• 제목/요약/키워드: Curing mode

검색결과 97건 처리시간 0.021초

중합방법이 이중중합 레진시멘트의 미세경도에 미치는 영향 (Effect of curing modes on micro-hardness of dual-cure resin cements)

  • 이기덕;박세희;김진우;조경모
    • Restorative Dentistry and Endodontics
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    • 제36권2호
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    • pp.132-138
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    • 2011
  • 연구목적: 본 연구는 3종의 이중중합 레진시멘트에서 자가중합법과 이중중합법이 중합도에 미치는 영향을 간접적으로 알아보고자 시간경과에 따라 미세경도를 측정하였다. 연구 재료 및 방법: 실험을 위해 자가접착 레진시멘트인 Maxcem Elite (Kerr)와 Rely-X Unicem (3M ESPE) 및 전통형 레진시멘트인 Rely-X ARC (3M ESPE)를 사용하였으며 각 레진시멘트를 동일한 크기의 테플론 몰드에 채우고 자가중합법과 이중중합법으로 중합을 하여 각각 10개씩 시편을 제작하였으며 중합 시작 후 10분, 30분, 1시간, 3시간, 6시간, 12시간, 24시간이 지난 시점에 미세경도를 측정하였다. 결과: 각 시점에서 레진시멘트별로 중합법 사이의 비교를 위한 independent samples t-test 및 모든 실험군 사이의 비교를 위한 one-way ANOVA와 Scheffe 사후검정을 95% 유의수준에서 실시하여 다음과 같은 결과를 얻었다. 1. 모든 실험군에서 시간이 경과함에 따라 미세경도가 증가하는 경향을 보였다. 2. Maxcem에서 중합 1시간 후 부터를 제외하고 이중중합이 자가중합에 비해 높은 미세경도 값을 보였다(p<0.05). 3. 매 시점에서 자가중합법의 Rely-X Unicem이 가장 낮은 미세경도를 보였으며 이중중합법의 Rely-X Unicem이 가장 높은 미세경도 값을 보였다. 결론: 이상의 실험 결과로 볼 때 이중중합 레진시멘트의 충분한 중합을 위해서는 광조사를 반드시 하여야 할 것으로 생각한다.

Degree of conversion of two dual-cured resin cements light-irradiated through zirconia ceramic disks

  • Kim, Min-Jeong;Kim, Kyo-Han;Kim, Young-Kyung;Kwon, Tae-Yub
    • The Journal of Advanced Prosthodontics
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    • 제5권4호
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    • pp.464-470
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    • 2013
  • PURPOSE. The aim of this Fourier transform infrared (FTIR) spectroscopic study was to measure the degree of conversion (DC) of dual-cured resin cements light-irradiated through zirconia ceramic disks with different thicknesses using various light-curing methods. MATERIALS AND METHODS. Zirconia ceramic disks (KT12) with three different thicknesses (1.0, 2.0, and 4.0 mm) were prepared. The light transmittance of the disks was measured using ultraviolet visible near-infrared spectroscopy. Four different light-curing protocols were used by combining two curing light modes (Elipar TriLight (standard mode) and bluephase G2 (high power mode)) with light-exposure times of 40 and 120 seconds. The DCs of the two dual-cured resin cements (Duo-Link and Panavia F2.0) light-irradiated through the disks was analyzed at three time intervals (3, 7, and 10 minutes) by FTIR spectroscopy. The data was analyzed using repeated measures ANOVA (${\alpha}$=.05).Two-way ANOVA and Tukey post hoc test were used to analyze the 10 minute DC results. RESULTS. The 1.0 mm thick disk exhibited low light transmittance (<25%), and the transmittance decreased considerably with increasing disk thickness. All groups exhibited significantly higher 10 minute DC values than the 3 or 7 minute values (P<.05), but some exceptions were observed in Duo-Link. Two-way ANOVA revealed that the influence of the zirconia disk thickness on the 10 minute DC was dependent on the light-curing methods (P<.001). This finding was still valid even at 4.0 mm thickness, where substantial light attenuation took place. CONCLUSION. The curing of the dual-cured resin cements was affected significantly by the light-curing technique, even though the additional chemical polymerization mechanism worked effectively.

