• 제목/요약/키워드: Die set

검색결과 234건 처리시간 0.03초

반용융 알루미늄 합금의 Thixoforming 공정에서 점도의 변화가 유도특성에 미치는 영향 (Effect of Viscosity Variation on Flow Characteristic in Thixoforming Process of Semi-Solid Aluminium Alloys)

  • 강충길;이유철
    • 소성∙가공
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    • 제8권2호
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    • pp.188-199
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    • 1999
  • Semi-Solid Forming Process(Thixoforming, Rheocasting) is a novel forming process which has some advantages compared with conventional die casting, squeeze casting and hot/cold forging. In this study. Thixoforming process was selected as analysis processing in terms of billet handling and easiness of automation process. The Thixoforming process consists of reheating process of billet, billet handling, filling inot the die cavity and solidification of SSM part. In filling process, two rheology models which were Newtonian and Non-Nettonian model (Ostwald-deWaele)were verified with experimental results. The Ostwald-deWaele model shows the good agreement to the real flow and filling phenomena in die cavity. To give a boost the economical efficiency of Thixoforming process and to ensure the good forming result, reheating device coupled die set was proposed and the initial billet temperature for system that was found from experimental resluts. This study presents an overview of application of numerical analysis for simulation of semi-solid metal forming process to reduce the lead time for development of manufacturing part in industrial field.

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석고 다이에 대한 다이 강화제의 영향 (THE INFLUENCE OF THE DIE HARDENER ON GYPSUM DIE)

  • 김영림;박주미;송광엽
    • 대한치과보철학회지
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    • 제45권4호
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    • pp.546-554
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    • 2007
  • Statement of problem: Die materials require abrasion resistance, dimensional stability with time, and high surface wettability for adequate material properties. Wear of gypsum materials is a significant problem in the fabrication of accurately fitting cast prosthetic devices. So It has been recommended that the use of die hardener before carving or burnishing of the wax pattern. Purpose: The purpose of this study was to compare the abrasion resistance and surface microhardness(Knoop) with 3 commonly used gypsum die materials(MG Crystal Rock, Super plumstone, GC $FUJIROCK^{(R)}$ EP) with and without the application of 2 die hardeners. Material and methods: Three die materials were evaluated for abrasion resistance and surface microhardness after application of 2 die hardeners(Die hardener and Stone die & plaster hardener). Thirty specimens of each gypsum material were fabricated using an impression of resin die(Pattern resin; GC Corporation, Japan) with 1-mm high ridges, sloped 90 degrees. Gypsum materials were mixed according to manufacturer's recommendations and allowed to set 24 hours before coating. Specimens were arbitrary assigned to 1 of 3 treatment subgroups (n=10/subgroup): no treatment(control), coated with Die hardener, and coated with Stone die & plaster hardener. Abrasion resistance(measured by weight loss) was evaluated using device in 50g mass perpendicular to the ridges. Knoop hardness was determined by loading each specimen face 5 times for 15 seconds with a force of 50g. A scanning electron microscope was used to evaluate the surface of specimens in each treatment subgroup. Conclusions: The obtained results were as follows: 1. 3 types of die stone evaluated in this study did not show significant differences in surface hardness and abrasive resistance(P<.05). 2. In the abrasive resistance test, there were no significant differences between GC $FUJIROCK^{(R)}$ EP and MG Crystal Rock with or without 2 die hardener(P<.05). 3. Super plumstone treated with Stone die & plaster hardener showed increased wear loss(P<.05) 4. Die hardener coatings used in this study decreased the surface hardness of the gypsum material(P<.05).

