• Korean Journal of Materials Research
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• v.17 no.8
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• pp.402-407
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• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2020.06a
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• pp.8-9
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• 2020

In this study, the electrical conductivity and shielding effect were evaluated according to the type of metal and the thickness of Metal sprayed coating. The metals used for the test are Cu, Cu-Ni and Cu-Zn, and the thicknesses were 100, 200, 500 um. Each metal sprayed coating was evaluated for electrical conductivity and electromagnetic shielding effect. When the thickness was 200 ㎛ or more, shielding effect 80 dB or more was satisfied at 1 GHz. However, in the case of Cu-Ni, there is little electrical conductivity at a thickness of 100 um or less due to the generated voids, and electromagnetic wave shielding performance cannot be expected. Therefore, To ensure electromagnetic shielding effect of structures, it is considered that the minimum thickness of metal spraying coating should be 200 um.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.13-19
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• 2000

Shear strengths of BGA solder joints on Cu pads were studied for Cu-containing Sn (0, 1.5, and 2.5 wt.% Cu) and Sn-40Pb (0 and 0.5wt.% Cu) solders, with emphasis on the roles of the Cu-Sn intermetallic layer thickness and the roughness of the interface between the intermetalic layer and solder. The shear strength test was performed for as-soldered solder joints with various soldering reaction times up to 4 min. The addition of Cu to the pure Sn solder results in an enhanced growth of the intermetallic layer whereas the effect of Cu addition to the Sn-40Pb solder is primarily on the reduction of the roughness of the intermetallic/solder interface. The critical thickness of the intermetallic layer for a maximum shear strength depends on the solder materials, which was measured to be ~ 2.3 $\mu\textrm{m}$ for Sn-Cu solders and ~ 1.2 $\mu\textrm{m}$ for Sn-Pb-Cu solders. The shear strength at the critical intermetallic layer thickness seems to increase as the intermetallic/solder interface becomes rougher. This is in accordance with the observation that the sheared fracture occurred initially within the solder tends to shift towards the intermetallic/solder interface as the intermetallic layer grows above the critical thickness.

• Progress in Superconductivity and Cryogenics
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• v.18 no.4
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• pp.1-4
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• 2016

We investigated the relation between the Cu-O bond length and the superconducting properties of $BaSnO_3$ (BSO)-added $GdBa_2Cu_3O_{7-x}$ (GdBCO) thin films by using extended x-ray absorption fine structure (EXAFS) spectroscopy. 4 wt.% $BaSnO_3$ (BSO) added $GdBa_2Cu_3O_{7-x}$ (GdBCO) thin films with varying thickness from $0.2{\mu}m$ to $1.0{\mu}m$ were fabricated by using pulsed laser deposition (PLD) method. The transition temperature ($T_c$) and the residual resistance ratio (RRR) of the GdBCO films increased with increasing thickness up to $0.8{\mu}m$, where the crystalline BSO has the highest peak intensity, and then decreased. This uncommon behaviors of $T_c$ and RRR are likely to be created by the addition of BSO, which may change the ordering of GdBCO atomic bonds. Analysis from the Cu K-edge EXAFS spectroscopy showed an interesting thickness dependence of ordering behavior of BSO-added GdBCO films. It is noticeable that the ordering of Cu-O bond and the transition temperature are found to show opposite behaviors in the thickness dependence. Based on these results, the growth of BSO seemingly have evident effect on the alteration of the local structure of GdBCO film.

• Journal of the Korean Magnetics Society
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• v.16 no.3
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• pp.173-177
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• 2006

We have investigated the magnetoresistance (MR) effect of the spin valve structures composed of perpendicularly magnetized Pd/Co multilayers, with changing the space layer (Pd or Cu) thickness, the stacking number of the Pd/Co multilayers, and the Co insertion-layer thickness. The Cu space layer showed larger MR ratio than the Pd space layer. The Co insertion-layer between Cu layer and pinned layer enhanced the MR ratio about three times. The maximum MR ratio of 7.4 % was established in the sample with the Co insertion-layer thickness of 0.62 and 1.01 nm.