복합레진의 exponential 중합법이 상아질접착제의 미세인장접착강도에 미치는 영향 (EFFECT OF THE EXPONENTIAL CURING OF COMPOSITE RESIN ON THE MICROTENSILE DENTIN BOND STRENGTH OF ADHESIVES)

  • 성소래;서덕규;이인복;손호현;조병훈
    • Restorative Dentistry and Endodontics
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    • 제35권2호
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    • pp.125-133
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    • 2010
  • 접착제를 통해 치아에 접착되는 상부의 복합레진의 빠른 중합은 접착제층에 높은 중합수축응력을 발생시킨다. 중합수축응력을 경감시키기 위해서, LED 광중합기의 하나인 Elipar FreeLight 2 (3M ESPE, USA)에서는 최초 5초 이내에 광강도를 증가시키는 exponential 중합법을 채택하고 있다. 본 연구에서는 짧은 시간내에 광강도를 증가시키는 exponential 중합법이 복합레진의 초기 중합수축속도를 효과적으로 조절할 수 있는지를 알아보기 위해 접착제 적용 후 상부의 복합레진을 exponential 중합법과 continuous 중합법으로 중합하여 상아질접착제의 미세인장접착강도를 비교하였다. 3M사의 Scotchbond Multipurpose Plus (MP), Single Bond 2 (SB), 및 Adper Prompt (AP)의 세 종류의 접착제를 발치한 대구치의 교합면 상아질에 제조사의 지시에 따라 적용하고, 혼합형 복합레진인 Denfil (Vericom, Korea)을 두 가지광중합방법으로 중합하였다. 접착 후 48시간에 미세인장접착강도를 측정하고, 파절면은 FE-SEM.으로 관찰하였다. 그 결과, 각각의 접착제에서 중합방법에 따른 접착강도의 차이는 관찰할 수 없었다(Two-way ANOVA, p > 0.05). MP와 SB의 미세인장접착강도는 AP에 비해 유의하게 높았다(p < 0.05). 대부분의 파절시편에서는 혼합형 파절이 가장 많이 관찰되었으나, 중합방법에 따른 파절양상의 차이는 없었다. 결론적으로 5초 이내의 짧은 시간에 광강도를 증가시키는 exponential 중합법은 continuous 중합법과 비교하여 상아질접착제의 미세인장접착강도에 영향을 주지 않았다.

Effect of curing conditions on mode-II debonding between FRP and concrete: A prediction model

  • Jiao, Pengcheng;Soleimani, Sepehr;Xu, Quan;Cai, Lulu;Wang, Yuanhong
    • Computers and Concrete
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    • 제20권6호
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    • pp.635-643
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    • 2017
  • The rehabilitation and strengthening of concrete structures using Fiber-Reinforced Polymer (FRP) materials have been widely investigated. As a priority issue, however, the effect of curing conditions on the bonding behavior between FRP and concrete structures is still elusive. This study aims at developing a prediction model to accurately capture the mode-II interfacial debonding between FRP strips and concrete under different curing conditions. Single shear debonding experiments were conducted on FRP-concrete samples with respect to different curing time t and temperatures T. The J-integral formulation and constrained least square minimization are carried out to calibrate the parameters, i.e., the maximum slip $\bar{s}$ and stretch factor n. The prediction model is developed based on the cohesive model and Arrhenius relationship. The experimental data are then analyzed using the proposed model to predict the debonding between FRP and concrete, i.e., the interfacial shear stress-slip relationship. A Finite Element (FE) model is developed to validate the theoretical predictions. Satisfactory agreements are obtained. The prediction model can be used to accurately capture the bonding performance of FRP-concrete structures.

