• Title/Summary/Keyword: Deposited metal area

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Characteristics of metal-induced crystallization (MIC) through a micron-sized hole in a glass/Al/$SiO_2$/a-Si structure (Glass/Al/$SiO_2$/a-Si 구조에서 마이크론 크기의 구멍을 통한 금속유도 실리콘 결정화 특성)

  • Oh, Kwang H.;Jeong, Hyejeong;Chi, Eun-Ok;Kim, Ji Chan;Boo, Seongjae
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.06a
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    • pp.59.1-59.1
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    • 2010
  • Aluminum-induced crystallization (AIC) of amorphous silicon (a-Si) is studied with the structure of a glass/Al/$SiO_2$/a-Si, in which the $SiO_2$ layer has micron-sized laser holes in the stack. An oxide layer between aluminum and a-Si thin films plays a significant role in the metal-induced crystallization (MIC) process determining the properties such as grain size and preferential orientation. In our case, the crystallization of a-Si is carried out only through the key hole because the $SiO_2$ layer is substantially thick enough to prevent a-Si from contacting aluminum. The crystal growth is successfully realized toward the only vertical direction, resulting a crystalline silicon grain with a size of $3{\sim}4{\mu}m$ under the hole. Lateral growth seems to be not occurred. For the AIC experiment, the glass/Al/$SiO_2$/a-Si stacks were prepared where an Al layer was deposited on glass substrate by DC sputter, $SiO_2$ and a-Si films by PECVD method, respectively. Prior to the a-Si deposition, a $30{\times}30$ micron-sized hole array with a diameter of $1{\sim}2{\mu}m$ was fabricated utilizing the femtosecond laser pulses to induce the AIC process through the key holes and the prepared workpieces were annealed in a thermal chamber for 2 hours. After heat treatment, the surface morphology, grain size, and crystal orientation of the polycrystalline silicon (pc-Si) film were evaluated by scanning electron microscope, transmission electron microscope, and energy dispersive spectrometer. In conclusion, we observed that the vertical crystal growth was occurred in the case of the crystallization of a-Si with aluminum by the MIC process in a small area. The pc-Si grain grew under the key hole up to a size of $3{\sim}4{\mu}m$ with the workpiece.

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Planarization of SUS310 Metal Substrate Used for Coated Conductor Substrate by Chemical Solution Coating Method (화학적인 용액 코팅방법에 의한 박막형 고온초전도체에 사용되는 SUS310 금속모재의 평탄화 연구)

  • Lee, J.B.;Lee, H.J.;Kim, B.J.;Kwon, B.K.;Kim, S.J.;Lee, J.S.;Lee, C.Y.;Moon, S.H.;Lee, H.G.;Hong, G.W.
    • Progress in Superconductivity
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    • v.12 no.2
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    • pp.118-123
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    • 2011
  • The properties of $2^{nd}$ generation high temperature superconducting wire, coated conductor strongly depend on the quality of superconducting oxide layer and property of metal substrate is one of the most important factors affecting the quality of coated conductor. Good mechanical and chemical stability at high temperature are required to maintain the initial integrity during the various process steps required to deposit several layers consisting coated conductor. And substrate need to be nonmagnetic to reduce magnetization loss for ac application. Hastelloy and stainless steel are the most suitable alloys for metal substrate. One of the obstacles in using stainless steel as substrate for coated conductor is its difficulties in making smooth surface inevitable for depositing good IBAD layer. Conventional method involves several steps such as electro polishing, deposition of $Al_2O_3$ and $Y_2O_3$ before IBAD process. Chemical solution deposition method can simplify those steps into one step process having uniformity in large area. In this research, we tried to improve the surface roughness of stainless steel(SUS310). The precursor coating solution was synthesized by using yttrium complex. The viscosity of coating solution and heat treatment condition were optimized for smooth surface. A smooth amorphous $Y_2O_3$ thin film suitable for IBAD process was coated on SUS310 tape. The surface roughness was improved from 40nm to 1.8 nm by 4 coatings. The IBAD-MgO layer deposited on prepared substrate showed good in plane alignment(${\Delta}{\phi}$) of $6.2^{\circ}$.