8각 아웃렛 박스 제조용 금형 및 주변기기 개발 (Developing die and Peripheral Equipment Used for the Manufacture of Octagonal Outlet Boxes)

  • 최계광
    • 한국산학기술학회논문지
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    • 제6권6호
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    • pp.560-565
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    • 2005
  • 본 논문은 8각 아웃렛 박스 제조용 수동 금형을 2벌의 금형으로 자동화한 것에 관한 연구이다. 8각 아웃렛 박스는 건축물의 전선관용 스위치 박스 또는 배선 연결용 박스이다. 이 박스를 제조 할 때는 제 1차 프레스에서 성형하고 제 2-6차 프레스로 8각 아웃렛 박스의 4측면 가공과 벤딩을 하게 되므로 프레스 6대, 금형 6벌, 작업자 7명을 필요로 한다. 이 때문에 인건비 과다발생, 생산속도 저조, 불량률 $10\%$ 이상 발생, 제조원가 상승의 요인이 되고 있으며, 프레스의 굉음과 진동 및 안전사고의 위험 등으로 작업자들이 직무를 기피하고 있다. 이러한 현상을 없애기 위해 금형 5벌을 1벌의 금형에 통합시킨 캠금형 개발과 자동이송장치를 개발하였다. 그 결과 프레스 2대와 금형 2벌로 무인화 작업을 할 수 있게 되어 직무기피요인을 해소하게 되고 제조원가 절감효과를 얻게 되었다.

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반도체 리드 프레임 제조를 위한 프로그레시브 금형의 CAD/CAM 시스템 개발 (Development of Progressive Die CAD/CAM System for Manufacturing Lead Frame, Semiconductor)

  • 최재찬;김병민;김철;김재훈;김창봉
    • 한국정밀공학회지
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    • 제16권12호
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    • pp.230-238
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    • 1999
  • This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from plasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64) and tool kit on the ESPRIT. Transference of data among AutoCAD, I-DEAS Master Series Drafting, and ESPRIT is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of six modules, which are input and shape treatment, production feasibility check, strip-layout, die-layout, modelling, and post-processor modules. The system can design process planning and Die design considering several factors and generate NC data automatically according to drawings of die-layout module. As forming process of high precision product and die design system using 2-D geometry recognition are integrated with technology of process planning, die design, and CAE analysis, standardization of die part in die design and process planning of high pression product for semiconductor lead frame is possible to set. Results carried out in each module will provide efficiencies to the designer and the manufacturer of lead frame, semiconductor.

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3차원 메모리의 수율 증진을 위해 접합 공정에서 발생하는 추가 고장을 고려한 다이 매칭 방법 (A Die-matching Method for 3D Memory Yield Enhancement considering Additional Faults during Bonding)

  • 이주환;박기현;강성호
    • 대한전자공학회논문지SD
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    • 제48권7호
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    • pp.30-36
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    • 2011
  • 많은 반도체 회사들이 메모리 층 사이에서 수직 버스의 역할을 하는 TSV를 사용한 3차원 메모리를 개발하고 있다. 3차원 메모리는 KGD로 이루어지며, 만약 추가 고장이 접합 공정 중에 발생한다면, 반드시 수리되어야 한다. 공유 예비 셀을 가지는 3차원 메모리의 수율을 증진시키기 위해서, 3차원 메모리 내의 메모리 다이를 효과적으로 적층하는 다이 매칭 방법이 필요하다. 본 논문에서는 공유 예비 셀을 가지는 3차원 메모리의 수율 증진을 위해 접합 공정에서 추가 고장이 발생하는 경우를 고려한 다이 매칭 방법을 제안한다. 세 가지 경계 제한 조건이 제안하는 다이 매칭 방법에서 사용된다. 이 조건은 3차원 메모리를 제작하기 위해 선택하는 메모리 다이의 검색 범위를 제한한다. 시뮬레이션 결과는 제안하는 다이 매칭 방법이 3차원 메모리의 수율을 크게 향상 시킬 수 있음을 보여 준다.

