Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)
- Volume 7 Issue 4
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- Pages.29-33
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- 2008
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- 1738-2270(pISSN)
A dynamic analysis on minute particles' detachment mechanism in a cryogenic $CO_2$ cleaning process
극저온 $CO_2$ 세정과정 시 미세오염물의 탈착 메커니즘 연구
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Seok, Jong-Won
(Sch. of Mech. Eng at Chung-Ang Univ.) ;
- Lee, Seong-Hoon (Grad. Sch. of Mech. Eng at Chung-Ang Univ.) ;
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Kim, Pil-Kee
(Grad. Sch. of Mech. Eng at Chung-Ang Univ.) ;
- Lee, Ju-Hong (Grad. Sch. of Mech. Eng at Chung-Ang Univ.)
- Published : 2008.12.30
Abstract
Rapid increase of integrity for recent semiconductor industry highly demands the development of removal technology of contaminated particles in the scale of a few microns or even smaller. It is known that the surface cleaning technology using
Keywords
- Cryogenic carbon dioxide cleaning;
- Sub-micron contaminant particles;
- Particle removal mechanism;
- Rebounding detachment mechanism;
- Adhesion energy