• Journal of Nutrition and Health
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• v.39 no.4
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• pp.381-391
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• 2006

This study is performed to compare the dietary intakes and food sources of copper (Cu) using the database of Cu content developed in this study between the elementary schoolchildren in remote rural areas (RA, n=58, $9.9{\pm}1.7$ yrs) and those in urban area (UA, n=60, $9.4{\pm}1.8$ yrs), and to analyze the relationship between serum Cu concentration and serum antioxidant status in the RA. The results obtained in this study were as followings: 1) Dietary intakes of calorie, calcium and iron in the RA were in the 3/5-4/5 of the Korean RDA while the UA were similar to or more than the Korean RDA, 7th ed. except iron. 2) More than 273 kinds of food consumed by the subjects were analyzed the content of Cu and database of Cu content were developed in the present study. The mean dietary intake of Cu per day in the RA was $0.99{\pm}0.07mg/d$ ($170.0{\pm}13.2%$ of the USA RDA) while it was $1.22{\pm}0.07mg/d$ ($203.4{\pm}13.1%$ of the RDA) in the UA. The percentage of dietary intakes of Cu less than 213 of the RDA was 8.6% in the RA in comparison to 0% in the UA. 3) The RA and the UA consumed more than 80% of total dietary intakes of Cu from plant foods. Thus, the RA and the UA consumed Cu from cooked rice, vegetables and fruits as a major source. However the RA had less Cu from meat and their products than did the UA (p<0.05) .4) Crab stew including crab and juice was the highest food source of Cu for the total subjects, followed by seasoned bud of aralia, cooked; beef rib meat, roasted; soybean paste soup w/mallow; and soybean paste soup w/mallow & beef. Major food source of Cu was similar for the RA and the UA such as cooked rice, vegetables and fruits. 5) Mean concentration of serum Cu in the RA was $18.1{\pm}0.7{\mu}M/L$ that was in the normal value, and all subjects in this group were in more than normal value. In the RA serum Cu concentration related positively with serum ceruloplasmin concentration, serum vitamin C concentration and EC SOD activity, respectively. However, serum Cu concentration did not relate with serum TBARS concentration in the RA. Above results showed that the RA had good status of Cu nutrition based upon dietary intake and serum concentration, however some of the RA had lower intake of Cu than the RDA. The overall children in the UA had good Cu nutrition. Therefore, the subgroup of the RA should be supported to improve their Cu nutrition, and this support could give them better antioxidant status based upon positive relationship between serum Cu concentration and serum antioxidant status in the RA.

• ETRI Journal
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• v.35 no.4
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• pp.625-631
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• 2013

For the formation of solder bumps with a fine pitch of 130 ${\mu}m$ on a printed circuit board substrate, low-volume solder on pad (LVSoP) technology using a maskless method is developed for SAC305 solder with a high melting temperature of $220^{\circ}C$. The solder bump maker (SBM) paste and its process are quantitatively optimized to obtain a uniform solder bump height, which is almost equal to the height of the solder resist. For an understanding of chemorheological phenomena of SBM paste, differential scanning calorimetry, viscosity measurement, and physical flowing of SBM paste are precisely characterized and observed during LVSoP processing. The average height of the solder bumps and their maximum and minimum values are 14.7 ${\mu}m$, 18.3 ${\mu}m$, and 12.0 ${\mu}m$, respectively. It is expected that maskless LVSoP technology can be effectively used for a fine-pitch interconnection of a Cu pillar in the semiconductor packaging field.

• Korean Journal of Materials Research
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• v.13 no.9
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• pp.555-560
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• 2003

Ag-coated Cu particles were prepared by dropping method of coating agent and were evaluated by scanning electron microscope and color difference meter. The shape of Cu particles having obvious crystal plan and edge was changed spherically according to the increase of Ag coating amount. When the Ag coating amount was 50 wt% to Cu particles, the whiteness of Ag-coated Cu particles was almost similar to that of pure Ag particles. Adding $NH_4$OH in reductant solution could increase effectively the whiteness of the Ag-coated particles. The Ag-coated particles having the highest whiteness was obtained when the content of hydrazine in reductant solution was 0.48 M.