성형하중 감소를 위한 냉간단조금형 최적설계에 관한 연구 (A study on the cold forging die geometry optimal design for forging load reduction)

  • 황준;이승현
    • 한국결정성장학회지
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    • 제32권6호
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    • pp.251-261
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    • 2022
  • 본 연구에서는 냉간단조공정에서 성형하중과 금형내 응력집중 감소를 위해 자동차 엔진 밸브 스프링 리테이너 제품의 형상최적화를 위한 금형형상 최적설계를 수행하였다. 기존 생산에 사용되는 각 성형공정별 냉간단조 금형에 대한 유한요소해석 시뮬레이션을 통해 절단공정을 포함해 총 6공정으로 구성되어 있는 냉간단조공정 별 단조 프리폼의 성형 시에 발생하는 성형하중과 성형유동 특성을 분석하였으며, 이를 통해 금형 내 응력집중이 발생하는 주요 설계인자를 확인하였다. 상형금형과 하형금형부의 챔퍼(chamfer) 및 에지필렛(edge fillet) 형상을 대상으로 4인자 3수준 설계인자 및 변수 수준을 설정하고, 성형해석 시뮬레이션과 다구찌법을 활용하여 설계인자별 영향도를 분석하여 최적의 최적설계인자를 결정하였다. 본 연구를 통해 얻어진 최적설계변수를 적용하여 엔진밸브 스프링 리테이너의 최적설계 시뮬레이션 결과, 각 프리폼 성형공정별로 최대 36 %, 전체 공정 평균 20 %의 성형하중 감소 효과를 얻을 수 있었다. 엔진의 고효율, 고출력, 고성능화 목표가 지속적으로 높아짐에 따라 고강도 소재의 활용이 많아지게 되어 이에 대응할 수 있는 성형공정 및 금형설계의 최적화가 필요하며, 향후 연구 결과를 활용하여 현업에 적용하여 제품단조성형성 개선 및 금형수명관리를 위한 기술자료로 활용하고자 한다.

눈움직임을 이용한 프레스작업의 안전성 평가에 대한 연구 (Safety Evaluation of Press Operation using Eye Movement)

  • 박경수;김유창
    • 한국안전학회지
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    • 제11권1호
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    • pp.129-132
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    • 1996
  • This paper presents an experiment which examines eye movement characteristics of novice and experienced workers in the press operation. Significant difference between the novice and the experienced workers was observed in fixation time, eye movement patterns, and spatial distribution of fixations when the top die hits the bottom die. There were no significant difference between the novice and the experienced workers in eye movement time. The results could be used to set up a guide to train the novice workers and to determine how long the novice should be trained.

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DIMM-in-a-PACKAGE Memory Device Technology for Mobile Applications

  • Crisp, R.
    • 마이크로전자및패키징학회지
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    • 제19권4호
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    • pp.45-50
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    • 2012
  • A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

원형포밍 성형 시 크랙 발생 최소화 방안에 관한 연구 (A Study on the cracks ways minimizing at circular forming)

  • 손종민;김세환;이춘규
    • Design & Manufacturing
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    • 제10권3호
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    • pp.20-24
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    • 2016
  • Foaming is a step of forming by the ratio of the internal combustion chamber in a state where the in flow of the material is suppressed, if the diameter is small and a high to a crack generated on the molding is not possible. The present study, we studied using as part experiments for forming the circular shape of the forming height of 10 mm without the occurrence of cracks, results preformed primary, the need to set the height of the forming than the height of the product, preformed secondary. It was able to increase the height of the molded product with less than the height of the next step to be carried out compression processing to create a small comer of the desired shape. In addition, it was found that on a great influence on the quality of the final quality on the final molding of the primary preformed, secondary.

압하율에 따른 기공압착 거동에 관한 실험적 연구 (An Experimental Study on Void Closure Behavior with respect to Reductions in Height)

  • 최익준;최호준;박훈재;최석우;정택우;박동규;최성규;임성주
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2009년도 춘계학술대회 논문집
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    • pp.114-117
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    • 2009
  • In this work, closing behavior of the voids generated in a casting process was investigated for various parameters such as reductions in height void size and billet rotation during hot open die forging process. The reduction in height and path schedule including the number of paths and billet rotation were chosen as key process variables to express the change of geometrical void shape and void closing behavior. On the other hand, values of die overlapping and die width ratio were set to be constant. Extend of void closure was observed and evaluated using tensile test and microscope. Based on the experimental result, it is ensured that void closure do not occur at 15% and 30% reduction in height as well as one or two rotations of a billet. The useful datum obtained from this study could be utilized to establish an optimum path schedule in the open die forging process.

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