Study on Electrode Selection for Electrochemical Detection of Cadmium and Lead (카드뮴과 납 전기화학적 검출을 위한 전극선정에 관한 연구)

  • Kim, Hak-Jin;Kim, Ki-Young;Moh, Chang-Yeon;Cho, Han-Keun
    • Journal of Biosystems Engineering
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    • v.33 no.6
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    • pp.404-409
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    • 2008
  • Excessive presence of heavy metals in environment affects plants and fruits grown in the contaminated area. Rapid on-site monitoring of heavy metals can provide useful information for efficiently characterizing heavy metal-contaminated sites and for minimizing the exposure of the contaminated food crops to humans. This study reports on the evaluation of gold and glassy carbon (GC) electrodes with mercury or bismuth as a coating material for simultaneous determination of cadmium (Cd) and lead (Pb) in 0.1 M $HNO_3$ solution by anodic stripping voltammetry (ASV). The use of a square-wave voltammetric potential between a working electrode and a reference electrode caused Cd and Pb ions deposited on the electrode surface to be oxidized, thereby generating electric currents at different potentials. The mercury-coated gold electrode was not sensitive enough to detect the usable range of Cd concentrations (1 to 100 ppb). The GC electrodes with mercury or bismuth displayed well-defined, sharp and separate current peaks for Cd and Pb ions when the square-wave voltammetric potentials were applied. The peak currents measured with both mercury- and bismuth- coated GC electrodes were linearly proportional to Cd and Pb concentrations in the range of 1 to 200 ppb in 0.1 M $HNO_3$ with strong linear relationships between concentration and peak current ($R^2$ > 0.95), indicating that both of Cd and Pb ions could be quantitatively measured.

Fabrication technology of the focusing grating coupler using single-step electron beam lithography (Single-step 전자빔 묘화 장치를 이용한 Focusing Grating Coupler 제작 연구)

  • Kim, Tae-Youb;Kim, Yark-Yeon;Sohn, Yeung-Joon;Han, Gee-Pyeong;Paek, Mun-Cheol;Kim, Hae-Sung;Shin, Dong-Hoon;Rhee, Jin-Koo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07b
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    • pp.976-979
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    • 2002
  • A focusing grating coupler (FGC) was not fabricated by the 'Continuous Path Control' writing strategy but by an electron-beam lithography system of more general exposure mode, which matches not only the address grid with the grating period but also an integer multiple of the address grid resolution (5 nm), To more simplify the fabrication, we are able to reduce a process step without large decrease of pattern quality by excluding a conducting material or layer such as metal (Al, Cr, Au), which are deposited on top or bottom of an e-beam resist to prevent charge build-up during e-beam exposure. A grating pitch period and an aperture feature size of the FGC designed and fabricated by e-beam lithography and reactive ion etching were ranged over 384.3 nm to 448.2 nm, and $0.5{\times}0.5mm^2$ area, respectively, This fabrication method presented will reduce processing time and improve the grating quality by means of a consideration of the address grid resolpution, grating direction, pitch size and shapes when exposing. Here our investigations concentrate on the design and efficient fabrication results of the FGC for coupling from slab waveguide to a spot in free space.

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A Study on the Formation of Polycrystalline Silicon Film by Lamp-Scanning Annealing and Fabrication of Thin Film Transistors (램프 스캐닝 열처리에 의한 다결정 실리콘 박막의 형성 및 TFT 제작에 관한 연구)

  • Kim, Tae-Kyung;Kim, Gi-Bum;Lee, Byung-Il;Joo, Seung-Ki
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.36D no.1
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    • pp.57-62
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    • 1999
  • Polycrystaline thin film transistors are fabricated on the transparent glass substrate by a lamp-scan annealing. The line-shaped lamp scanning method, which is profitable for large area process, effectively radiated silicon film on glass substrate. Amorphous silion film absorbs the light which is emitted from halogen-lamp and it transformed into crystalline silicon by metal-induced lateral crystallization. In order to enhance the annealing effect, capping layer was deposited on the whole substrate. When the scan speed was 1-2mm/sec, lateral crystallization of amorphous silicon under capping layer was 18~27${\mu}m/scan$. The thin film transistor fabricated by this method shows high electron mobility over 130$cm^2/V{\cdot}sec$

