• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.953-954
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• 2006

Ti-Cu-Ni-Sn quaternary amorphous alloys of $Ti_{50}Cu_{32}Ni_{15}Sn_3$, $Ti_{50}Cu_{25}Ni_{20}Sn_5$, and $Ti_{50}Cu_{23}Ni_{20}Sn_7$ composition were prepared by mechanical alloying in a planetary high-energy ball-mill (AGO-2). The amorphization of all three alloys was found to set in after milling at 300rpm speed for 2h. A complete amorphization was observed for $Ti_{50}Cu_{32}Ni_{15}Sn_3$ and $Ti_{50}Cu_{25}Ni_{20}Sn_5$ after 30h and 20h of milling, respectively. Differential scanning calorimetry analyses revealed that the thermal stability increased in the order of $Ti_{50}Cu_{32}Ni_{15}Sn_3$, $Ti_{50}Cu_{25}Ni_{20}Sn_5$, and $Ti_{50}Cu_{23}Ni_{20}Sn_7$.

• Journal of Welding and Joining
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• v.7 no.3
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• pp.36-43
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• 1989

The furnace brazing in a Ar of copper to martensitic stainless steel(13.5Cr) using Cu-(5~8%)P-(0~8%)Sn powders was investigated. Shear strength, wettability, reacted layer, defect ratio at the stainless steel interface was evaluated. As Sn was added to the Cu-P powders, defect ratio and P content at the stainless steel interface decreased. And also as Sn was added, defect form at the stainless steel interface changed from the continuous layer to the discrete type, and shear strength of the brazed joint increased.

• Journal of Powder Materials
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• v.16 no.4
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• pp.268-274
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• 2009

For the purpose of obtaining basic information on the development of lead-free materials, a high density composites (a) W-Cu, (b) W-Sn (c)W-Cu-Sn and (d) W-Cu-Ni were fabricated by the P/M method. The particle size of used metal powders were under 325 mesh, inner size of compaction mould was $\phi8$ mm, and compaction pressure was 400 MPa. A High density composite samples were sintered at a temperature between $140^{\circ}C$ and $1050^{\circ}C$ for 1 hour under Ar atmosphere. The microstructure, phase transformation and physical properties of the sintered samples were investigated. As the results, the highest relative density of 95.86% (10.87 g/$cm^3$) was obtained particularly in the sintered W-Cu-Sn ternary system sample sintered at 450 for 1hr. And, Rockwell hardness (HRB) of 70.0 was obtained in this system.

• ETRI Journal
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• v.35 no.6
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• pp.1152-1155
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• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• Journal of the Korean institute of surface engineering
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• v.44 no.5
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• pp.185-189
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• 2011

$Cu_2ZnSnSe_4$ thin films for solar absorber application were prepared by pulsed laser deposition of a synthesized $Cu_2ZnSnSe_4$ compound target. The film's composition revealed that the deposited films possess an identical composition with the target material. Further film compositional control toward a stoichiometric composition was performed by optimizing substrate temperature, deposition time and target rotational speed. At the optimum condition, X-ray diffraction patterns of films showed that the films demonstrated polycrystalline stannite single phase with a high degree of (112) preferred orientation. The absorption coefficient of $Cu_2ZnSnSe_4$ thin films were above 104 cm.1 with a band gap of 1.45 eV. At an optimum condition, films were identified as a p type semiconductor characteristic with a resistivity as low as $10^{-1}{\Omega}cm$ and a carrier concentration in the order of $10^{17}cm^{-3}$.

• Journal of Powder Materials
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• v.11 no.3
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• pp.193-201
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• 2004

1960년 Au-Si계 합금에서 처음으로 비정질상이 급속 응고법에 의해 보고된 이래/sup 1)/ 지난 40년 간 많은 합금계에서 비정질상이 보고되어졌다. 대표적으로 Fe-, Ni-, Co기 합금 등 많은 합금계에서 비정질상이 보고되었으나, 비정질상의 형성을 위해서는 약 105 K/s이상의 높은 냉각속도를 필요로 하였다. 1980년대 수백 K/s의 낮은 냉각속도 하에서도 비정질상이 형성될 수 있는 다원계 합금(multi-component alloy)이 Mg-Ln-(Ni, Cu, Zn), Ln-Al-TM 합금에서 보고되어 졌으나 많은 관심을 받지 못하다가 1993년 Zr-Ti-Ni-Cu-Be 합금에서 수 ㎝ 크기의 비정질합금 제조가 보고되면서 전 세계적으로 많은 관심을 받게 되었다. Zr-Ti-Ni-Cu-Be계 벌크 비정질 합금이 보고된 후 Zr-(Nb,Pd)-Al-TM, Pd-Cu-Ni-P, Fe-Co-Zr-Mo-W-B, Ti-Zr-Ni-Cu-Sn등 여러 합금계에서 벌크 비정질 합금이 보고되었다. (중략)

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• ETRI Journal
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• v.33 no.4
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• pp.637-640
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• 2011

A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 ${\mu}m$ in one direction.

• Journal of Mechanical Science and Technology
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• v.20 no.4
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• pp.513-521
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• 2006

The performances of porous bearings under different operating conditions were experimentally investigated in this study. Material groups studied are 90%Cu + 10%Sn bronze and 1%C + % balance Fe iron-based self-lubricating P/M bearings at constant (85%) density. In the experiments, the variation of the coefficient of friction and wear ratio of those two different group materials for different sliding speeds, loads, and temperatures were investigated. As a result, the variation of the friction coefficient-temperature for both constant load, and constant sliding speed, friction coefficient-average bearing pressure, PV-wear loss and temperature-wear loss curves were plotted and compared with each other for two materials, separately. The test results showed that Cu-based bearings have better friction and wear properties than Fe-based bearings.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.936-936
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• 2006

Bulk amorphous materials have been intensively studied to apply for various advanced industry fields due to their high mechanical, chemical and electrical properties. These materials have been produced by several techniques such as mechanical alloying, melt spinning and gas atomization, etc. Among them, the atomization is the most potential technique for commercialization due to high cooling rate during solidification of the melt and mass productivity. However, the amorphous powders still have some limitations because of their low ductility and toughness. Therefore, intensive efforts have to be carried out to increase the ductility and toughness. In this study, the Ni-based amorphous powder was produced by the gas atomization process. And in order to increase the ductile toughness, ductile Cu phase was coated on the Ni amorphous powder by spray drying process. The characteristics of the as-synthesis powders have been examined and briefly mentioned. The master alloy with $Ni_{57}Zr_{20}Ti_{16}Si_2Sn_3$ was prepared by vacuum induction melting furnace with graphite crucible and mold. The atomization was conducted at $1450^{\circ}C$ under the vacuum of $10^{-2}$ torr. The gas pressure during atomization was varied from 35 to 50 bars. After making the Ni amorphous powders, the spray drying was processed to produce the Cu -coated Ni amorphous composite powder. The amorphous powder and Cu nitrate solution were mixed together with a small amount of binder and then it was sprayed at temperature of $130^{\circ}C$ and rotating speed of 15,000 R.P.M.