LED 광중합기의 조사 mode가 복합레진의 미세경도 및 수축응력에 미치는 영향 (INFLUENCE OF IRRADIATION MODES ON THE MICROHARDNESS AND THE POLYMERIZATION CONTRACTION OF COMPOSITE RESIN POLYMERIZED WITH LED CURING UNIT)

  • 박인호;오유향;이난영;이창섭;이상호
    • 대한소아치과학회지
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    • 제32권2호
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    • pp.312-320
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    • 2005
  • 이 연구의 목적은 LED 광중합기(Elipar Freelight $2^{(R)}$, 3M-ESPE, USA)의 조사 mode에 따른 복합레진($Supreme^{(R)}$, Filtek $Flow^{(R)}$, 3M-ESPE, USA)의 수축응력과 미세경도를 평가하는 것이다. 수축응력을 측정하기 위해 스트레인 게이지가 사용되었다. 표본은 조사 mode와 충전방법에 따라 6개의 군으로 나누어졌다. A군 : Filtek $Flow^{(R)}$ 이장, $Supreme^{(R)}$ 충전, 10초 광중합, B군 : Filtek $Flow^{(R)}$ 이장 $Supreme^{(R)}$ 충전, 15초 광중합, C군 : Filtek $Flow^{(R)}$ 이장, $Supreme^{(R)}$ 충전, 15초 soft start 광중합, D군 : $Supreme^{(R)}$ 충전, 10초 광중합, E군 : $Supreme^{(R)}$ 충전, 15초 광중합, F군 : $Supreme^{(R)}$ 충전, 15초 soft start광중합. 스트레인 게이지를 아크릴릭 링에 부착하고 strainmeter에 연결한 후 광중합하고 10분 동안 1초 간격으로 측정하고 기록하였다. 24시간 후에 각각 표본의 미세경도를 측정하였다. 결과는 ANOVA와 Tukey test를 이용해 통계학적으로 분석하였다. 결과는 다음과 같았다. 1. Soft start curing 했을 때 수축응력이 낮았다(p<0.05). Flowable resin을 이장한 군에서는 효과가 없었다. 2. 10초간 조사한 군은 15초간 조사한 군에 비해 수축응력이 적었다(p<0.05). 3. 미세경도 측정결과 상면과 하면에서 각 군 간에 차이는 없었다(p>0.05). 하지만, 하면의 미세경도가 상면에 비해 80%에 이르지 못했다.

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Mechanical behavior of hybrid steel-PVA fibers reinforced reactive powder concrete

  • Poorhoseina, Reza;Nematzadeh, Mahdi
    • Computers and Concrete
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    • 제21권2호
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    • pp.167-179
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    • 2018
  • Reactive powder concrete (RPC) is a type of ultra-high strength cement-based material with a dense microstructure, which is made of ultra-fine powders. RPC demonstrate a very brittle behavior, thus adding fibers improves its mechanical properties. In this study, it was attempted to investigate the effect of using steel and polyvinyl alcohol (PVA) fibers as well as their combination on the properties of RPC. In this regard, hooked-end crimped steel fibers together with short PVA fibers were utilized. Steel and PVA fibers were used with the maximum volume fraction of 3% and 0.75%, respectively, and also different combinations of these fibers were used with the maximum volume fraction of 1% in the concrete mixes. In total, 107 concrete specimens were prepared, and the effect of fiber type and volume fraction on the physico-mechanical properties of RPC including compressive strength, tensile strength, modulus of elasticity, density, and failure mode was explored. In addition, the effect of the curing type on the properties of compressive strength, modulus of elasticity, and density of RPC was evaluated. Finally, coefficients for conversion of cubic compressive strength to cylindrical one for the RPC specimens were obtained under the two curing regimes of heat treatment and standard water curing.

Effect of adhesive application method on repair bond strength of composite

  • Hee Kyeong Oh;Dong Hoon Shin
    • Restorative Dentistry and Endodontics
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    • 제46권3호
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    • pp.32.1-32.10
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    • 2021
  • Objectives: This study aimed to evaluate the effect of the application method of universal adhesives on the shear bond strength (SBS) of repaired composites, applied with different thicknesses. Materials and Methods: The 84 specimens (Filtek Z350 XT) were prepared, stored in distilled water for a week and thermocycled (5,000 cycles, 5℃ to 55℃). They were roughened using 400-grit sandpapers and etched with phosphoric acid. Then, specimens were equally divided into 2 groups; Single Bond Universal (SU) and Prime&Bond Universal (PB). Each group was subdivided into 3 subgroups according to application methods (n = 14); UC: 1 coat + uncuring, 1C: 1 coat + curing, 3C: 3 coats + curing. After storage of the repaired composite for 24 hours, specimens were subjected to the SBS test and the data were statistically analyzed by 2-way analysis of variance and independent t-tests. Specimens were examined with a stereomicroscope to analyze fracture mode and a scanning electron microscope to observe the interface. Results: Adhesive material was a significant factor (p = 0.001). Bond strengths with SU were higher than PB. The highest strength was obtained from the 1C group with SU. Bonding in multiple layers increased adhesive thicknesses, but there was no significant difference in SBS values (p = 0.255). Failure mode was predominantly cohesive in old composites. Conclusions: The application of an adequate bonding system plays an important role in repairing composite resin. SU showed higher SBS than PB and the additional layers increased the adhesive thickness without affecting SBS.

