• Journal of the Korea Concrete Institute
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• v.15 no.3
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• pp.400-408
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• 2003

Chloride ion inside concrete destroys the so-called passive film surrounding reinforcing bars inside concrete so that the so-called salt attack accelerates corrosion which is the most critical factor for durability as well as structural safety of reinforced concrete structures. Recently, as a solution of the salt attack, the ground granulated blast-furnace slag(GGBFS) have been used as binder or blended cement more extensively. In this paper, characteristics of chloride ion diffusion for the GGBFS concrete, which is known to possess better resistance to damage due to the chloride ion penetration than ordinary portland cement(OPC) concrete possesses, are analyzed and a chloride ion diffusion model for the GGBFS concrete is proposed by modifying an existing diffusion model for the OPC concrete. The proposed model is verified by comparing diffusion analysis results using the model accelerated chloride penetration test results for concrete specimens as well as field test results for an RC bridge pier. Then, an optimal resistance condition to chloride penetration for the GGBFS concrete is obtained according to degrees of fineness and replacement ratios of the GGBFS concrete. The result shows that the GGBFS concrete has better resistance to chloride ion penetration than OPC concrete has and the resistance is more affected by the replacement ratio than the degree of fineness of the GGBFS.

• Journal of Conservation Science
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• v.36 no.3
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• pp.178-186
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• 2020

Verdigris is a traditional artificial pigment reported on old research papers and according to the methods mentioned in the literature, it is manufactured by the corrosion of copper or copper alloys using vinegar and by further scraping the generated rust. Since the Three Kingdoms Period, various household products with copper alloys, such as bronze and brass, have been used, and pigment analysis of these cultural heritage items has revealed the presence of tin, zinc, lead, and copper in green pigments. Based on these data, five types of verdigris were prepared from copper and copper alloys, and analyzed. the analysis results revealed a bluish green pigmentation, and the chromaticity, particle shape, and oil absorption quantity of each verdigris differed based on the type of copper alloy used in its preparation. The main components of verdigris are Cu, Sn, Zn and Pb, and their proportions depended on the type of copper alloy used during manufacturing. However, the main constituent mineral of the pigments is the same as 'hoganite[Cu(CH₃COO)₂·H₂O]', regardless of the copper alloy used. The result of accelerated weathering test for stability evaluation revealed that verdigris was discolored rapidly, thereby indicating that its stability was low, in particular, the pigments comprising lead presented relatively lower stability.

• Korean Journal of Materials Research
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• v.11 no.8
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• pp.647-654
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• 2001

Effects of final annealing temperature on the precipitate and oxidation were investigated for the Zr-lNb and Zr-lNb-lSn-0.3Fe alloys. The microstructure and oxidation of both alloys were evaluated for the optimization of final annealing process of these alloys in the annealing temperature regime of 450 to $800^{\circ}C$. The corrosion test was performed under steam at $400^{\circ}C$ for 270 days in a static autoclave. The oxide formed was identified by low angle X-ray diffraction method. The $\beta$-Zr was observed at annealing temperature above $600^{\circ}C$. Above $600^{\circ}C$, the precipitate area volume fraction of Zr-lNb and Zr-1Nb-lSn-0.3Fe alloys appeared to be increased with increasing the final annealing temperature. The corrosion resistance of Zr-lNb was higher than that of Zr- lNb-lSn-0.3Fe alloy. The corrosion rate of both alloys were accelerated due to the formation and growth of $\beta$-Zr with increasing the annealing temperature.

• Transactions on Electrical and Electronic Materials
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• v.18 no.4
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• pp.207-210
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• 2017

The suspension arrangement of insulators provides flexibility and assists in power transmission in transmission lines. The performance of the insulator string is strongly influenced by the environmental conditions to which it is exposed, its shape and the inherent material properties of suspension-type insulators. The suspension-type insulators are mostly made from glass, porcelain and ceramic material due to their high resistivity. Irregularity in charge distribution throughout the porcelain insulator may lead to accelerated aging and electrical breakdown. A very high and steep lightning impulse voltage may also cause breakdown of suspension-type insulators. We investigated various material characteristics such as alumina addition, surface morphology, x-ray diffraction pattern and relative density of suspension porcelain insulators manufactured in 1989 (36,000 lbs.), 1995 (36,000 lbs.) and 2001 (36,000 lbs.) by the KRI Company for use in 154 kV high power transmission lines. We compared the material characteristics of these porcelain insulators with that of the top-of-the-line porcelain insulators (36,000 lbs.) manufactured by the NGK Company in 2000. These suspension-type porcelain insulators were exposed to arc and flashover tests to examine their electrical and mechanical strength. It was noted that alumina addition (17 wt.%) for K-2001 was one of the major contributors to the enhancement of the performance of the porcelain insulators and to their ability to withstand very high current generation during the arc test. The porcelain insulators manufactured during 2001 also showed the highest relative density of 95.8% as compared to the other insulators manufactured in 1989 and 1995 respectively 94.2% and 91.5%. We also discuss reports of various failure modes of suspension-type porcelain insulators.

