Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
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Microstructural Control of Al-Sn Alloy with Addition of Cu and Si

Cu와 Si 첨가에 의한 Al-Sn 합금의 미세조직 제어

  • Son, Kwang Suk (Dept. of Materials Science and Engineering, Dong-A University) ;
  • Park, Tae Eun (Dept. of Materials Science and Engineering, Dong-A University) ;
  • Kim, Jin Soo (Dept. of Materials Science and Engineering, Dong-A University) ;
  • Kang, Sung Min (Dept. of Materials Science and Engineering, Dong-A University) ;
  • Kim, Tae Hwan (Il Kwang Metal Works Co.) ;
  • Kim, Donggyu (Dept. of Materials Science and Engineering, Dong-A University)
  • Received : 2009.11.30
  • Published : 2010.03.20
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Abstract

The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface.

Keywords

Acknowledgement

Supported by : 한국산업기술진흥원

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