• Journal of Magnetics
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• v.4 no.1
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• pp.17-21
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• 1999

The GMR ($d_Cu$) oscillatory behaviour as well as the widths of first and the second antiferromagnetically coupled ranges of the Permalloy ($Py=Ni_{83}Fe_{17}$)/Cu multilayers have been found to be strongly affected not only by the presence of the superparamagnetic/paramagnetic entitles located at the Py/Cu interfaces but mainly by the existence of the magnetic bridges between Py layers. The effectiveness of the magnetic bridges has been found to be temperature dependent, leading to the temperature dependence of the remnant to saturation magnetization ratio ($M_R/M_S$). We have found that for Py/Cu multilayers with equal Py and Cu layer thicknesses a high field sensitivity of the GMR effect (0.4%/Oe) and negligible hysteresis can be achieved when the number of Py layers decreases from 100 to 6. Sensitivity can be further improved by increasing the Py layers thickness, but the hysterstic effect becomes more pronounced then.

• Transactions on Electrical and Electronic Materials
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• v.16 no.3
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• pp.112-116
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• 2015

This work studied the thickness and contact angle of solder joints between SAC 305 lead-free solder alloy and a Copper (Cu) substrate. Intermetallic compound (IMC) thickness and contact angle of 3Sn-Ag-0.5Cu (SAC 305) leadfree solder were measured using varying aging times, at a fixed temperature at 30℃. The thickness of IMC and contact angle depend on the aging time. IMC thickness increases as the aging increases. The contact angle gradually decreased from 39.49° to 27.59° as aging time increased from zero to 24 hours for big solder sample. Meanwhile, for small solder sample, the contact angle increased from 32.00° to 40.53° from zero to 24 hours. The IMC thickness sharply increased from 0.007 mm to 0.011 mm from zero to 24 hours aging time for big solder. In spite of that, for small solder the IMC thickness gradually increased from 0.009 mm to 0.017 mm. XRD analysis was used to confirm the intermetallic formation inside the sample. Cu₆Sn₅, Cu₃Sn, Ni₃Sn and Ni₃Sn₂ IMC layers were formed between the solder and the copper substrate. As the aging time increased, the strength of the solder joint mproved due to reduced contact angle.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.61-66
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• 2010

Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

• Transactions on Electrical and Electronic Materials
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• v.8 no.4
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• pp.174-177
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• 2007

We fabricated organic field-effect transistors (OFETs) based a fluorinated copper phthalocyanine ($F_{16}CuPC$) and copper phthalocyanine (CuPc) as an active layer. And we observed the surface morphology of the $F_{16}CuPC$ thin film. The $F_{16}CuPC$ thin film thickness was 40 nm, and the channel length was $50{\mu}m$, channel width was 3 mm. And we also fabricated the $F_{16}CuPc/CuPc$ double layer FET and with different $F_{16}CuPc$ film thickness devices. We observed the typical current-voltage (I-V) characteristics and capacitance-voltage (C-V) in $F_{16}CuPc$ FET and we calculated the effective mobility. From the double layer FET devices, we observed the higher drain current more than single layer FET devices.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.73-73
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• 2000

Shear strength of BGA solder joints on Cu pad was studied for Cu-contained Sn n.5 a and 2.5wt.% Cu) and Sn-Pb (o.5wt.% Cu) solders, with emphasis on the roles of the C Cu-Sn intermetallic layer thickness and the roughness of the interface between the i intermetallic layer and solder. The shear strength test was performed both for a as-soldered s이der joints with soldering reaction times of 1, 2, 4 min and for aged s이der j joints at 170 C up to 16 days. The Cu addition to both pure Sn and eutectic Sn-Pb s solders increased the intermetallic layer thickness at both soldering and aging t temperatures. The Cu addition also resulted in changes in the roughness of the interface b between the intermetallic layer and solder at as-soldered states. With increasing Cu c content. the interface roughened for Sn-Cu solders whereas it flattened for Sn-Pb-Cu s solders. The shear fractures in all solder joints investigated were confined in the bulk s solder rather than through the intermetallic layer. Therefore, the effect of Cu content in s solders on the shear strength of the solder joints was primarily attributed to its i influence on the micros$\sigma$ucture of bulk solder, such as the size and spatial distributions of CU6Sn5 precipitates. In addition, the critical intermetallic layer thickness for a m maximum shear strength seemed to depend on the Cu content in bulk solder.older.