• Title/Summary/Keyword: Core-Chip

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A Quadrature VCO Exploiting Direct Back-Gate Second Harmonic Coupling

  • Oh, Nam-Jin
    • Journal of electromagnetic engineering and science
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    • v.8 no.3
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    • pp.134-137
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    • 2008
  • This paper proposes a novel quadrature VCO(QVCO) based on direct back-gate second harmonic coupling. The QVCO directly couples the current sources of the conventional LC VCOs through the back-gate instead of front-gate to generate quadrature signals. By the second harmonic injection locking, the two LC VCOs can generate quadrature signals without using on-chip transformer, or stability problem that is inherent in the direct front-gate second harmonic coupling. The proposed QVCO is implemented in $0.18{\mu}m$ CMOS technology operating at 2 GHz with 5.0 mA core current consumption from 1.8 V power supply. The measured phase noise of the proposed QVCO is - 63 dBc/Hz at 10 kHz offset, -95 dBc/Hz at 100 kHz offset, and -116 dBc/Hz at 1 MHz offset from the 2 GHz output frequency, respectively. The calculated figure of merit(FOM) is about -174 dBc/Hz at 1 MHz offset. The measured image band rejection is 46 dB which corresponds to the phase error of $0.6^{\circ}$.

A 15-GHz CMOS Multiphase Rotary Traveling-Wave Voltage-Controlled Oscillator

  • Zhang, Changchun;Wang, Zhigong;Zhao, Yan;Park, Sung-Min
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.12 no.3
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    • pp.255-265
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    • 2012
  • This paper presents a 15-GHz multiphase rotary traveling-wave voltage-controlled oscillator (RTW VCO) where a shielded coplanar stripline (CPS) is exploited to provide better shielding protection and lower phase noise at a moderate cost of characteristic impedance and power consumption. Test chips were implemented in a standard 90-nm CMOS process, demonstrating the measured results of 2-GHz frequency tuning range, -11.3-dBm output power, -109.6-dBc/Hz phase noise at 1-MHz offset, and 2-ps RMS clock jitter at 15 GHz. The chip core occupies the area of $0.2mm^2$ and dissipates 12 mW from a single 1.2-V supply.

SRP Based Programmable FHD HEVC Decoder (SRP 기반 FHD HEVC Decoder)

  • Song, Joon Ho;Lee, Sang-jo;Lee, Won Chang;Kim, Doo Hyun;Kim, Jae Hyun;Lee, Shihwa
    • Proceedings of the Korean Society of Broadcast Engineers Conference
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    • 2014.06a
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    • pp.160-162
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    • 2014
  • A programmable video decoding system with multi-core DSP and co-processors is presented. This system is adopted by Digital TV SoC (System on Chip) and is used for FHD HEVC (High Efficiency Video Coding) decoder. Using the DSP based programmable solution, we can reduce commercialization period by one year because we can parallelize algorithm development, software optimization and hardware design. In addition to the HEVC decoding, the proposed system can be used for other application such as other video decoding standard for multi-format decoder or video quality enhancement.

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ISDN System On Chip Design Using ARM7 Core and Implementation of Multimedia Terminal (ARM7 코어를 이용한 ISDN 시스템 칩 설계 및 멀티미디어 단말 구현)

  • So, Woon-Seob;Hyang, Dae-Hwan
    • Proceedings of the Korea Information Processing Society Conference
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    • 2001.10b
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    • pp.1463-1466
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    • 2001
  • 본 논문은 ISDN 통신망에서 멀티미디어 통신 서비스를 제공하기 위해 단말에 사용되는 ISDN 시스템 칩 설계 및 단말 구현에 관한 것이다. 저가의 통신 단말을 구현하기 위하여 32 비트 RISC 프로세서인 ARM7 프로세서 코어를 중심으로 ISDNS S/T 인터페이스를 통한 통신망 접속 기능, 톤 발생 및 음성 코덱 기능, TDM 버스 정합 기능, PC 정합 기능을 가지는 ISDN 시스템 칩을 설계 및 개발하였고, 이 칩을 시험하기 위한 시험 프로그램 및 통신 단말 소프트웨어를 개발하였으며, 응용단말을 구현하여 자체 기능 시험 및 실제 망 접속 시험을 통하여 기능을 검증하였다.

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A Study on the Optical communication part Lid glass manufacture technology by high temperature and compression molding (광통신 부품 Lid glass 고온압축성형의 관한 연구)

  • Jang, K.C.;Lee, D.G.;Jang, H.
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1526-1531
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    • 2007
  • Data transmission capacity that is required in 2010 is forecasted that increase by optical communication capacity more than present centuple, and is doing increased demand of optical communication related industry product present. Specially, Lid glass' application that is one of optical communication parts is used in optical communication parts manufacture of Fiber array, Ferrule array, Fanout Black, Silica optical waveguide chip and splitter etc. Also, it is used widely for communication network system, CATV, ATM-PON, FTTH and system. But, Lid glass need much processing times and becomes cause in rising prices of optical communication parts because production cost is expensive. The objectives, of this work is to suggest the micro concave and convex pattern manufacturing technology on borosilicate plate using high temperature and compression molding method. As a result, could developed micro pattern Mold more than 5 pattern, and reduce Lid Glass manufacture cycle time.