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A Study on the Heat Transfer Characteristics of Single Bead Deposition of Inconel 718 Superalloy on S45C Structural Steel Using a DMT Process (DMT 공정을 이용한 S45C 구조용강 위 Inconel 718 초합금 단일 비드 적층시 열전달 특성 분석에 관한 연구)

  • Lee, Kwang-Kyu;Ahn, Dong-Gyu;Kim, Woo-Sung;Lee, Ho-Jin
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.19 no.8
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    • pp.56-63
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    • 2020
  • The heat transfer phenomenon in the vicinity of the irradiated region of a focused laser beam of a DMT process greatly affects both the deposition characteristics of powders on a substrate and the properties of the deposited region. The goal of this paper is to investigate the heat transfer characteristics of a single bead deposition of Inconel 718 powders on S45C structural steel using a laser-aided direct metal tooling (DMT) process. The finite element analysis (FEA) model with a Gaussian volumetric heat flux is developed to simulate a three-dimensional transient heat transfer phenomenon. The cross-section of the bead for the FEA is estimated with an equivalent area method using experimental results. Through the comparison of the results of the experiments and those of the analysis, the effective beam radius of the bottom region of the volumetric heat flux and the efficiency of the heat flux model for different powers and travel speeds of the laser are predicted. From the results of the FEA, the influence of the power and the travel speed of the laser on the creation of a steady-state heat transfer region and the formation of the heat-affected zone (HAZ) in the substrate are investigated.

IZO/Ag/IZO Multilayers Prepared by Magnetron Sputtering for Flexible Transparent Film Heaters (마그네트론 스퍼터링 법을 이용한 IZO/Ag/IZO 다층 박막 투명 면상 발열체)

  • Park, So-Won;Gang, Dong-Ryeong;Kim, Na-Yeong;Hwang, Seong-Hun;Jeon, Seung-Hun;ZhaoPin, ZhaoPin;Kim, Tae-Hun;Kim, Seo-Han;Park, Cheol-U;Song, Pung-Geun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.114.2-114.2
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    • 2017
  • Transparent film heaters (TFHs) based on Joule heating are currently an active research area. However, TFHs based on an indium tin oxide (ITO) monolayer have a number of problems. For example, heating is concentrated in part of the device. Also, heating efficiency is low because it has high sheet resistance ($R_S$). Resistance of indium zinc oxide (IZO) is similar to ITO and it can be used to flexible applications due to its amorphous structure. To solve these problems, our study introduced hybrid layers of IZO/Ag/IZO deposited by magnetron sputtering, and the electrical, optical, and thermal properties were estimated for various thickness of the metal interlayer. It was found that the sheet resistance of the multilayer was mainly dependent on the thickness of the Ag layers. The $R_S$ of IZO(40)/Ag/IZO(40nm) multilayer was 5.33, 3.29, $2.15{\Omega}/{\Box}$ for Ag thickness of 10, 15, and 20nm, respectively, while the $R_S$ of an IZO monolayer(95nm) was $59.58{\Omega}/{\Box}$. The optical transmittance at 550nm for the IZO(95nm) monolayer is 81.6%, and for the IZO(40)/Ag/IZO(40nm) multilayers with Ag thickness 10, 15 and 20nm, is for 72.8, 78.6, and 63.9%, respectively. The defrost test showed that the film with the lowest RS had the highest heat generation rate (HGR) for the same applied voltage. The results indicated that IZO(40)/Ag(15)/IZO(40nm) multilayer has the best suitable property, which is a promising thin film heater for the application in vehicle windshield.

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Characteristics of ITO/Ag/ITO Hybrid Layers Prepared by Magnetron Sputtering for Transparent Film Heaters