반도체 패키지의 응력 해석 (The Stress Analysis of Semiconductor Package)

  • 이정익
    • 한국공작기계학회논문집
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    • 제17권3호
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    • pp.14-19
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    • 2008
  • In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

발광 다이오드 광중합기의 복합레진 중합 평가 (Evaluation of New LED Curing Light on Resin Composite Polymerization)

  • 강지은;전새로미;김종빈;김종수;유승훈
    • 대한소아치과학회지
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    • 제41권2호
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    • pp.152-156
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    • 2014
  • 최근 도입된 광범위 스펙트럼의 발광 다이오드 광중합기는 4개의 램프로 구성되어 있으며 다양한 중합 모드를 가지고 있다. 이 연구는 광범위 스펙트럼 발광 다이오드($VALO^{(R)}$, Ultradent, USA) 광중합기와 기존의 발광 다이오드 광중합기 ($Elipar^{TM}$ Freelight 2, 3M ESPE, USA)의 효율을 미세경도 시험을 통해 비교하였다. 연구에 사용한 광중합기는 $VALO^{(R)}$$Elipar^{TM}$ Freelight 2이며 중합 시간은 제조사의 지시에 따랐다. $37^{\circ}C$의 생리식염수에 중합된 레진 시편을 24시간 동안 보관한 후 미세경도 시험을 시행하였다. 시편 상부와 하부의 복합레진 미세경도는 공분산분석을 시행하였다. 광범위 스펙트럼의 발광 다이오드 광중합기를 이용하여 고성능 모드에서 4초, 플라즈마 모드에서 20초 광중합을 실시한 복합레진 시편의 상부는 기존의 발광 다이오드 광중합기에 비해 미세경도가 증가하였으나(p < 0.05), 시편의 하부에서는 실험에 사용된 광중합기 간에 유의성 있는 차이를 보이지 않았다.

The effect of saliva decontamination procedures on dentin bond strength after universal adhesive curing

  • Kim, Jayang;Hong, Sungok;Choi, Yoorina;Park, Sujung
    • Restorative Dentistry and Endodontics
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    • 제40권4호
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    • pp.299-305
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    • 2015
  • Objectives: The purpose of this study was to investigate the effectiveness of multiple decontamination procedures for salivary contamination after curing of a universal adhesive on dentin bond strength according to its etch modes. Materials and Methods: Forty-two extracted bovine incisors were trimmed by exposing the labial dentin surfaces and embedded in cylindrical molds. A universal adhesive (All-Bond Universal, Bisco) was used. The teeth were randomly divided into groups according to etch mode and decontamination procedure. The adhesive was applied according to the manufacturer's instructions for a given etch mode. With the exception of the control groups, the cured adhesive was contaminated with saliva for 20 sec. In the self-etch group, the teeth were divided into three groups: control, decontamination with rinsing and drying, and decontamination with rinsing, drying, and adhesive. In the etch-and-rinse group, the teeth were divided into four groups: control, decontamination with rinsing and drying, decontamination with rinsing, drying, and adhesive, and decontamination with rinsing, drying, re-etching, and reapplication of adhesive. A composite resin (Filtek Z350XT, 3M ESPE) was used for filling and was cured on the treated surfaces. Shear bond strength was measured, and failure modes were evaluated. The data were subjected to one-way analysis of variation and Tukey's HSD test. Results: The etch-and-rinse subgroup that was decontaminated by rinse, drying, re-etching, and reapplication of adhesive showed a significantly higher bond strength. Conclusions: When salivary contamination occurs after curing of the universal adhesive, additional etching improves the bond strength to dentin.