• Korean Journal of Materials Research
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• v.13 no.8
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• pp.503-508
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• 2003

The purpose of this study is to investigate the effect of $V_2$$O_{5}$ addition on the Ag and Cu precipitation in the NiCuZn ferrite layers of 7.7${\times}$4.5${\times}$1.0 mm sized multi-layer chip inductors prepared by the screen printing method using 0∼0.5 wt% $V_2$$O_{5}$ -doped ferrite pastes. With increasing the $V_2$$O_{5}$ content and sintering temperature, Ag and Cu oxide coprecipitated more and more at the polished surface of ferrite layers during re-annealing at $840^{\circ}C$. It was thought that during the sintering process, V dissolved in the NiCuZn ferrite lattice and the Ag-Cu liquid phase of low melting point was formed in the ferrite layers due to the Cu segregation from the ferrite lattice and Ag diffusion from the internal electrode. During re-annealing at $840^{\circ}C$, the Ag-Cu liquid phase came out the polished surface of ferrite layers, and was decomposed into the isolated Ag particles and the Cu oxide phase during the cooling process.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.27.1-27.1
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• 2009

Chalcopyrite구조의CIS 화합물은 직접천이형 반도체로서 높은 광흡수 계수 ($1\times10^5\;cm^{-1}$)와 밴드갭 조절의 용이성 및 열적 안정성 등으로 인해 고효율 박막 태양전지용 광흡수층 재료로 많은 관심을 끌고 있다. CIS 계 물질에 속하는 $Cu(InGa)Se_2$ (CIGS) 태양전지의 경우 박막 태양전지 중 세계 최고 효율인 20%를 달성한 바 있으며, 이는 기존 다결정 웨이퍼형 실리콘 태양전지의 효율에 근접하는 수치이다. 그러나 이러한 우수한 효율에도 불구하고 박막 증착시 동시증발장치 혹은 스퍼터링장치와 같은 고가 진공장비를 사용하게 되면 공정단가가 높을 뿐만 아니라 사용되는 재료의 20-50%의 손실을 감수해야만 한다. 또한 대면적 Cell제작에 어려움이 있기 때문에 기술개발 이후의 상용화 단계를 고려할 때 광흡수층 박막 제조 공정단가를 획기적으로 낮출 수 있고 대면적화가 용이한 신 공정 개발이 필수적이다. 이러한 관점에서 비진공 코팅방법에 의한 CIS 광흡수층 제조 기술은 CIS 태양전지의 저가화 및 대면적화를 가능케 하는 차세대 기술로 인식되고 있고 최근 급속한 발전을 이루고 있는 미세 입자 합성, 제어 및 응용 기술에 부합하여 많은 세계 연구기관 및 기업체에서 활발히 연구를 진행하고 있다. 비진공 방식에 의한 CIS 광흡수층 제조 기술은 전구체 물질의 형태에 따라 크게 입자형 전구체를 사용하는 방법과 용액 전구체를 사용하는 방법으로 나눌 수 있다. 본 연구에서는 용액 전구체를 paste 공정으로 실험하였다. 이는 용액전구체 물질 제조가 입자형 전구체 제조에 비해 매우 간단하고, 전구체 물질 내 구성원소의 원자비를 쉽게 조절할 수 있다는 장점 및 사용효율이 높아 소량의 source로도 박막 제작이 가능해 공정 단가 절감에 큰 효과가 기대되기 때문이다. 실험에 사용 된 용액전구체는 $Cu(NO_3)$ 및 $InCl_3$, $Ga(NO_3)$를 Cu, In, Ga 출발 물질로 선정하여 이를 메탄올에 완전히 용해시켜 binder인 셀룰로오즈와 메탄올을 섞은 용액과 혼합하여 전구체 슬러리를 형성하였다. 이 슬러리를 paste공정으로 precursor막을 입히고 저온 건조 후 Se 분위기에서 열처리하여 CIGS박막을 얻을 수 있었다. 박막의 특성을 XRD, SEM, AES, TGA등으로 분석하였다.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.35-41
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• 2022

In the era of Fifth-Generation (5G), technology requirements such as Artificial Intelligence (AI), Cloud computing, automatic vehicles, and smart manufacturing are increasing. For high efficiency of electronic devices, research on high-intensity circuits and packaging for miniaturized electronic components is important. A solder paste which consists of small solder powders is one of common solder for high density packaging, whereas an electroplated solder has limitation of uniformity of bump composition. Researches are underway to improve wettability through the addition of nanoparticles into a solder paste or the surface finish of a substrate, and to suppress the formation of IMC growth at the metal pad interface. This paper describes the principles of improving the wettability of solder paste and suppressing interfacial IMC growth by addition of nanoparticles.

