Browse > Article
http://dx.doi.org/10.4313/TEEM.2015.16.3.112

Effect of Different Aging Times on Sn-Ag-Cu Solder Alloy  

Ervina Efzan, M.N. (Faculty of Engineering and Technology, Multimedia University)
Siti Norfarhani, I. (Faculty of Engineering and Technology, Multimedia University)
Publication Information
Transactions on Electrical and Electronic Materials / v.16, no.3, 2015 , pp. 112-116 More about this Journal
Abstract
This work studied the thickness and contact angle of solder joints between SAC 305 lead-free solder alloy and a Copper (Cu) substrate. Intermetallic compound (IMC) thickness and contact angle of 3Sn-Ag-0.5Cu (SAC 305) leadfree solder were measured using varying aging times, at a fixed temperature at 30℃. The thickness of IMC and contact angle depend on the aging time. IMC thickness increases as the aging increases. The contact angle gradually decreased from 39.49° to 27.59° as aging time increased from zero to 24 hours for big solder sample. Meanwhile, for small solder sample, the contact angle increased from 32.00° to 40.53° from zero to 24 hours. The IMC thickness sharply increased from 0.007 mm to 0.011 mm from zero to 24 hours aging time for big solder. In spite of that, for small solder the IMC thickness gradually increased from 0.009 mm to 0.017 mm. XRD analysis was used to confirm the intermetallic formation inside the sample. Cu6Sn5, Cu3Sn, Ni3Sn and Ni3Sn2 IMC layers were formed between the solder and the copper substrate. As the aging time increased, the strength of the solder joint mproved due to reduced contact angle.
Keywords
Solder; IMC; Contact angle; XRD;
Citations & Related Records
연도 인용수 순위
  • Reference
1 P. E. Tegehall, “ Review of the Impact of Intermetallic Layers on the Brittleness of Tin Lead and Lead-Free Solder Joints,” IVF Industrial Research and Development Corporation, March 2006.
2 Y. M. Jen, et al., “Fracture mechanics study on the intermetallic compound cracks for the solder joints of electronic packages”, 2011.
3 R. N. Raoelison, et al., “Magnetic pulse welding: Interface of Al/Cu joint and Investigation of intermetallic formation effect on the weld features,” Laboratory Roberval, 2014.
4 N. Mookam and K. Kanlayasiri, Institute of Technology, Ladkrabang, Bangkok, 2011.
5 Y. Y. Uan and T. R. Lee, Contact Angle and Wetting Properties(Houston, USA, 2013) http://dx.doi.org/10.1007/978-3-642-34243-1_1   DOI
6 M. Berthou, et al., “Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage,” (Talence, France, 2013).
7 J. Fan, et al., Bremer Institut für angewandte Strahltechnik Gmbh (Bremen, Germany, 2011).
8 N. Eustathopoulos et al., “Wettability at High Temperatures,” Pergamon Materials Series (Elsevier, The Boulevard, UK, 1999).
9 K. Brindley,” Chapter 12-Soldering”, in Starting Electronics, 4th Ed., (2011) p. 205-206.
10 eHow Contributor. (2013, March 19) Facts about Soldering [Online]. Available http://www.ehow.com/facts_5808842_soldering.html
11 J. Sylvester, “ Eutectic Solder Die Attach for High-Powered Devices”, Palomar Technologies, 2011.
12 N.A, (2008), Definition of Intermetallic [online]. Available FTP : http://www.techdictionary.org/
13 A. Grusd, “Lead-Free Solders in Electronics”, Heraeus Inc,West Conshohocken.
14 M. Mouas, et al “ Staticstructure and dynamic properties in liquid Sn96.2, Ag3.8 lead free solder: Structure factor, diffusion coefficients and viscosity”, Elsevier, 2003.
15 J.O.G.Parent, et al, “ Effects of Intermetallic formation at the interface between Copper and Lead-tin Solder”, Department of Metallurgical Engineering and Materials Science (Carnegie Mellon University, Pittsburgh, USA) p. 2564.
16 T. C. Chiu, et al, “Effect of Thermal Aging on Board Level Drop Reliability for Pb-free BGA Packages,” Proc.of the 54th Electronic Components and Technology Conf., 2004.
17 S. Montgomery, “Definition of Soldering”.
18 C. M. Carabello. (NA). Lead-Free Solder New Methodolgy and Perception [online]. Available http://www.matrixelectronics.com/pdfs/solutions/HASL_Info.pdf