• Journal of Auto-vehicle Safety Association
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• v.13 no.2
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• pp.30-34
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• 2021

Electrical failures and reliability problems of electronic components by ionic migration between adjacent device terminals have become an issue in automotive electronics. Especially unlike galvanic corrosion, ionic migration is occurred at high temperature and high humidity under applied electric field condition. Until now, although extensive studies of the ionic migrations dealing with PCBs, electrodes, and solders were reported, there is no study on the effect of insulation polymers and metallic fillers for ionic migration. In this research, therefore, ionic migration induced by the types and contents of polymers and metallic fillers, and variety conditions of temperature, humidity, and applied voltage was studied in detail. Ester and amide types of liquid crystal polymer (LCP) and poly (phthalamide) (PPA) were used as base polymers, respectively and compounded with the metallic fillers of Copper iodide (CuI), Zinc stearate (Zn-st), or Calcium stearate (Ca-st) in various compositions. The compounding polymers were fabricated in IPC-B-24 of SIR test coupon according to ISO 9455-17 with Cu electrodes for ionic migration test. While there is no change in LCP-based samples, ionic migration in PPA compounding sample with a high water absorption property was accelerated in the presence of 0.25 wt% or above of CuI at the environmental conditions of 85℃, 85% RH and 48V. The dendritic short-circuit growth of Cu caused by ionic migration between the electrodes on the surface of compounded polymers was systematically observed and analyzed by using optical microscopy and SEM (EDX).

• KSCE Journal of Civil and Environmental Engineering Research
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• v.7 no.3
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• pp.229-240
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• 1987

Carbonation of concrete is one type of a chemical process. The reaction mechanism is very complex for the case when low-calcium fly ash and blast furnace slag is added. When fly ash and blast furnace slag is used as an admixture in concrete, they improve compressive strength in the long term, permeability and chemical resistance of concrete by a pozzolanic reaction and latent hydraulic property. On the other hand, the pozzolanic reaction of fly ash and latent hydraulic property of the blast furance slag leads to a reduction of the alkalinity of the concrete. It has been pointed out that this will accelerate the carbonation of the concrete and the corrosion of reinforcement steel embedded in the concrete. In order to clarify the effect of fly ash and blast furance slag on the carbonation of concrete, an accelerated carbonation testing of concrete was carried out by varying the conditions of concrete and the initial curing period in water. The test results of accelerated carbonation were compared to the carbonation test results of concrete stored for 15 years in open air, but protected from rain. As a result, the equation for the rate of carbonation based on compressive strength of concrete was proposed.

• Journal of the Korea institute for structural maintenance and inspection
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• v.21 no.6
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• pp.83-90
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• 2017

Concrete structure for nuclear power plant is mass concrete structure with large wall depth and easily permits cracking in early age due to hydration heat and drying shrinkage. It always needs cooling water so that usually located near to sea shore. The crack on concrete surface permits rapid chloride intrusion and also causes more rapid corrosion in the steel. In the study, the effect of age and crack width on chloride diffusion is evaluated for the concrete for nuclear power plant with 6000 psi strength. For the work, various crack widths with 0.0~1.4 mm are induced and accelerated diffusion test is performed for concrete with 56 days, 180days, and 365 days. With increasing crack width over 1.0mm, diffusion coefficient is enlarged to 2.7~3.1 times and significant reduction of diffusion is evaluated due to age effect. Furthermore, apparent diffusion coefficient and surface chloride content are evaluated for the concrete with various crack width exposed to atmospheric zone with salt spraying at the age of 180 days. The results are also analyzed with those from accelerated diffusion test.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of Advanced Marine Engineering and Technology
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• v.38 no.7
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• pp.883-889
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• 2014

It is generated for cavitation erosion due to the local static boiling by pressure differentials in high speed rotating fluid environment. The cavitation is influenced by various elements such as pressure, velocity, temperature, pH of fluid and medium. In particular, the damage of material is accelerated due to the electrochemical corrosion by $C1^-$ and cavitation erosion due to cavities in seawater. In this paper, hence, it investigated for martensite stainless steel the damage behavior with applied current density and cavitation time in natural seawater solution. Less damage depth at the cavitation condition was observed than static condition as a result of galvanostatic experiment. Furthermore, it was shown that dramatic increase of weightloss, damage rate and damage depth after 3 hour of cavitation test.