• Korean Journal of Materials Research
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• v.27 no.4
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• pp.221-228
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• 2017

Various morphologies of copper oxide (CuO) have been considered to be of both fundamental and practical importance in the field of electronic materials. In this study, using Cu ($0.1{\mu}m$ and $7{\mu}m$) particles, flake-type CuO particles were grown via a wet oxidation method for 5min and 60min at $75^{\circ}C$. Using the prepared CuO, AlN, and silicone base as reagents, thermal interface material (TIM) compounds were synthesized using a high speed paste mixer. The properties of the thermal compounds prepared using the CuO particles were observed by thermal conductivity and breakdown voltage measurement. Most importantly, the volume of thermal compounds created using CuO particles grown from $0.1{\mu}m$ Cu particles increased by 192.5 % and 125 % depending on the growth time. The composition of CuO was confirmed by X-ray diffraction (XRD) analysis; cross sections of the grown CuO particles were observed using focused ion beam (FIB), field emission scanning electron microscopy (FE-SEM), and energy dispersive analysis by X-ray (EDAX). In addition, the thermal compound dispersion of the Cu and Al elements were observed by X-ray elemental mapping.

• Journal of the Korean Ceramic Society
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• v.31 no.4
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• pp.427-435
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• 1994

Cu-metallized low firing temperature substrates were synthesized by cofiring green sheet of cordierite-based glass with Cu. By Sol-Gel method, Cu powder was coated with borosilicate gel which should act as a glass frit in Cu paste during cofiring. Theoretical weight ratios of Glass/Cu were controlled to be 2.5, 5, 10 and 15% by varying alkoxide concentrations. Average particle size of coated Cu was 0.629~0.674 ${\mu}{\textrm}{m}$ in comparison to that of as-received Cu(0.596 ${\mu}{\textrm}{m}$), which increased with alkoxide concentration but did not increase above certain concentration. The weight ratios of coated layer were 2.11~5.37%. The properties of Cu-metallized low firing temperature substrate, cofired at 90$0^{\circ}C$ for 1h under H2/N2 atmosphere, were as follows; sheet resistance was 13~43 m{{{{ OMEGA }}/$\square$, adhesion strength was 1.0~2.1 kgf/$\textrm{mm}^2$. From the observations of SEM photographs, the gel coated on Cu performed excellently as a glass frit.

• Korean Journal of Materials Research
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• v.17 no.1
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• pp.50-55
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• 2007

Ultra-fine Copper powder for a conductive paste in electric-electronic field have been synthesized by chemical reduction of aqueous $CuSO_4$ with hydrazine hydrate $(N_2H_4{\cdot}H_2O)$ as a reductor. The effect of reaction conditions such as dispersant and reaction temperature on the particle size and shape for the prepared Cu powders was investigated by means of XRD, SEM, TEM and TGA. Experiments showed that type of dispersant and reaction temperature were affected on the particle size and morphology of the copper powder. When the carboxymethyl cellulose (CMC) was added as a dispersant the relative mono-dispersed and spherical Cu powder was obtained. Cu powders with particle size of approximately 140nm and narrow particle size distribution were obtained from 0.3M $CuSO_4$ with adding of 0.03M CMC and 40ml $N_2H_4{\cdot}H_2O$ at a reaction temperature of $70^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1989.06a
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• pp.59-61
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• 1989

The cell parameters of the sintered CdS/CdTe solar cells in which te CuCl$_2$was added in the carbon paste after the sintering of the CdS/CdTe composites an were annealed at 35$0^{\circ}C$ for 10 min in nitrogen are investigated. Voc and FF do not change significantly as the CuCl$_2$increasing up to 500 ppm, Jsc increases with futher increase in copper. The hole concentration, determined by C-V measurement, increases to $1.5\times$10$^{16}$ ㎤ as the copper increased to 25 ppm and then stays at about the same value with further increase in copper.