• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.271-274
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• 2003

[ $Sr_xBa_{1-x}Nb_2O_6$ ] (SBN, $0.25{\leq}x{\leq}0.75$) ceramic is a ferroelectric material with tetragonal tungsten bronze (TTB) type structure, which has a high pyroelectric coefficient and a nonlinear electro-optic coefficient value. In spite of its advantages, SBN has not been investigated well compared to other ferroelectric materials with perovskite structure. In this study, SBN thin film was manufactured by ion beam sputtering technique using the prepared SBN target in $Ar/O_2$ atmosphere. SBN30 thin films of different thickness were pre-deposited as a seed layer on $Pt(100)/TiO_2/SiO_2/Si$ substrate followed by SBN60 deposition up to $4500\;{\AA}$ in thickness. As-deposited SBN60/SBN30 layer was heat-treated at different temperatures of 650, 700, 750, and $800\;^{\circ}C$ in air, respectively, The crystallinity and orientation behavior as well as electric properties of SBN60/SBN30 multi-layer were examined. The deposited layer was uniform and the orientation was shown primarily along (001) plane from XRD pattern. There was difference in the crystal structure with heat-treatment temperature, and the electric properties depended on the heating temperature and the seed-layer thickness. In electric properties of Pt/SBN60/SBN30/Pt thin film capacitor prepared, the remnant polarization (2Pr) value was $15\;{\mu}C/cm^2$, the coercive field (Ec) 65 kV/cm, and the dielectric constant 1492, respectively.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.12
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• pp.2210-2216
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• 2007

In this paper, triple-band plastic chip antennas for mobile terminal are investigated. Plastic chip antenna is composed of Foamex material with circle of PVC(Polyvilyl chloride). For its electric characteristics, the dielectric constant is 1.9, the insulation intensity is 112KV/cm. Plastic chip antennas are don't tend to break easily against to external shock, have more gain and efficiency than ceramic chip antennas. Triple-band plastic chip antennas of four type are implemented and experimented. From the experiments results, the antenna resonate at the triple-band, the gain of the antennas has about above -2dB, the pattern is ommidirectional the same as the conventional antennas. So, the antennas realized with Foamex material will be application for mobile phone antenna operated at the triple band which is cellular band and Korea-PCS band and ISM band or the antenna for other wireless communication system.

• Journal of Industrial and Engineering Chemistry
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• v.68
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• pp.117-123
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• 2018

Recently, aqueous method has attracted lots of attention because it enables the solution-processed metal oxide thin film with high electrical properties in low temperature fabrication condition to various flexible devices. Focusing the development of aqueous route, many researchers are only focused on metal oxide materials. However, for expansive application of the aqueous-based metal oxide films, the systematic study of performance change with process variables for the development of aqueous-based metal oxide insulator film is urgently required. Here, we propose importance of process variables to achieve high electrical-performance metal oxide insulator based on the aqueous method. We found that the significant process variables including precursor solution temperature and humidity during the spincoating process strongly affect chemical, physical, and electrical properties of $AlO_x$ insulators. Through the optimization of significant variables in process, an $AlO_x$ insulator with a leakage current value approximately $10^5$ times smaller and a breakdown voltage value approximately 2-3 times greater than un-optimized $AlO_x$ was realized. Finally, by introducing the optimized $AlO_x$ insulators to solutionprocessed $InO_x$ TFTs, we successfully achieved $InO_x/AlO_x$ TFTs with remarkably high average field-effect mobility of ${\sim}52cm^2V^{-1}\;s^{-1}$ and on/off current ratio of 106 at fabrication temperature of $250^{\circ}C$.

• Journal of Advanced Navigation Technology
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• v.23 no.2
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• pp.172-178
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• 2019

This paper has designed, fabricated, and analyzed the passive devices realized using low temperature co-fired ceramic (LTCC) multi layer substrates by dividing into the shrinkage process and the non-shrinkage process. Using two types of ceramic materials with dielectric constant 7 or 40, we have fabricated the same shape of various elements in 2 different processes and compared the characteristics. For the substrate of dielctric constant 40, compared with the shrinkage process which has 17% shrink in the X and Y directions with 36% shrink in the Z direction, the non-shrinkage process has 43% shrink in the Z direction without shrink in the X and Y directions, so high dimensional accuracy and surface flatness can be obtained. The inductances and capacitances of the fabricated elements are estimated from measurement using empirical analysis equations of parameters and implemented as a design library. Depending on the substrate and the process, the inductance and capacitance depending on the turn number of winding and unit area have been measured, and empirical polynomials are proposed to predict element values.

• Journal of the Korea Convergence Society
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• v.12 no.2
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• pp.29-34
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• 2021

In this paper, a cylindrical photonic crystal waveguide with a low-index core is first proposed. The core can be filled with air, liquid, or arbitrary dielectric materials. Exact analyses for the electromagnetic field characteristics of guided modes, by using appropriate Bessel functions and applying the boundary conditions, are performed to find out the guiding characteristics of the proposed waveguide. For verification and usage in design and manufacturing process, the computer-calculation of the waveguide transmission characteristics is also performed by applying the rigorous full-vectorial finite difference method. Providing variations of the effective area for the fundamental mode of the designed waveguide with different numbers of cladding layers, ranging from 2.6056 ㎛2 to 5.9673 ㎛2 over the operation wavelength, generally as the core refractive index n1 is higher, the mode area becomes smaller and the result leads to more optimistic effect for nonlinear device applications.

