Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2003.11a
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- Pages.94-98
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- 2003
Micorstructure of Sn1.8Bi0.8Cu0.6In alloy during thermal aging
시료에 따른 Sn1.8Bi0.8Cu0.6In솔더의 미세구조
- Published : 2003.11.01
Abstract
The microstructure of Sn1.8Bi0.8Cu0.6In alloys was evaluated at various aging time. The bumps of Sn1.8Bi0.8Cu0.6In alloys after reflowed at
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