• Title/Summary/Keyword: Critical size effect

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The effect of micro pore on the characteristics of crack tip plastic zone in concrete

  • Haeri, Hadi;Sarfarazi, V.
    • Computers and Concrete
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    • v.17 no.1
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    • pp.107-127
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    • 2016
  • Concrete is a heterogeneous material containing many weaknesses such as micro-cracks, pores and grain boundaries. The crack growth mechanism and failure behavior of concrete structures depend on the plastic deformation created by these weaknesses. In this article the non-linear finite element method is used to analyze the effect of presence of micro pore near a crack tip on both of the characteristics of crack tip plastic zone (its shape and size) and crack growth properties (such as crack growth length and crack initiation angle) under pure shear loading. The FE Code Franc2D/L is used to carry out these objectives. The effects of the crack-pore configurations and the spacing between micro pore and pre-excising crack tip on the characteristics of crack tip plastic zone and crack growth properties is highlighted. Based on the obtained results, the relative distance between the crack tip and the micro pore affects in very significant way the shape and the size of the crack tip plastic zone. Furthermore, crack growth length and crack initiation angle are mostly influenced by size and shape of plastic zone ahead of crack tip. Also the effects of pore decrease on the crack tip by variation of pore situation from linear to perpendicular configuration. The critical position for a micro pore is in front of the crack tip.

Oxidation Effect on the Critical Velocity of Pure Al Feedstock Deposition in the Kinetic Spraying Process (저온분사 공정에서 알루미늄 분말의 산화가 임계 적층 속도에 미치는 영향)

  • Kang, Ki-Cheol;Yoon, Sang-Hoon;Ji, Youl-Gwun;Lee, Chang-Hee
    • Journal of Welding and Joining
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    • v.25 no.4
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    • pp.35-41
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    • 2007
  • In kinetic spraying process, the critical velocity is an important criterion which determines the deposition of a feedstock particle onto the substrate. In other studies, it was experimentally and numerically proven that the critical velocity is determined by the physical and mechanical properties and the state of materials such as initial temperature, size and the extent of oxidation. Compared to un-oxidized feedstock, oxidized feedstock required a greater kinetic energy of in-flight particle to break away oxide film during impact. The oxide film formed on the surface of particle and substrate is of a relatively higher brittleness and hardness than those of general metals. Because of its physical characteristics, the oxide significantly affected the deposition behavior and critical velocity. In this study, in order to investigate the effects of oxidation on the deposition behavior and critical velocity of feedstock, oxygen contents of Al feedstock were artificially controlled, individual particle impact tests were carried out and the velocities of in-flight Al feedstock was measured for a wide range of process gas conditions. As a result, as the oxygen contents of Al feedstock increased, the critical velocity increased.

Theoretical models of threshold stress intensity factor and critical hydride length for delayed hydride cracking considering thermal stresses

  • Zhang, Jingyu;Zhu, Jiacheng;Ding, Shurong;Chen, Liang;Li, Wenjie;Pang, Hua
    • Nuclear Engineering and Technology
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    • v.50 no.7
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    • pp.1138-1147
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    • 2018
  • Delayed hydride cracking (DHC) is an important failure mechanism for Zircaloy tubes in the demanding environment of nuclear reactors. The threshold stress intensity factor, $K_{IH}$, and critical hydride length, $l_C$, are important parameters to evaluate DHC. Theoretical models of them are developed for Zircaloy tubes undergoing non-homogenous temperature loading, with new stress distributions ahead of the crack tip and thermal stresses involved. A new stress distribution in the plastic zone ahead of the crack tip is proposed according to the fracture mechanics theory of second-order estimate of plastic zone size. The developed models with fewer fitting parameters are validated with the experimental results for $K_{IH}$ and $l_C$. The research results for radial cracking cases indicate that a better agreement for $K_{IH}$ can be achieved; the negative axial thermal stresses can lessen $K_{IH}$ and enlarge the critical hydride length, so its effect should be considered in the safety evaluation and constraint design for fuel rods; the critical hydride length $l_C$ changes slightly in a certain range of stress intensity factors, which interprets the phenomenon that the DHC velocity varies slowly in the steady crack growth stage. Besides, the sensitivity analysis of model parameters demonstrates that an increase in yield strength of zircaloy will result in a decrease in the critical hydride length $l_C$, and $K_{IH}$ will firstly decrease and then have a trend to increase with the yield strength of Zircaloy; higher fracture strength of hydrided zircaloy will lead to very high values of threshold stress intensity factor and critical hydride length at higher temperatures, which might be the main mechanism of crack arrest for some Zircaloy materials.

