• Journal of Microbiology and Biotechnology
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• 제24권10호
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• pp.1397-1404
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• 2014

A few starters have been developed and used for doenjang fermentation but often without safety evaluation. Filamentous fungi were isolated from industrial doenjang koji, and their potential for mycotoxin production was evaluated. Two fungi were isolated; one was more dominantly present (90%). Both greenish (SNU-G) and whitish (SNU-W) fungi showed 97% and 95% internal transcribed spacer sequence identities to Aspergillus oryzae/flavus, respectively. However, the SmaI digestion pattern of their genomic DNA suggested that both belong to A. oryzae. Moreover, both fungi had morphological characteristics similar to that of A. oryzae. SNU-G and SNU-W did not form sclerotia, which is a typical characteristic of A. oryzae. Therefore, both fungi were identified to be A. oryzae. In aflatoxin gene cluster analysis, both fungi had norB-cypA genes similar to that of A. oryzae. Consistent with this, aflatoxins were not detected in SNU-G and SNU-W using ammonia vapor, TLC, and HPLC analyses. Both fungi seemed to have a whole cyclopiazonic acid (CPA) gene cluster based on PCR of the maoA, dmaT, and pks-nrps genes, which are key genes for CPA biosynthesis. However, CPA was not detected in TLC and HPLC analyses. Therefore, both fungi seem to be safe to use as doenjang koji starters and may be suitable fungal candidates for further development of starters for traditional doenjang fermentation.

• 한국통신학회논문지
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• 제30권9A호
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• pp.729-736
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• 2005

본 논문에서는 OFDMA/TDD 방식을 사용하는 휴대 인터넷 시스템에서 상향링크 부채널 할당 및 전력제어 알고리즘의 설계 및 구현에 대하여 살펴보았다. OFDMA 시스템에서 단말기의 송신전력은 기지국보다 낮게 설계되지만 단말기는 기지국과 같이 최소 1개부터 최대일 때 부채널 전부를 사용할 수 있기 때문에 부채널 전부를 사용할 수 있는 거리(FLR : full loading range)의 제한이 생기고 FLR 바깥에 위치한 단말은 기존의 개방루프 전력제어 방식을 사용할 수 없는 문제가 발생한다. 본 논문에서는 OFDMA 시스템의 ranging 정보를 이용하여 단말기의 위치를 파악하고 단말기의 위치에 따라서 사용가능한 부채널수를 제한하고 PCG(power concentration gain)를 인가하는 방식을 제안하였다. 시뮬레이션을 통한 실험결과에서 제안된 방식은 상향링크 통화반경을 셀 경계지역까지 확보하면서 무선자원의 최적 활용이 가능하며 FLR 바깥에서 상향링크 전력제어가 별도의 하드웨어 없이 가능함을 확인하였다.

• 폴리머
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• 제30권3호
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• pp.202-206
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• 2006

트리아세틴(TA)을 가소제로 이용하여 용융 가공법으로 가소화된 셀룰로오스 디아세테이트(CDA)를 제조하였다. 또한 2차 가소제로 에폭시화된 콩기름(ESO)을 사용하여 CDA의 가공성을 향상시켰다. DMA분석으로 CDA에 20%의 가소제를 사용한 경우 $T_g$가 약 $50^{\circ}C$ 낮게 나타났고 여기에 ESO를 5% 더 첨가했을 때는 약 $20^{\circ}C\;T_g$가 감소하였다. 또한 TA로 가소화된 CDA필름이 폴리프로필렌(PP) 또는 폴리락트산(PLA)보다 우수한 인장강도 및 탄성률을 나타내었다. 호기성 퇴비화 조건에서 CDA는 60일 동안 셀룰로오스 대비 약 90%의 생분해도를 나타내었다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권2호
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• pp.132-140
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• 2002

This paper presents an ARM-based SOC bus transaction verification IP and the usage experiences in SOC designs. The verification IP is an AMBA AHB protocol checker, which captures legal AHB transactions in FSM-style signal sequence checking routines. This checker can be considered as a reusable verification IP since it does not change unless the bus protocol changes. Our AHB protocol checker is designed to be scalable to any number of AHB masters and reusable for various AMBA-based SOC designs. The keys to the scalability and the reusability are Object-Oriented Programming (OOP), virtual port, and bind operation. This paper describes how OOP, virtual port, and bind features are used to implement AHB protocol checker. Using the AHB protocol checker, an AHB simulation monitor is constructed. The monitor checks the legal bus arbitration and detects the first cycle of an AHB transaction. Then it calls AHB protocol checker to check the expected AHB signal sequences. We integrate the AHB bus monitor into Verilog simulation environment to replace time-consuming visual waveform inspection, and it allows us to find design bugs quickly. This paper also discusses AMBA AHB bus transaction coverage metrics and AHB transaction coverage analysis. Test programs for five AHB masters of an SOC, four channel DMAs and a host interface unit are executed and transaction coverage for DMA verification is collected during simulation. These coverage results can be used to determine the weak point of test programs in terms of the number of bus transactions occurred and guide to improve the quality of the test programs. Also, the coverage results can be used to obtain bus utilization statistics since the bus cycles occupied by each AHB master can be obtained.

