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http://dx.doi.org/10.3365/KJMM.2010.48.03.248

Microstructural Control of Al-Sn Alloy with Addition of Cu and Si  

Son, Kwang Suk (Dept. of Materials Science and Engineering, Dong-A University)
Park, Tae Eun (Dept. of Materials Science and Engineering, Dong-A University)
Kim, Jin Soo (Dept. of Materials Science and Engineering, Dong-A University)
Kang, Sung Min (Dept. of Materials Science and Engineering, Dong-A University)
Kim, Tae Hwan (Il Kwang Metal Works Co.)
Kim, Donggyu (Dept. of Materials Science and Engineering, Dong-A University)
Publication Information
Korean Journal of Metals and Materials / v.48, no.3, 2010 , pp. 248-255 More about this Journal
Abstract
The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface.
Keywords
Al-Sn; alloys; casting; wear; electron backscattering;
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Times Cited By SCOPUS : 1
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