Effect of Natural Convection Instability on Reduction of Fouling and Increasing of Critical Flux in Constant-flow Ultrafiltration (정유량 한외여과에서 자연대류 불안정성의 막오염 감소 및 임계 플럭스 증가 효과)

  • Jang, A-Rum;Nam, Sang-Won;Youm, Kyung-Ho
    • Membrane Journal
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    • v.22 no.5
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    • pp.332-341
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    • 2012
  • We studied the effects of induction of natural convection instability flow (NCIF) according to the gravitational orientation (inclined angle) of the membrane cell on the reduction of membrane fouling in the constant-flow ultrafiltration (UF) of colloidal silica solutions. Five colloidal silica solutions with different silica size (average size = 7, 12, 22, 50 nm and 78 nm) were used as UF test solutions. The silica particles in colloidal solutions form cakes on the membrane surface thereby causing severe membrane fouling. The constant-flow UF performance according to the gravitational orientation of the membrane cell (from $0^{\circ}$ to $180^{\circ}$ inclined angle), was examined in an unstirred dead-end cell. We evaluate the effects of NCIF on the suppression of fouling formation by measuring the variation of transmembrane pressure (TMP) and the increase of critical flux by using the flux-stepping method. In the constant-flow dead-end UF for the smaller size (7, 12 nm and 22 nm) silica colloidal solutions, changing the gravitational orientation (inclined angle) of the membrane cell above the $30^{\circ}$ angle induces NCIF in the membrane module. This induced NCIF enhances back transport of the deposited silica solutes away from the membrane surface, therefore gives for the reduction of TMP. But in the constant-flow UF for the more larger size (50 nm and 78 nm) silica colloidal solutions, NCIF effects are not appearing. The critical flux is increased as increasing the module angle and decreasing the silica size. Those results show that the intesity of NCIF occurrence in membrane module is more higher as increasing the module angle and decreasing the silica size.

The Effect of Hole Size on the Failure Strength and Fracture Toughness in Polymer Matrix Composite Plates (Plastic기 복합재료의 파손강도 및 파괴인성에 미치는 원공크기의 영향)

  • Kim, Jeong-Gyu;Kim, Do-Sik
    • Korean Journal of Materials Research
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    • v.3 no.2
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    • pp.197-204
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    • 1993
  • Abstract The effects of the hole size and the specimen width on the fracture behavior of several fabric composite plates are experimentally investigated in tension. Tests are performed on plain woven glass/ epoxy, plain woven carbon/epoxy and satin woven glass/polyester specimens with a circular hole. It is shown in this paper that the characteristic length according to the point stress criterion depends on the hole size and the specimen width. An excellent agreement is found between the experimental results and the analytical predictions of the modified failure criterion. The notched strength increase with an increase in the damage ratio, which is explained by a stress relaxation due to the formation of damage zone. When the unstable fracture occurred, the critical crack length equivalent for the damage zone is about twice the characteristic length. The critical energy release rate $G_c$ is independent of hole size for the same specimen width. The variation of $G_c$ according to the material system, fiber volume fraction and specimen width relates to the notch sensitivity factor. $G_c$ increases with a decrease in the notch sensitivity factor, which can be explained by a stress relaxation due to the increase of damage zone.

