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Degradation Behavior and Resistivity Changes After Thermal Aging of Matte Tin-Plated Copper Sheet for Current Collector in Fuel Cell  

Kim, Ju-Han (충남대 전기공학과)
Kim, Jae-Hun (충남대 전기공학과)
Koo, Kyung-Wan (호서대 국방과학기술학과)
Keum, Young-Bum (현대-기아자동차 환경기술연구소 연료전지개발1팀)
Jeong, Kwi-Seong (현대-기아자동차 환경기술연구소 연료전지개발1팀)
Ko, Haeng-Jin (현대-기아자동차 환경기술연구소 연료전지개발1팀)
Han, Sang-Ok (충남대 전기공학과)
Publication Information
The Transactions of The Korean Institute of Electrical Engineers / v.58, no.8, 2009 , pp. 1559-1565 More about this Journal
Abstract
Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(${\mu}$) and Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(${\mu}$) intermetallics layer gradually changed Cu3Sn(${\varepsilon}$). Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.
Keywords
Current Collector; Tin-plate; Thermal Aging; Intermetallic; Resistivity;
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Times Cited By KSCI : 3  (Citation Analysis)
Times Cited By SCOPUS : 0
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1 C. G. Mackamey, J. A. Horton and C. T. Liu, 'Effect of chromium on properties of Fe_{3}Al', Journal of Materials Research, Vol. 4, Isu. 5, pp. 1156-1163, 1989. 9   DOI   ScienceOn
2 N. S. Stoloff, 'Physical and mechanical metallurgy of Ni3Al and its alloys', International Materials Reviews, Vol. 34, Isu. 4, pp, 153-183, 1989   DOI
3 M. Abtew and G. Selvaduray, 'Lead-free solder in microelectronics', Materials Science and Engineering, Vol. 27, No.5, pp. 95-141, 2000. 6   DOI   ScienceOn
4 강전홍, 한상옥, 'Van der Pauw 측정법을 이용한 금속 도전율의 직류와 교류특성', 대한전기학회, Vol. 56P No.4, pp. 157-160, 2007   과학기술학회마을
5 김재훈, 김주한, 한상옥, 구경완, 금영범, 정귀성, 고행진, '연료전지 집전판용 주석도금 동판의 열열화에 따른 금속간화합물 성장 및 비저항 변화', 대한전기학회 하계학술대회, pp.2067-2068, 2009
6 G. H. Fair and J. V. Wood, 'Mechanical Alloying of Iron-Aluminium Intermetallics', Powder Metallurgy, Vol. 36, No.2, pp. 123-128, 1993   DOI
7 S. Bader, W. Gust and H. Hieber, 'Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems', Acta Metallurgica et Materialia, Vol. 43, Isu. 1, pp. 329-337, 1995. 1   DOI   ScienceOn
8 P. G Harris, I. M. Notter and J. Mcintosh, Proc. 5th Int'l Tinpalte Conf., Paper No. 6, 1992. 8
9 J. Glazer, 'Metallurgy of Low Temperature Pb-fee Solders for Electronic Assembly', Vol. 40, No.2 (1995) 71
10 M. McComark and S. Jin : Metall. and Mater, Trans., 25A (1994), pp. 1514
11 M. Yamaguchi and Y. Umakoshi, 'The deformation behaviour of intermetallic superlattice compounds', Progress in Materials Science, Vol. 34, Isu. 1, pp. 1-148, 1990   DOI   ScienceOn
12 김종연, 유진, '전해도금 Cu와 Sn-3.5Ag 솔더 접합부의 Kirkendall void 형성과 충격 신뢰성에 관한 연구', 한국마이크로전자 및 패키징학회, v.15, no.1, pp. 33-37, 2008   과학기술학회마을
13 김용혁, 이성례, 'Sn/Cu 및 Sn/Ni 계면에서 금속간화합물의 형성 및 성장에 관한 연구(I) : 금속간화합물의 생성, 성장반응 및 속도론', 한국금속표면공학회, Vol. 22, No. 1, pp.3-9, 1989
14 K. Zeng, R. Stierman, T.-C. Chiu, D. Edwards, K. Ana, and K. N. Tu, 'Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability', Journal of applied physics. Vol. 97, pp. 024508.1-024508.8, 2005   DOI   ScienceOn
15 김홍석, 이성래, 'Sn/Cu 및 Sn/Ni 계면에서 금속간화합물 형성 및 성장에 관한 연구(II)', 금속표면처리학회, 제22권, 제2호, pp.47-54, 1989. 7