures of hetrogeneous interfaces in cofired multilayer ceramic capacitors', J. Electroceram., Vol. 14, p. 213, 2005
DOI
|
4 |
H. Chazono and H. Kishi, 'dc electrical degradation of the BT based materials for multilayer ceramic capacitor with Ni internal electrode: Impedance analysis and microstructure', Jpn. J. Appl. Phys., Vol. 40, p. 5624, 2001
DOI
|
5 |
이석원, 윤중락, 'X7R 적층칩 세라믹 캐패시터 조성의 희토류첨가에 따른 유전특성', 전기전자재료학회논문지, 16권, 12호, p. 1080, 2003
|
6 |
윤중락, 김민기, 이헌용, 이석원, '중,고압용 적층 세라믹 캐패시터 제작 및 분석', 전기전자재료학회논문지, 18권, 8호, p. 685, 2005
|
7 |
Electronic Industries Association, Specification, #RS198
|