• 대한금속재료학회지
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• 제48권3호
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• pp.248-255
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• 2010

The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.19-27
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• 2003

플립칩 전자패키지에서 칩과 기판(PCB)를 연결할 때, 통상적으로 칩쪽은 금속패드/UBM 처리를 기판 쪽은 표면처리를 한 후 솔더로 연결하는데, 이 때 사용되는 UBM이나 표면처리에 따라, 칩/솔더, PCB/솔더에 생성되는 금속간 화합물의 종류와 두께 및 솔더의 조성이 변하게 되어 궁극적으로 솔더 접합부의 기계적 신뢰성에 영향을 주게 된다. 본 연구에서는 Cu와 Au/Ni의 두가지 금속 패드가 무연솔더의 저주기 피로특성에 어떠한 영향을 미치는 지에 대해 고찰해 보았다. 저주기 피로 실험은 Cu나 Au/Ni이 표면처리 된 기판에 무연솔더 (Sn-3.5Ag, Sn-3.5Ag-1.5Cu, Sn-3.5Ag-XBi(X=2.5, 7.5), Sn-0.7Cu)를 리플로하여 총변위를 변화시키면서 상온에서 시행하였다. 기판의 표면처리에 관계없이 Sn-3.5Ag, Sn-3.5Ag-XCu(X-0.75, 1.5), Sn-0.7Cu 합금이 Sn-3.5Ag-7.5Bi 합금보다 피로저항성이 현격히 좋았으며, Au/Ni 표면처리한 솔더 접합부가 Cu 처리한 경우보다 피로저항성이 뛰어난 것으로 나타났다. 파괴 후 단면을 조사한 결과 계면에 형성된 금속간 화합물 내에 미세균열이 발견되었는데, Cu 표면처리를 사용한 경우 더 많은 미세균열이 생성된 것을 볼 수 있었다. Sn-3.5Ag, Sn-3.5Ag-Cu(X=0.75, 1.5), Sn-0.7Cu 합금의 경우 금속간 화합물 내에 생기는 미세 균열이 거시 균열로 성장하지 않고 파단은 항상 솔더 내부로 일어난 반면. Bi를 함유한 솔더의 경우, 기판의 표면처리에 상관없이 금속간 화합물/솔더 계면으로 균열이 생성 진전되어 다른 솔더합금에 비해 열악한 피로저항성을 나타내는 것으로 보인다. 이것은 Bi의 금속간화 합물/솔더 입계 편석이나 Bi 합금이 다른 합금에 비해 높은 경도값을 가지는 것에 인한 것으로 보여 진다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.94-98
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• 2003

The microstructure of Sn1.8Bi0.8Cu0.6In alloys was evaluated at various aging time. The bumps of Sn1.8Bi0.8Cu0.6In alloys after reflowed at $250^{\circ}C$ were well-formed and had 260um height. The craters on the bumps, however, were observed. Intermetallic compounds formed on the interface between so]der and Cu/Ni UBM were consist of $(Cu,Ni)_6Sn_5$. As aging goes on up to 1000hours, the composition of Ni changed from $6.63\%$ at initial stage(as-reflowed) to $13.47\%$ at final stage(1000hours aging ). In addition, after 500hours aging, the floating of IMC to the solder was observed.

• 한국주조공학회지
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• 제5권3호
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• pp.19-26
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• 1985

This study has been carried out to examine into wettability of Cu-5%Sn alloy in $Al_2O_3$, MgO, $SiO_2$ and graphite, respectively and investigated into the change in macrostructure of Cu-5%Sn alloy according to kind and mixing rate of mold-coating. The results obtained from the experiment are summerized as follows; 1. Cu Cu-5%Sn alloy, wettabilities of $Al_2O_3$ and MgO were good, on the other hand, wettabilities of $SiO_2$ and graphite were bad. 2. The fine equiaxed zone was created because of the role of $Al_2O_3$ and MgO as preferential nucleation sites. 3. Notwithstanding change of mixing rate of $SiO_2$ in mold coating the equixed zone was not created. 4. The area of equiaxed zone was varied according to mixing rate in the case of using $Al_2O_3$ and MgO in mold-coating.