  • Kim, Jaeyeon;Kim, Seohan;Yoon, Seonghwan;Song, Pungkeun
    • Journal of the Optical Society of Korea
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    • v.20 no.6
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    • pp.807-812
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    • 2016
  • Transparent film heaters (TFHs) based on Joule heating are currently an active research area. However, TFHs based on an indium tin oxide (ITO) monolayer have a number of problems. For example, heating is concentrated in only part of the device. Also, heating efficiency is low because it has high sheet resistance ($R_s$). To address these problems, this study introduced hybrid layers of ITO/Ag/ITO deposited by magnetron sputtering, and the electrical, optical, and thermal properties were estimated for various thicknesses of the metal interlayer. The $R_s$ of ITO(40)/Ag/ITO(40 nm) hybrid TFHs were 5.33, 3.29 and $2.15{\Omega}/{\Box}$ for Ag thicknesses of 10, 15, and 20 nm, respectively, while the $R_s$ of an ITO monolayer (95 nm) was $59.58{\Omega}/{\Box}$. The maximum temperatures of these hybrid TFHs were 92, 131, and $145^{\circ}C$, respectively, under a voltage of 3 V. And that of the ITO monolayer was only $32^{\circ}C$. For the same total thickness of 95 nm, the heat generation rate (HGR) of the hybrid produced a temperature approximately $100^{\circ}C$ higher than the ITO monolayer. It was confirmed that the film with the lowest $R_s$ of the samples had the highest HGR for the same applied voltage. Overall, hybrid layers of ITO/Ag/ITO showed excellent performance for HGR, uniformity of heat distribution, and thermal response time.

Characteristics of Organic Light-Emitting Diodes using PECCP Langmuir-Blodgett(LB) Film as an Emissive Layer (PECCP LB 박막을 발광층으로 사용한 유기 발광 다이오드의 특성)

  • Lee, Ho-Sik;Lee, Won-Jae;Park, Jong-Wook;Kim, Tae-Wan;Dou--Yol Kang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.111-114
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    • 1999
  • Electroluminescence(EL) devices based on organic thin films have been attracted lots of interests in large-area light-emitting display. In this stuffy, an emissive layer was fabricated using Langmuir-Blodgett(LB) technique in organic light-emitting (OLEDs). This emissive organic material was synthesized and named PECCP[poly(3.6-N-2-ethylhexyl carbazolyl cyanoterephthalidene)] which has a strong electron donor group and an electron acceptor group in main chain repeated unit. This material has good solubility in common organic solvents such as chloroform. THF, etc, and has a good stability in air. The Langmuir-Blodgett(LB) technique has the advantage of precise control of the thickness down to the molecular scale, In particular, by varying the film thickness it is possible to investigate the metal/polymer interface. Optimum conditions for the LB film deposition are usually determined by investigating a relationship between a surface pressure $\pi$ and an effective are A occupied by one molecule on the subphase. The LB films were deposited on an indium-tin-oxide(ITO) glass at a surface pressure of 10 mN/m and dipping speed of 12 mm/min after spreading PECCP solution on distilled water surphase at room temperature, Cell structure was ITO/PECCP LB film/Alq$_3$/Al. We considered PECCP as a hole -transport layer inserted between the emissive layer and ITO. We also used Alq$_3$ as an emissive layer and an electron transport layer. We measured current-voltage(I-V) characteristics, UV/visible absorption, PL spectrum and EL spectrum of the OLEDs.

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Fabrication Technology of the Focusing Grating Coupler using Single-step Electron Beam Lithography

  • Kim, Tae-Youb;Kim, Yark-Yeon;Han, Gee-Pyeong;Paek, Mun-Cheol;Kim, Hae-Sung;Lim, Byeong-Ok;Kim, Sung-Chan;Shin, Dong-Hoon;Rhee, Jin-Koo
    • Transactions on Electrical and Electronic Materials
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    • v.3 no.1
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    • pp.30-37
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    • 2002
  • A focusing grating coupler (FGC) was not fabricated by the 'Continuous Path Control'writing strategy but by an electron-beam lithography system of more general exposure mode, which matches not only the address grid with the grating period but also an integer multiple of the address grid resolution (5 nm). To more simplify the fabrication, we are able to reduce a process step without large decrease of pattern quality by excluding a conducting material or layer such as metal (Al, Cr, Au), which are deposited on top or bottom of an e-beam resist to prevent charge build-up during e-beam exposure. A grating pitch period and an aperture feature size of the FGC designed and fabricated by e-beam lithography and reactive ion etching were ranged over 384.3 nm to 448.2 nm, and 0.5 $\times$ 0.5 mm$^2$area, respectively. This fabrication method presented will reduce processing time and improve the grating quality by means of a consideration of the address grid resolution, grating direction, pitch size and shapes when exposing. Here our investigations concentrate on the design and efficient fabrication results of the FGC for coupling from slab waveguide to a spot in free space.