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A Basic Study on the Fabrication of W-M(M=Cu, Sn, Ni) System High Density Composite (I)

W-M(M=Cu, Sn, Ni)계 고밀도 복합재료 제조에 관한 기초연구(I)

  • Jang, Tak-Soon (Div. of Mechanical Engineering, Chungnam National University) ;
  • Hong, Jun-Hee (Div. of Mechanical Engineering, Chungnam National University) ;
  • Lee, Tae-Haeng (Div. of Advanced Materials Engineering, Kongju National University) ;
  • Koo, Jar-Myung (Div. of Advanced Materials Engineering, Kongju National University) ;
  • Song, Chang-Bin (Div. of Advanced Materials Engineering, Kongju National University)
  • Published : 2009.08.28

Abstract

For the purpose of obtaining basic information on the development of lead-free materials, a high density composites (a) W-Cu, (b) W-Sn (c)W-Cu-Sn and (d) W-Cu-Ni were fabricated by the P/M method. The particle size of used metal powders were under 325 mesh, inner size of compaction mould was $\phi8$ mm, and compaction pressure was 400 MPa. A High density composite samples were sintered at a temperature between $140^{\circ}C$ and $1050^{\circ}C$ for 1 hour under Ar atmosphere. The microstructure, phase transformation and physical properties of the sintered samples were investigated. As the results, the highest relative density of 95.86% (10.87 g/$cm^3$) was obtained particularly in the sintered W-Cu-Sn ternary system sample sintered at 450 for 1hr. And, Rockwell hardness (HRB) of 70.0 was obtained in this system.

Keywords

References

  1. Vernon E. Ryan: U. S. Patent No. 4738,047 (1988)
  2. John E. Brown: U. S. Patent No. 4,949,644 (1990)
  3. Jhon Huffman: U. S. Patent No. 5,189,252 (1993)
  4. Germain Belanger and St. Germain-de-Grantham: U.S. Patent No. 5,237,930 (1993)
  5. Olin Corporation: U. S. Patent No. 5,399,187 (1995)
  6. Idea stumarket Elpi: Korea Patent No. 10-2000-0022324 (2000)
  7. SCM metal products incooperated R. J.: Korea Patent No. 10-1998-0701874 (1998)
  8. Remington arms company: Korea Patent No. 10-2000-0070539 (2000)
  9. F. Hoffman: Korea Patent No. 10-1998-701776 (1998)
  10. Pungsan (Co., Ltd.): Korea Patent No. 10-0257463
  11. ADD: Korea Patent No. 10-0363395
  12. KAIST: Korea Patent No. 10-0375944
  13. T. H. Kim, J. H. Yu and J. S. Lee: Nano Struct. Mater., 9 (1997) 213 https://doi.org/10.1016/S0965-9773(97)00056-1
  14. D. K. Kim, S. H. Lee, H. S. Song and K. J. Park: Journal of the Korean Institute of Metals and Materials, 35 (1997) 45
  15. K. G. Lee, K. H. Lee, B. G. Lee and D. H. Lee: Journal of the Korean Institute of Metals and Materials, 36 (1998) 104
  16. Dorfman et al.: U.S. patent No. 5,956,560 (1999)
  17. D. G. Kim, E. P. Kim and Y. D. Kim: Korean Journal of Materials Research, 12 (2002) 16 https://doi.org/10.3740/MRSK.2002.12.1.016
  18. D. G. Kim, K. W. Lee, M. J. Seok and Y. D. Kim: Korean Journal of Materials Research, 13 (2003) 169
  19. H. B. Park, D. J. Cho and C. B. Song: MRSK 8th Conference Proceedings, 5 (2005) 96
  20. H. B. Park, J. M. Goo and C. B. Song: MRSK 9th Conference Proceedings, 11 (2005) 159
  21. M. S. Shim, D. S. Kim, Y. H. Oh and C. B. Song: MRSK 11th Conference Proceedings, 11 (2006) 123
  22. C. B. Song and H. B. Park: Korea Patent No. 10-2007-0030336 (2007)
  23. C. B. Song and J. M. Goo: Korea Patent No. 10-2007-0063697 (2007)
  24. C. B. Song, Y. H. Oh and J. M. Goo: Korea Patent No. 10-2007-0075411 (2007)
  25. Y. H. Oh, S. H. Kim and C. B. Song: MRSK Twelfth Conference Proceedings, 5 (2007) 55
  26. Y. H. Oh, T. S. Jang, J. H. Hong and C. B. Song: MRSK 13th Conference Proceedings, 11 (2007) 164
  27. Massalski, T. B.: Binary Alloy Phase Diagram, Sn-Walloy System, ASM, Metals Park, Ohio, 3 (1986) 3411
  28. JCPDS-ICDD 2000(PDF #090205): Ref. Long, Frazer, Ott, J. Am. Chem. Soc., 56 (1934) 1101 https://doi.org/10.1021/ja01320a028
  29. Massalski, T. B.: Binary Alloy Phase Diagram, Cu-Ni alloy System, ASM, Metals Park, Ohio, 3 (1986) 1444
  30. Massalski, T. B.: Binary Alloy Phase Diagram, Ni-W alloy System, ASM, Metals Park, Ohio, 3 (1986) 2883