• 한국환경과학회지
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• 제14권7호
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• pp.669-674
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• 2005

Catalytic combustion of toluene was investigated on $CuOx/SnO_2-ZrO_2\;CuOx/SnO_2\;CuOx/ZrO_2$ catalysts prepared by impregnation. Characteristics of catalysts loaded on binary support and single support were observed by TPR, TPO, XRD, XPS techniques. The results on catalytic combustion showed that binary supports improve the activity of copper in the combustion of toluene. The reason for high catalytic activity on toluene combustion of $CuOx/SnO_2-ZrO_2$ catalyst was ascribed to oxidation$\cdot$reduction activity at low temperatures and stability of oxidation state after reduction.

• 한국재료학회지
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• 제12권9호
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• 마이크로전자및패키징학회지
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• 제17권3호
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• pp.27-32
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• 2010

Cu pillar 범프와 Sn 패드로 구성된 플립칩 접속부를 형성한 후, Sn 패드의 높이에 따른 Cu pillar 플립칩 접속부의 열 싸이클링 및 고온유지 신뢰성을 분석하였다. Cu pillar 플립칩 접속부를 구성하는 Sn 패드의 높이가 5 ${\mu}m$에서 30 ${\mu}m$로 증가함에 따라 접속저항이 31.7 $m{\Omega}$에서 13.8 $m{\Omega}$로 감소하였다. $-45^{\circ}C{\sim}125^{\circ}C$ 범위의 열 싸이클을 1000회 인가한 후에도 Cu pillar 플립칩 접속부의 접속저항의 증가가 12% 이하로 유지되었으며, 열 싸이클링 시험전과 거의 유사한 파괴 전단력을 나타내었다. $125^{\circ}C$에서 1000 시간 유지시에도 Cu pillar 플립칩 접속부의 접속저항의 증가가 20% 이하로 유지되었다.

• Journal of Welding and Joining
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• 제31권5호
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

• 대한금속재료학회지
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• 제49권5호
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• pp.411-418
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• 2011

The current study investigates the electroplating characteristics of Sn-Cu eutectic micro-bumps electroplated on a Si chip for flip chip application. Under bump metallization (UBM) layers consisting of Cr, Cu, Ni and Au sequentially from bottom to top with the aim of achieving Sn-Cu bumps $10\times10\times6$ ${\mu}m$ in size, with 20${\mu}m$ pitch. In order to determine optimal plating parameters, the polarization curve, current density and plating time were analyzed. Experimental results showed the equilibrium potential from the Sn-Cu polarization curve is -0.465 V, which is attained when Sn-Cu electro-deposition occurred. The thickness of the electroplated bumps increased with rising current density and plating time up to 20 mA/$cm^2$ and 30 min respectively. The near eutectic composition of the Sn-0.72wt%Cu bump was obtained by plating at 10 mA/$cm^2$ for 20 min, and the bump size at these conditions was $10\times10\times6$ ${\mu}m$. The shear strength of the eutectic Sn-Cu bump was 9.0 gf when the shearing tip height was 50% of the bump height.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.17-21
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• 2008

Sn-Cu계 솔더 범프에서 무전해도금법을 이용한 범프 형성에 대한 연구를 하였다. $20{\mu}m$ via에 전기도금법으로 구리를 채운 웨이퍼 위에 ball형태의 범프를 형성하기 위하여 구리와 주석을 도금하여 약 $10{\mu}m$높이의 범프를 형성하였다. 구리 범프 형성 시 via위에 선택적으로 도금하기 위하여 활성화 처리 후 산세처리를 실시하고 무전해 도금액에 안정제를 첨가하였다. 무전해도금법을 이용하여 주석 범프 형성 시 도금층이 구리 범프에 비해 표면의 균일도가 벌어지는 것으로 관찰되었지만 reflow공정을 실시한 후 ball 형태의 균일한 Sn-Cu 범프를 형성하였다.