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Superconducting properties of MgB2 superconductors in-situ processed using various boron powder mixtures

  • Kang, M.O.;Joo, J.;Jun, B.H.;Kim, C.J.
    • Progress in Superconductivity and Cryogenics
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    • v.23 no.3
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    • pp.45-50
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    • 2021
  • In this study, the effect of the size of B powder on the critical current density (Jc) of MgB2 prepared by an in situ reaction process was investigated. Various combinations of B powders were made using a micron B, ball-milled B and nano B powders. Micron B powder was reduced by ball milling and the milled B powder was mixed with the micron B or nano B powder. The mixing ratios of the milled B and micron or nano B were 100:0, 50:50 and 0:100. Non-milled micron B powder was also mixed with nano powder in the same ratios. Pellets of (2B+Mg) prepared with various B mixing ratios were heat-treated to form MgB2. Tc of MgB2 decreased slightly when the milled B was used, whereas the Jc of MgB2 increased with increasing amount of the milled B or the nano powder. The used of the milled B and nano B power promoted the formation MgB2 during heat treatment. In addition to the enhanced formation of MgB2, the use of the powders reduced the grain size of MgB2. The use of the milled and nano B powder increased the Jc of MgB2. The highest Jc was achieved when 100% nano B powder was used. The Jc enhancement is attributed to the high volume fraction of the superconducting phase (MgB2) and the large grain boundaries, which induces the flux pinning at the magnetic fields.

Engineered nanoparticles in wastewater systems: Effect of organic size on the fate of nanoparticles

  • Choi, Soohoon;Chen, Ching-Lung;Johnston, Murray V.;Wang, Gen Suh;Huang, Chin-Pao
    • Membrane and Water Treatment
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    • v.13 no.1
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    • pp.29-37
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    • 2022
  • To verify the fate and transport of engineered nanoparticles (ENP), it is essential to understand its interactions with organic matter. Previous research has shown that dissolved organic matter (DOM) can increase particle stability through steric repulsion. However, the majority of the research has been focused on model organic matter such as humic or fulvic acids, lacking the understanding of organic matter found in field conditions. In the current study, organic matter was sampled from wastewater treatment plants to verify the stability of engineered nanoparticles (ENP) under field conditions. To understand how different types of organic matter may affect the fate of ENP, wastewater was sampled and separated based on their size; as small organic particular matter (SOPM) and large organic particular matter (LOPM), and dissolved organic matter (DOM). Each size fraction of organic matter was tested to verify their effects on nano-zinc oxide (nZnO) and nano-titanium oxide (nTiO2) stability. For DOM, critical coagulation concentration (CCC) experiments were conducted, while sorption experiments were conducted for organic particulates. Results showed that under field conditions, the surface charge of the particles did not influence the stability. On the contrary, surface charge of the particles influenced the amount of sorption onto particulate forms of organic matter. Results of the current research show how the size of organic matter influences the fate and transport of different ENPs under field conditions.

Fabrication of Electrochemical method (전기화학 합성)

  • Lee, Sang-Heon;Choi, Yong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.284-284
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    • 2010
  • YBCO ceramic specimens were fabricated by added $BaTiO_3$ as donors and sintered $950^{\circ}C$/24hrs. Average grain size decreased with increased in added $BaTiO_3$. Affect to grain growth. XRD result, peak strength was lowed then crystallization not well all specimens. All specimens critical temperature about 90k.

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Improvement of Dispersion Stability of Ink-jet Ink for Polyester Fiber (폴리에스터용 잉크젯 잉크의 분산안정성 개선에 관한 연구)

  • 최재홍;지병철;서인석
    • Textile Coloration and Finishing
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    • v.15 no.5
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    • pp.321-326
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    • 2003
  • In order for disperse dye based ink to be fitted with the critical requirements of ink jet printing, this study was undertaken to investigate the effects of 6 different dispersants on the milling efficiency of insoluble dye particles and dispersion stability of the final ink. It was found that a polystyrene dispersant with high molecular weight exerted relatively better dispersion stability which may be associated with its steric stabilization effect in the ink solution.

Dynamic Reliability of Board Level by Changing the Design Parameters of Flip Chips (플립칩의 매개변수 변화에 따른 보드레벨의 동적신뢰성평가)

  • Kim, Seong-Keol;Lim, Eun-Mo
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.5
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    • pp.559-563
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    • 2011
  • Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.