Browse > Article
http://dx.doi.org/10.12673/jant.2019.23.2.172

Passive Device Library Implementation of LTCC Multilayer Board for Wireless Communications  

Cho, Hak-Rae (Department of Electronics Engineering, Incheon National University)
Koo, Kyung Heon (Department of Electronics Engineering, Incheon National University)
Publication Information
Journal of Advanced Navigation Technology / v.23, no.2, 2019 , pp. 172-178 More about this Journal
Abstract
This paper has designed, fabricated, and analyzed the passive devices realized using low temperature co-fired ceramic (LTCC) multi layer substrates by dividing into the shrinkage process and the non-shrinkage process. Using two types of ceramic materials with dielectric constant 7 or 40, we have fabricated the same shape of various elements in 2 different processes and compared the characteristics. For the substrate of dielctric constant 40, compared with the shrinkage process which has 17% shrink in the X and Y directions with 36% shrink in the Z direction, the non-shrinkage process has 43% shrink in the Z direction without shrink in the X and Y directions, so high dimensional accuracy and surface flatness can be obtained. The inductances and capacitances of the fabricated elements are estimated from measurement using empirical analysis equations of parameters and implemented as a design library. Depending on the substrate and the process, the inductance and capacitance depending on the turn number of winding and unit area have been measured, and empirical polynomials are proposed to predict element values.
Keywords
LTCC; Library; Helical inductor; MIM capacitor;
Citations & Related Records
연도 인용수 순위
  • Reference
1 W. Blood, F. Ling, T. Myers and M. Petras, "Library development process for embedded capacitors in LTCC," in IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524), Scottsdale: AZ, pp. 147-150, 2000.
2 A. Sutono, A. Pham, J. Laskar and W. Smith, "RF/microwave characterization of multilayer ceramic-based MCM technology," IEEE Transactions on Advanced Packaging, Vol. 22, No. 3, pp. 326-331, Aug. 1999.
3 K. Chen and S. Chung, "A novel compact balanced- to-unbalanced low-temperature co-fired ceramic bandpass filter with three coupled lines configuration," IEEE Transactions on Microwave Theory and Techniques, Vol. 56, No. 7, pp. 1714-1720, July 2008.   DOI
4 J. Sieiro, J. M. Lopez-Villegas, J. A. Osorio, T. Carrasco, M. N. Vidal and S. Ahyoune, "Synthesis of compact planar inductors in LTCC technology," in 2012 International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Seville: Spain, pp. 45-4, 2012.
5 M. Nicak, B. Psota, P. Kosina, J. Stary and J. Sandera, "Zero shrink LTCC 3D structure interconnections," in 2012 35th International Spring Seminar on Electronics Technology, Bad Aussee : Austria, 2012, pp. 128-132.
6 K. Tokita, Y. Hashimoto, K. Fujiwara, A. Suzuki, Y. Ishida and H. Yamaoka, "Development of zero-shrinkage-LTCC substrate for millimeter-wave applications," in 2018 Asia-Pacific Microwave Conference (APMC), Kyoto: Japan, pp. 1274-127, 2018.