• 한국재료학회지
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• 제8권9호
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• pp.837-842
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• 1998

ULSI급 소자의 집적도가 높아짐에 따라 공정의 신뢰도 및 수율 향상을 위한 세정 방법에 대한 관심이 더욱 높아지고 있다. 그중 가장 관심을 집중시키는 분야는 구리나 철과 같은 금속불순물의 제거에 관한 것이다. 본 연구에서는 금속 불순물 중 실제 공정에서 잘 오염되는 것으로 알려진 구리와 철 불순물을 인위적으로 오염시킨 후 $\textrm{H}_2\textrm{O}_2$와 HF의 혼합용액과 UV/$\textrm{O}_3$과 HF처리의 조합을 이용한 세정 방법을 이용하여 금속불순물을 제거하였다. 세정후 제정효과는 TXRF를 이용하여 측정하였고 Si 기판의 표면 거칠기를 AFM을 이용하여 측정하였다. 또한 금속 불순물의 흡착형태와 흡착기구 등을 SEM을 이용해 관찰하였고 AES를 이용하여 화학적 성분 분석을 실시하였다. 실험 결과 인위적 오염 후 구리의 오염도는 $\textrm{10}^{14}$ atoms/$\textrm{cm}^2$이었으며 각각의 세정을 통하여 $\textrm{10}^{10}$ atoms/$\textrm{cm}^2$으로 감소되었으며 반복된 세정으로 더욱 우수한 세정효과와 표면 거칠기의 개선 효과를 얻을 수 있었다. 구리는 박막의 형태가 아닌 구형의 입자 형태로 화학적 흡착에 의해 오염되는 것으로 관찰되었다. 철의 경우는 오염도가 $\textrm{10}^{13}$ atoms/$\textrm{cm}^2$ 이며 세정효과는 구리의 경우와 유사한 결과를 보여주었다. 철 불순물은 물리적 흡착에 의해 Si 표면에 오염되는 것으로 보이며 역시 구형의 입자형태로 표면에 흡착하는 것으로 관찰되었다.

• 한국표면공학회지
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• 제52권4호
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• pp.227-232
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• 2019

Mo-N based coatings have been studied for enhancing mechanical characteristics of thin films. In the case of Mo-X-N coatings, the microstructure and mechanical properties can be affected by the addition of the third element. In this work, Mo-Cu-N coatings were successfully fabricated with varying the Cu content from 4.5 at% to 31 at% by the co-sputtering method. Thus, properties of the coatings were analyzed by EDS, SEM, XRD, AFM, nano indentation and scratch test techniques. From observed results, MoxN bonds were made in a nitrogen atmosphere and Cu elements were present at grain boundaries. In addition, coatings with the Cu content above 14 at% had a Cu3N peak in the XRD results. Thus, it is suggested that the formation of Cu3N phase affected the microstructure and mechanical properties of Mo-Cu-N coatings. Mechanical properties of Mo-Cu-N coatings were found to be relatively better at Cu content of about 12 at%.

• Journal of Electrochemical Science and Technology
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• 제7권3호
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• pp.190-198
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• 2016

Application of fuel cell to produce renewable energy for commercial purpose is limited by the high cost of Pt based electrode materials. Development of inexpensive, high energetic electrode is the need of the hour to produce pollution free energy using bio-fuel through a fuel cell. Ni-Cu and Ni-CeO₂-Cu electrode materials, electro synthesized by pulse current have been developed. The surface morphology of the electrode materials is controlled by different deposition parameters in order to produce a high current from the electro-oxidation of the fuel, the ethanol. The developed materials are electrochemically characterized by Cyclic Voltammetry (CV), Chronoamperometry (CA) and Potentiodynamic polarization tests. The results confirm that the high current is due to their enhanced catalytic properties viz. high exchange current density (i₀), low polarization resistance (R_p) and low impedance. It is worthwhile to mention here that the addition of CeO₂ to Ni-Cu has outperformed Pt as far as the high electro catalytic properties are concerned; the exchange current density is about eight times higher than the same on Pt surface. The morphology of the electrode surface examined by SEM and FESEM exhibits that the grains are narrow and sub spherical with 3D surface, containing vacancies in between the elongated grains. The fact has enhanced more surface area for electro oxidation of the fuel, giving rise to an increase in current. Presence of Ni, CeO₂, and Cu is confirmed by the XRD and EDXS. Fuel cell fabricated with Ni-CeO₂-Cu material electrode is expected to produce clean electrical energy at cheaper rates than conventional one, using bio fuel the derived from biomass.

