• Proceedings of the KIEE Conference
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• 2006.07a
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• pp.93-94
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• 2006

The sheath of a single-conductor cable for ac service acts as a secondary of a transformer, the current in the conductor induces a voltage in the sheath. When the sheaths of single-conductor cables are bonded to each other, as is common practice for multi-conductor cables, the induced voltage causes current to flow in the completed circuit. This current causes losses in the sheath. Various methods of bonding may be used for the purpose of minimizing sheath losses. In korea, sheath cross bonding system was employed for the prevention of sheath losses, the sheaths wire subjected to at voltages, and the bonding was designed to keep the magnitude of the induced voltages within small limits so as to prevent the possibility of sheath corrosion. But, sheath cross bonding system without transposition of cable can not achieve an exact balance of induced sheath voltages unless the cables are lain in trefoil. This paper describes a transposition system with sheath cross bonding using EMTP(Electromagnetic Transient Program). The transposition system with cross bonding can be extended to longer cable circuits for laid in flat as wall as trefoil by the methods described in this paper.

• Journal of the Korea Convergence Society
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• v.13 no.3
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• pp.203-216
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• 2022

In the recent business environment, purchase patterns are changing around the influence of COVID-19 and the online market. This study analyzed cluster and correlation analysis based on purchase and product information. The cluster analysis of new methods was attempted by creating customer, product, and cross-bonding clusters. The cross-bonding cluster analysis was performed based on the results of each cluster analysis. As a result of the correlation analysis, it was analyzed that more association rules were derived from a cross-bonding cluster, and the overlap rate was less. The cross-bonding cluster was found to be highly efficient. The cross-bonding cluster is the most suitable model for recommending products according to customer needs. The cross-bonding cluster model can save time and provide useful information to consumers. It is expected to bring positive effects such as increasing sales for the company.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.5
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• pp.629-635
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• 2014

This paper describes propagation characteristics obtained by considering semiconducting screen and cross-bonding in underground transmission cables. The semiconducting screen of power cable has effect on propagation characteristics including attenuation, velocity and surge impedance. However, it is very difficult to apply the semiconduction screen for EMTP model because of the number of conductors limitation. Therefore, CIGRE WG 21-05 proposed advanced insulation structure and analysis technique of simplified approach including inner and outer semiconducting screen. In this paper, the various propagation characteristics analyse using this structure and technique for 154kV XLPE $2000mm^2$ cable. The frequency independent model of EMTP CABLE PARAMETER is used for just pattern analysis of propagation characteristics. For exact data analysis, the frequency dependent model of J-marti is used for EMTP modeling. From these result, various propagation characteristics of 154kV XLPE $2000mm^2$ cable according to semi conducting screen consideration, frequency range, cable length and pulse width are analysed. In addition, in this paper, the effects of cross-bonding are also variously discussed according to cross-bonding methods, direct connection and impedance of lead cable.

• Korean Journal of Child Studies
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• v.31 no.1
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• pp.1-17
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• 2010

This study explored the differences in gender, developmental period and parents in terms of parenting, the cross-sectional and longitudinal relationships in parenting by gender, and the cross-sectional and longitudinal relationships between participant roles in bullying situations and parenting by gender. The subjects were 498 4-5th grade children and the instruments utilized in this study were the Parental Bonding Instrument (Bowers, Smith, & Binney, 1994) and the Participant Roles Scale (Sutton & Smith, 1999). The subjects were contacted again one year after the first contact. Results showed that the relationships between parents were longitudinally quite stable. Girls whose fathers had higher levels of accurate monitoring were more likely to be defenders cross-sectionally. Girls whose parents had more accurate monitoring were less likely to be victims longitudinally. The results underscore the importance of examining both gender and participant roles in bullying situations.

• Restorative Dentistry and Endodontics
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• v.37 no.1
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• pp.2-8
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• 2012

The limited durability of resin-dentin bonds severely compromises the longevity of composite resin restorations. Resin-dentin bond degradation might occur via degradation of water-rich and resin sparse collagen matrices by host-derived matrix metalloproteinases (MMPs). This review article provides overview of current knowledge of the role of MMPs in dentin matrix degradation and four experimental strategies for extending the longevity of resin-dentin bonds. They include: (1) the use of broadspectrum inhibitors of MMPs, (2) the use of cross-linking agents for silencing the activities of MMPs, (3) ethanol wet-bonding with hydrophobic resin, (4) biomimetic remineralization of water-filled collagen matrix. A combination of these strategies will be able to overcome the limitations in resin-dentin adhesion.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.48 no.1
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• pp.61-66
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• 2016

In order to improve the bonding efficiency of starch adhesives and water resistance of corrugated board, mixing ratio of additives dosage was changed and its effects were analyzed. When the additives dosage was increased, bonding strength, vertical compression strength, bursting strength and water resistance were increased, because of hydroxyl groups or acetyl groups in starch adhesives and cellulose fibers of corrugated board were cross-linked by additives. When 1.0% glyoxal dosage was added, flat crush strength and vertical compression strength were increased. With 1.5% glyoxal, bonding strength and bursting strength were increased. However, 2.0% glyoxal dosage was added, most of strength except bursting strength were decreased. Thus, when the appropriate amount of additives are added during corrugated board production process, increased bonding efficiency of starch adhesives and higher water resistance of corrugated board can be achieved.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.4
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• pp.41-47
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• 2000

In this study, the purpose finds out the best welding conditions for bonding of electric wire by ultrasonic welding. The material was plastic-insulating low-voltage-cabels for automobiles. The experiment varied the values of welding time and welding pressure and fixed the values of amplitude and energy. With the facts, the best condition for ultrasonic welding to achieve bonding exactly is gained according to the size of the cross-sectional area of the cable, and the adhesive intensity is greatly influenced by the variables of welding time and welding pressure. Also when the welding time and welding time and welding pressure increase as the cross-sectional areas of the cable increase the welding result in gained exactly.

• Journal of information and communication convergence engineering
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• v.13 no.3
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• pp.172-179
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• 2015

Face-to-face (F2F) bonding in three-dimensional integrated circuits (3D ICs), compared with other bonding styles, is closer to commercialization because of its benefits in terms of density, yield, and cost. However, despite the benefits that F2F bonding expect to provide, it's physical nature has not been studied thoroughly. In this study, we, for the first time, extract cross-die (inter-die) parasitic elements from F2F bonds on the full-chip scale and compare them with the intra-die elements. This allows us to demonstrate the significant impact of field sharing across dies in F2F bonding on full-chip noise and critical path delay values. The baseline method used is the die-by-die method, where the parasitic elements of individual dies are extracted separately and the cross-die parasitic elements are ignored. Compared with this inaccurate method, which was the only method available until now, our first-of-its-kind holistic method corrects the delay error by 25.48% and the noise error by 175%.

• Journal of Sensor Science and Technology
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• v.14 no.3
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• pp.206-210
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• 2005

The SOI structure with buried alumina was fabricated by ALD followed by bonding and etchback process. The interface of alumina and silicon was analyzed by CV measurements and cross section was investigated by SEM analysis. The density of interface state of alumina and silicon was 2.5E11/$cm^{2}$-eV after high temperature annealing for wafer bonding. It was confirmed that the surface silicon layer was completely isolated from substrate by cross section SEM and AES depth profile. The device on this alumina SOI structure would have better thermal properties than that on conventional SOI due to higher thermal conductivity of alumina than that of silicon dioxide.