• 전자공학회논문지
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• 제51권4호
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• pp.33-41
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• 2014

본 논문에서는 모바일 시스템 환경에서 멀티포트 메모리 컨트롤러의 특성을 고려한 직접 메모리 접근 컨트롤러를 사용하여 고속 데이터 전송을 효과적으로 수행하는 메모리 액세스 방법을 보인다. 제안된 직접 메모리 접근 컨트롤러는 여러 개의 직접 메모리 접근 채널을 제어 할 수 있는 통합 채널 관리 기능을 제공하며, 그 채널들은 물리적으로 분리되어 서로 독립적으로 동작한다. 제안된 직접 메모리 접근 방법을 통한 데이터 전송을 이용함으로써 읽기 동작에 대하여 72%, 쓰기 동작에 대하여 69%의 데이터 전송 성능 향상을 얻었다. 특히, 4 채널 접근 모드에 대해서 제안된 방법이 기존 직접 메모리 접근 방법에 비하여 63% 적은 전체 전송 사이클을 가짐으로써 전송 성능 향상에 기여할 수 있음을 보인다.

• 생태와환경
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• 제40권4호
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• pp.569-575
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• 2007

This study was carried out to determine bioaccumulation levels of total mercury on various fish tissues in two streams (Banseok and Hasin Stream) and one lake (Yeongsan Lake) during April-May 2007. We also determined natural background levels of total mercury bioaccumulation to evaluate relative individual impacts of fish and compared the levels with reference sites as a preliminary study to evaluate heavy metal stressor using fish. For the study, we collected fishes in the sampling sites and analyzed the concentrations of total mercury in the liver, kidney, gill, vertebral column, and muscle tissues using Direct Mercury Analyzer (DMA-80, US EPA Method 7473). The levels varied depending on the types of waterbody and tissues used. Concentrations of total mercury ranged between 5.1${\mu}g$ $kg^{-1}$ and 108.6 ${\mu}g$ $kg^{-1}$ in the streams and between 5.3${\mu}g$ $kg^{-1}$ and 87.3 ${\mu}g$ $kg^{-1}$ in the reservoir, and the values were highest in the muscle tissues. Levels of natural background levels of total mercury, even though the sampling number was few, averaged 23.6 ${\mu}g$ $kg^{-1}$ in the study sites. The individual and mean values in each system was not so high in terms of US EPA criteria of fish health and human health, indicating that the impact was minor in the study site. Further studies should be done for the determination of mercury levels in the systems.

• Archives of Pharmacal Research
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• 제21권2호
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• pp.128-134
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• 1998

Nitric oxide synthase, NOS (EC.1.14.13.39), was purified from bovine pancreas over 5,500-fold with a 7.6% yield using 30% ammonium sulfate precipitation, and $2^1$,$5^1$-ADP-agarose and calmodulin-agarose affinity chromatography. The purified bovine pancreatic NOS (bpNOS) showed a single band on SDS-PAGE corresponding to an apparent molecular mass of 160 kDa, whereas it was 320 kDa on non-denaturating gel-filtration. This indicated a homodimeric nature of the enzyme. The specific activity of the purified bpNOS was 31.67 nmol L-citrulline fored/mtn/mg protein and an apparent $K\textrm{m}$ for L-arginine was 15.72 $\mu\textrm{M}$, The enzyme activity was dependent on $Ca^{2+}$ and calmodulin, and to a lesser extent on NADPH, FAD and FMN. $H_4B$ was not required as a cofactor for the activity. In an inhibition experiment with L-arginine analogues, $N^G$-nitro-L-arginine (NNA) had the most potent inhibitory effect on bpNOS, and $N^{G}$, $N^{G1}$-dimethyl-L-arginine (symmetric; sDMA) did not have any inhibitory effect. Immunohistochemical analysis of the bovine pancreas using brain type NOS antibody (anti-bNOS antibody) revealed that acinar cells showed strong immunoreactivity against the antibody.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• 마이크로전자및패키징학회지
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• 제13권3호
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• pp.39-45
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• 2006

다양한 에폭시 수지를 함유한 언더필의 열적 특성을 시차주사열량측정법, 열중량측정법, 동적-기계적 분석법, 열적-기계적 분석법과 같은 열 분석법을 이용하여 분석하였다. 또한, 언더필과 FR-4기판 사이의 접합 강도를 측정하였다. Cycolaliphatic 에폭시 수지를 함유한 언더필의 유리 전이 온도가 cycolaliphatic 에폭시 수지를 함유하지 않은 언더필의 유리 전이 온도보다 낮음을 확인할 수 있다. 대기로부터 유입된 산소와 열화된 폴리머 사이의 화학적 반응으로 인하여 언더필의 열적 감소 반응이 두 번 발생하는 것을 확인할 수 있다. Cycolaliphatic 에폭시 수지를 함유한 언더필의 열팽창 계수가 cycolaliphatic 에폭시 수지를 함유하지 않은 언더필의 열팽창 계수보다 높음을 확인할 수 있다. 과도한 경화 온도는 에폭시 수지의 경계면을 약하게 하여 에폭시 수지의 기계적 특성의 변화를 초래하게 되고 언더필과 FR-4 기판 사이의 접합 특성을 저하시키게 된다.