• Journal of Surface Science and Engineering
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• v.54 no.1
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• pp.30-36
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• 2021

In this study, double-layered anodizing films were formed on Al 5052 and Al 6061 alloys consecutively first in sulfuric acid and then in oxalic acid, and hardness, withstand voltage, surface roughness and acid resistance of the anodizing films were compared with single-layered anodizing films in sulfuric acid and oxalic acid electrolytes. Hardness of the double-layered anodizing film decreased with increasing ratio of inner layer to outer layer for both Al 5052 and Al 6061 alloys, suggesting that outer anodizing film formed in sulfuric acid electrolyte is damaged during the second anodizing in oxalic acid electrolyte. Withstand voltage of the double-layered anodizing films increased with increasing the thickness ratio of inner layer to outer layer. Surface roughness of the double-layered anodizing films were comparable with that of single-layered anodizing film formed in sulfuric acid but higher than that of single layer anodizing film formed in oxalic acid electrolyte. In acid resistance test, all of the double-layered and single-layered anodizing films showed good acid resistance more than 3 h without any visible gas evolution, which is attributable to sealing of pores. Based on the experimental results obtained in this work, it is possible to design a double-layered anodizing film with cost-effectiveness and improved physical and electrical properties by combining two consecutive anodizing processes of sulfuric acid anodizing and oxalic acid anodizing methods.

• Composites Research
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• v.22 no.3
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• pp.44-54
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• 2009

In this paper, we proposed a numerical model the complex permittivity for the E-glass fabric/epoxy composite laminate containing electrical conductive carbon black. The model is based on the percolation theory and for the composites over than the percolation threshold and in higher frequency band in that the AC conductivity is fully proportional to the frequency. The measurement for the complex permittivity wasperformed at the frequency band of 0.5 GHz $\sim$ 18.0 GHz using a vector network analyzer with a 7 mm coaxial air line. The proposed model is composed of the numerical equations of the scaling law used in percolation theory and constants obtained from experiments to quantify the model itself. The model describes the complex permittivity as the function of frequency and filler concentration. The model was verified by being compared with the measurements.

• Composites Research
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• v.36 no.5
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• pp.310-314
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• 2023

VaRTM(Vacuum assisted resin transfer molding) and VAP(Vacuum assisted process) processes are a type of RTM(Resin transfer molding) process, and are typical out-of-autoclave (OOA) processes that can manufacture large structures at low cost. In this paper, a resin filling test was conducted to compare the VaRTM and VAP processes, and the filling process and dimensional stability were compared. In addition, an analysis method to simulate the filling process was developed, and a dielectric sensor was used to detect the flow front of the resin, which was compared with the analysis results. From the resin filling test, the total filling time of the composite plate was measured to be 48 minutes for the VAP process and 145 minutes for the VaRTM process, and the filling time by the VAP process was reduced by about 67%. In addition, it was confirmed that the VAP process was superior to the VaRTM process in the thickness control ability and uniformity of the composite plate.

• Journal of IKEEE
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• v.22 no.1
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• pp.180-184
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• 2018

Gallium oxide ($Ga_2O_3$) and silicon carbide (SiC) are the material with the wide band gap ($Ga_2O_3-4.8{\sim}4.9eV$, SiC-3.3 eV). These electronic properties allow high blocking voltage. In this work, we investigated the characteristic of $Ga_2O_3$ and 4H-SiC vertical depletion-mode metal-oxide-semiconductor field-effect transistors. We demonstrated that the blocking voltage and on-resistance of vertical DMOSFET is dependent with structure. The structure of $Ga_2O_3$ and 4H-SiC vertical DMOSFET was designed by using a 2-dimensional device simulation (ATLAS, Silvaco Inc.). As a result, 4H-SiC and $Ga_2O_3$ vertical DMOSFET have similar blocking voltage ($Ga_2O_3-1380V$, SiC-1420 V) and then when gate voltage is low, $Ga_2O_3-DMOSFET$ has lower on-resistance than 4H-SiC-DMOSFET, however, when gate voltage is high, 4H-SiC-DMOSFET has lower on-resistance than $Ga_2O_3-DMOSFET$. Therefore, we concluded that the material of power device should be considered by the gate voltage.

• Korean Journal of Materials Research
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• v.2 no.3
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• pp.228-238
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• 1992

An investigation on the step-coverage of PECVD and $O_3$ ThCVD oxides was undertaken to implement into the void-free inter metal dielectric planarization using multi-chamber system for the submicron double level metallization. At various initial aspect ratios the instantaneous aspect ratios were measured through modelling and experiment by depositing the oxides up to $0.9{\mu}m$ in thickness in order to monitor the onset of void formation. The modelling was found to be in a good agreement with the observed instantaneous aspect ratio of TEOS-based PECVD oxide whose re-entrant angle was less than $5^{\circ}$. It is demonstrated that either keeping the instantaneous aspect ratio of PECVD oxide as a first layer less than a factor of 0.8 or employing Ar sputter etch to create sloped oxide edge ensures the void-free planarization after$O_3$ ThCVD oxide deposition whose step-coverage is superior to PECVD oxide. It has been observed that $O_3$ ThCVD oxide etchback scheme has shown higher yield of via contact chain than non etchback process, with resistance per via contact of $0.1~0.3{\Omega}/{\mu}m^2$.