• Corrosion Science and Technology
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• 제6권4호
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• pp.198-205
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• 2007

The initial stages of electrochemical oxidative CuI film formation on Cu(111), as studied by means of Cyclic Voltammetry (CV), in-situ Scanning Tunneling Microscopy (STM) and ex-situ Synchrotron X-ray Photoemission Spectroscopy (SXPS), indicate a significant acceleration of copper oxidation in the presence of iodide anions in the electrolyte. A surface confined supersaturation with mobile CuI monomers first leads to the formation of a 2D-CuI film via nucleation and growth of a Cu/I-bilayer on-top of a pre-adsorbed iodide monolayer. Structurally, this 2D-CuI film is closely related to the (111) plane of crystalline CuI (zinc blende type). Interestingly, this film causes no significant passivation of the copper surface. In an advanced stage of copper dissolution a transition from the 2D- to a 3D-CuI growth mode can be observed.

• 한국재료학회지
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• 제19권11호
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.2067_2068
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, $Cu_6Sn_5({\mu})$ and $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface. $Cu_6Sn_5({\mu})$ intermetallics layer gradually changed $Cu_3Sn({\varepsilon})$. Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• 전기학회논문지
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• 제58권8호
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• pp.1559-1565
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(${\mu}$) and Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(${\mu}$) intermetallics layer gradually changed Cu3Sn(${\varepsilon}$). Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• 한국표면공학회지
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• 제56권1호
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• pp.40-54
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• 2023

In this work, we synthesized a novel electrochemical sensing materials based on tetracarboxylic copper phthalocyanine (TcCuPtc) conjugated PANI (TcCuPtc@PANI). The synthesized materials were employed to modify the screen-printed carbon electrode (SPCE) for the selective sensing of 4-nitrophenol. The TcCuPtc was conjugated with conducting polymer of PANI through the electrostatic interaction and π-π electron conjugation, the polymer film of PANI to inhibit the leakage of TcCuPtc from the surface of the electrode. The prepared TcCuPtc@PANI were characterized and confirmed by scanning electron microscopy (SEM) with EDX, ATR-IR, UV-vis absorption spectroscopy, cyclic voltammetry, and differential pulse voltammetry techniques. The prepared TcCuPtc@PANI/SPCE showed an excellent electrocatalytic sensing of 4-NP in the linear concentrations from 3 to 500 nM with a LOD of 0.03 nM and a sensitivity of 8.8294 ㎂/nM cm^-2. However, the prepared TcCuPtc@PANI/SPCE showed selective sensing of 4-NP in the presence of other interfering species. The practical applicability of the TcCuPtc@PANI/SPCE was employed for the sensing of 4-NP in different water samples by standard addition method and showed satisfactory recovery results.

• 한국전기전자재료학회논문지
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• 제37권5호
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• pp.547-553
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• 2024

Precise control over the morphology of nanostructures is critical for tailoring their physical and chemical properties. This study addresses the challenge of developing a simple, integrated method for synthesizing both 1D and 2D colloidal Cu nanostructures in a single system, achieving successful tuning of their localized surface plasmon resonance (LSPR) properties. A facile hydrothermal synthesis utilizing potassium iodide (KI) and hexadecylamine (HDA) is presented for controlling Cu nanostructure morphologies. The key to achieving 1D nanowires (NWs) and 2D nanoplates (NPs) depends on the controlled adsorption of HDA molecules and iodide (I-) ions on specific crystal facets. Depending on the morphologies, the resultant Cu nanostructures exhibit tunable LSPR peaks from 558 nm [nanoplates (NPs)] to 590 nm [nanowires (NWs)]. These results pave the way for the scalable and cost-effective production of plasmonic Cu nanostructures with tunable optical properties, holding promise for applications in sensing, catalysis, and photonic devices.

• 한국진공학회지
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• 제9권2호
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• pp.144-149
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• 2000

Cu(4.5at.% Mg) target을 이용하여 sputtering에 의해 증착된 Cu(Mg) alloy박막의 열처리시 형성되는 산화 방지막 MgO의 박막 특성에 영향을 주는 인자에 대해 살펴보았다. MgO 박막의 산화방지 능력 및 막질에 영향을 주는 인자로는 열처리 온도, $O_2$ 압력, Mg 농도 등으로 나타났다. MgO 박막의 두께는 열처리 온도가 증가함에 따라 증가하다 $500^{\circ}C$ 이상에서는 150 $\AA$ 정도의 성장한계두께를 나타내었다. 표면에 형성되는 MgO 박막은 $O_2$압력이 낮을수록, Mg의 농도가 높을수록 치밀한 MgO가 형성되어 산화방지에 우수한 특성을 보였으며 전 열처리 과정인 진공 열처리 공정은 1at.%정도의 낮은 Mg 농도에서도 치밀한 MgO형성에 매우 효과적임이 확인되었다. 본 연구에서 Cu(Mg) alloy박막의 열처리를 통해 낮은 저항의 Cu박막의 형성과 동시에 산화방지에 우수한 특성을 보이는 MgO 박막을 열처리 온도, $O_2$ 압력, Mg 농도 등의 최적조건을 이용하여 얻어질 수 있음을 확인하였다.