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Implementation of S1n91e-Phase SAMRT Meter using Programmable IC (Programmable IC를 이용한 다기능 전자식 단상 전력량계 기능 구현)

  • Park, Jong-Beom;Yoon, Gi-Gab;Woo, Sang-Mok;Park, In-Kwon;Kim, Hong;Kim, Jung-Soo
    • Proceedings of the KIEE Conference
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    • 2000.11d
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    • pp.644-646
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    • 2000
  • According to the deregulations of governments in the world. the power industries of United State and European nations are proceeding remote meter reading and remote load control. But the core technology of multifunctional electronic meter implemented by programmable one-chip IC, which can be the right answer of all the power industy's efforts is now still under development in the advanced countries. Implementation of smallest size, lowest price single-phase meter with features which enable distribution automation such as bidirectional communication, Remote load control, remote meter reading, remote credit assigment. Prepayment billing system.

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A Design of CMOS Subbandgap Reference using Pseudo-Resistors (가상저항을 이용한 CMOS Subbandgap 기준전압회로 설계)

  • Lee, Sang-Ju;Lim, Shin-Il
    • Proceedings of the KIEE Conference
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    • 2006.10c
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    • pp.609-611
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    • 2006
  • This paper describes a CMOS sub-bandgap reference using Pseudo-Resistors which can be widely used in flash memory, DRAM, ADC and Power management circuits. Bandgap reference circuit operates weak inversion for reducing power consumption and uses Pseudo-Resistors for reducing the chip area, instead of big resistor. It is implemented in 0.35um Standard 1P4M CMOS process. The temperature coefficient is 5ppm/$^{\circ}C$ from $40^{\circ}C$ to $100^{\circ}C$ and minimum power supply voltage is 1.2V The core area is 1177um${\times}$617um. Total current is below 2.8uA and output voltage is 0.598V at $27^{\circ}C$.

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A 4-Channel 6.25-Gb/s/ch VCSEL Driver for HDMI 2.0 Active Optical Cables

  • Hong, Chaerin;Park, Sung Min
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.17 no.4
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    • pp.561-567
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    • 2017
  • This paper presents a 4-channel common-cathode VCSEL driver array operating up to 6.25 Gb/s per channel for the applications of HDMI 2.0 active optical cables. The proposed VCSEL driver consists of an input buffer, a modified Cherry-Hooper amplifier as a pre-driver, and a main driver with pre-emphasis to drive a common-cathode VCSEL diode at high-speed full switching operations. Particularly, the input buffer merges a linear equalizer not only to broaden the bandwidth, but to reduce power consumption simultaneously. Measured results of the proposed 4-channel VCSEL driver array implemented in a $0.13-{\mu}m$ CMOS process demonstrate wide and clean eye-diagrams for up to 6.25-Gb/s operation speed with the bias current 2.0 mA and the modulation currents of $3.1mA_{PP}$. Chip core occupies the area of $0.15{\times}0.1{\mu}m^2$ and dissipate 22.8 mW per channel.

Design of Core Chip for 3.1Gb/s VCSEL Driver in 0.18㎛ CMOS (0.18㎛ CMOS 3.1Gb/s VCSEL Driver 코아 칩 설계)

  • Yang, Choong-Reol;Lee, Sang-Soo
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.38A no.1
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    • pp.88-95
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    • 2013
  • We propose a novel driver circuit design using $0.18{\mu}m$ CMOS process technology that drives a 1550 nm high-speed VCSEL used in optical transceiver. We report a distinct improvement in bandwidth, voltage gain and eye diagram at 3.1Gb/s data rate in comparison with existing topology. In this paper, the design and layout of a 3.1Gb/s VCSEL driver for optical transceiver having arrayed multi-channel of integrating module is confirmed.

The Function Test of Three-Phase SAMRT Meter using FPGA (FPGA를 이용한 다기능 전자식 삼상 전력량계 기능 시험)

  • Park, Jong-Beom;Kim, Min;Kim, Hong;Kim, Jung-Soo
    • Proceedings of the KIEE Conference
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    • 2001.11c
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    • pp.209-211
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    • 2001
  • The core in developing the transformer-operated 3 phase solid state meter is to design a single chip IC, that incorporates all the necessary features required for development of the 3 phase solid state meter. Using this technology, the solid state meter can be mass produced at lower cost and higher quality. This report deals with the performance of the prototype FPGA board, which is the final step before actual IC fabrication in fabrication LAB. All the features of FPGA board, shown in this report will be included in the final ASIC IC product.

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