• Journal of the Korean Society for Precision Engineering
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• v.25 no.9
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• pp.109-115
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• 2008

The cleaning process of contaminant particles adhering to the microchips, integrated circuits (ICs) or the like is essential in modern microelectronics industry. In the cleaning process particularly working with the application of inert gases, the removal of contaminant particles of submicron scale is very difficult because the particles are prone to reside inside the boundary layer of the working fluid, The use of cryogenic $CO_2$ cleaning method is increasing rapidly as an alternative to solve this problem. In contrast to the merits of high efficiency of this process in the removal of minute particles compared to the others, even fundamental parametric studies for the optimal process design in this cleaning process are hardly done up to date, In this study, we attempted to measure the cleaning efficiency with the variations of some principal parameters such as mass flow rate, injection distance and angle, and tried to draw out optimal cleaning conditions by measuring and evaluating an effective cleaning width called $d_{50}$.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.6
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• pp.13-19
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.609-610
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.927-928
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• 2008

• Journal of the Semiconductor & Display Technology
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• v.9 no.1
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• pp.5-10
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• 2010

Among a variety of cleaning processes, the cryogenic carbon dioxide ($CO_2$) cleaning has merits because it is highly efficient in removing very fine particles, innoxious to humans and does not produce residuals after the cleaning, which enables us to extend its area of coverage in the semi-conductor fabrication society. However, the cryogenic carbon dioxide cleaning method has some technical research issues in aspect to particles' adhesion and removal. To resolve these issues, performing an analysis for the identification of particle adhesion mechanism is needed. In this study, a research was performed by a theoretical approach. To this end, we extended the G-T (Greenwood-Tripp) model by applying the JKR (Johnson-Kendall-Roberts) and Lennard-Jones potential theories and the statistical characteristics of rough surface to investigate and identify the contact, adhesion and deformation mechanisms of soft or hard particles on the rough substrate. The statistical characteristics of the rough surface were taken into account through the employment of the normal probability distribution function of the asperity peaks on the substrate surface. The effects of surface roughness on the pull-off force for these particles were examined and discussed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.197-198
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.635-636
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• 2006

• Journal of the Semiconductor & Display Technology
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• v.7 no.4
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• pp.29-33
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• 2008

Rapid increase of integrity for recent semiconductor industry highly demands the development of removal technology of contaminated particles in the scale of a few microns or even smaller. It is known that the surface cleaning technology using $CO_2$ snow has its own merits of high efficiency. However, the detailed removal mechanism of particles using this technology is not yet fully understood due to the lack of sophisticated research endeavors. The detachment mechanism of particles from the substrates is known to be belonged in four types; rebounding, sliding, rolling and lifting. In this study, a modeling effort is performed to explain the detachment mechanism of a contaminant particle due to the rebounding caused by the vertical collision of the $CO_2$ snow. The Hertz and Johnson-Kendall-Roberts(JKR) theories are employed to describe the contact, adhesion and deformation mechanisms of the particles on a substrate. Numerical simulations are followed for several representative cases, which provide the perspective views on the dynamic characteristics of the particles as functions of the material properties and the initial inter-particle collision velocity.

• Journal of the Korean Institute of Gas
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• v.23 no.6
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• pp.81-89
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• 2019

This study deals with a process for recovering hydrogen isotopes from fusion exhaust gas. The goal of this process is to remove impurities, maximally recover only pure hydrogen isotopes. Experiments using hydrogen and deuterium were conducted to confirm the possibility of the recovery of hydrogen isotopes. In the exhaust gas containing H₂, impurities was removed in the membrane process, and only pure H₂ was recovered. And the H₂ in the exhaust gas of the He-GDC(Glow Discharge Cleaning) process was recovered using a cryogenic adsorption process. In addition, HAZOP analysis was performed for qualitative risk assessment. For scenario analysis, the damage prediction ALOHA program was used to calculate the range of influence. Finally measures were sought to improve safety.

• Journal of the Korean Society of Combustion
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• v.17 no.3
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• pp.30-45
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• 2012

An existing unit of power plant is considered to refurbish it for possible application of carbon capture and storage(CCS). Conceptual design of the plant includes basic considerations on the national and international situation of energy use, environmental concerns, required budget, and time schedule as well as the engineering concept of the plant. While major equipment of the recently upgraded power plant is going to be reused, a new boiler for air-oxy fired dual mode operation is to be designed. Cryogenic air separation unit is considered for optimized capacity, and combustion system accommodates flue gas recirculation with multiple cleaning and humidity removal units. The flue gas is purified for carbon dioxide separation and treatment. This paper presents the background of the project, participants, and industrial background. Proposed concept of the plant operation is discussed for the possible considerations on the engineering designs.