1 |
S. J. Corvet, S. Akimoto and H. Imaizumi, 電子材料, No. 5, 92 (1986)
|
2 |
T. Iida, 電子材料, No. 5, 45 (1996)
|
3 |
C. D. Sanguesa, R. H. urbina and M. Figlarz, J. Solid State Chem., 100, 272 (1992)
DOI
ScienceOn
|
4 |
J. Satou, A. Yokoyama, Y. Hayashi, 電子材料, No. 10, 45 (1994)
|
5 |
S. Nakata, 電子材料, No. 9, 22 (1996)
|
6 |
M. Hirota, Y. Kuriyama, M. Suzuki and T. Oshima, 粉碎, 37, 22 (1993)
|
7 |
K. Hirai, H. Wada, A.Sasaki, H. Kaga, J. Kikuchi, S. Yamana and H. Kuwajima, U. S. Patent 5,840,432 (1998)
|
8 |
C. I. Courdurvelis and G. Suteliffe, Plating, 67, 71 (1980)
|
9 |
F. W. Billmeyer and M. Saltzman, Principles of Color Technology, 2nd ed., pp. 103, A Willey-Interscience Publication, New York. Toronto (1981)
|
10 |
H. Nakamura, Y. Chen, K. Kimura, H. Takeyama and H, Hirosue, J. Ceramic Society of Japan, 105(11), 1037 (1997)
DOI
|