• Title/Summary/Keyword: Copper(II) Oxide

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Chromatic Characteristics of Copper Glaze as a Function of Copper Oxide Addition and Sintering Atmosphere

  • No, Hyunggoo;Kim, Soomin;Kim, Ungsoo;Cho, Wooseok
    • Journal of the Korean Ceramic Society
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    • v.54 no.1
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    • pp.61-65
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    • 2017
  • Examined in this study were the effects of copper oxide (II) addition and sintering conditions on the chromatic characteristics of copper glaze. Oxidatively sintered samples exhibited the negative increase of $CIEa^*$ and the positive increase of $CIEb^*$ with the increase of CuO concentration, leading to Green and Green-Yellow coloration. On the other hand, $CIEa^*$ and $CIEb^*$ of reductively sintered samples were positively increased in direct proportion. The green color of oxidatively sintered samples was originated from the $Cu^{2+}$ ions formed by the dissolution of CuO. The reductively sintered samples resulted in dull tone red color with low chroma. Such behavior seems to be influenced by the interplay of metal Cu aggregation, metal Cu globule, and $Cu_2O$ formed in the glaze layer through the redox interaction of CuO during the sintering process.

A study of Immobilizing Heavy metals by pellets manufactured from Coal tailings and Iron oxide (선탄경석(選炭硬石)과 광산화물(鑛酸化物)로 제조(製造)한 담체(擔體)의 중금속(重金屬) 불용화(不溶化) 특성연구(特性硏究))

  • Lee, Gye-Seung;Song, Young-Jun
    • Resources Recycling
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    • v.21 no.1
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    • pp.75-81
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    • 2012
  • Porous pellets for immobilizing heavy metals were manufactured from coal tailings and iron oxide powder. Coal tailings was pulverized and mixed with iron oxide powder. The mixed powder was granulated into spherical pellets and roasted. Over $1100^{\circ}C$, residual coal in coal tailings reduced iron oxide to ZVI(Zero-Valent Iron). The pellets have 34.63% of porosity, 1.31 g/mL of bulk density, and 9.82.urn median pore diameter. The pellets were reacted with synthetic solutions containing each heavy metals: arsenic(V), copper(II), chrome(VI), and cadmium(II), respectively. On the test of immobilizing heavy metal, the pellets made at $1100^{\circ}C$ were superior to the other pellets made under $1000^{\circ}C$. Immobilizing over 99.9% of 10ppm heavy metal solutions required I hour for arsenic, 2 hours for chrome, and 4 hours for copper. However, immobilizing capacity of cadmium was inferior to that of the other metals and it was decreased in reversely proportion to initial concentration of the solutions.

Failure Paths of Polymer/Roughened Metal Interfaces under Mixed-Mode Loading (혼합 하중하에서의 고분자/거친금속 계면의 파손경로)

  • Lee Ho-Young;Kim Sung-Ryong
    • Korean Journal of Materials Research
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    • v.14 no.5
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    • pp.322-327
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    • 2004
  • Copper-based leadframe sheets were oxidized in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched Brazil-nut (SBN) specimens. The SBN specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under mixed-mode (mode I + mode II) loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The results revealed that the failure paths were strongly dependent on the oxide type. In case of brown oxide, hackle-type failure was observed and failure path lay near the EMC/CuO interface with a little inclining to CuO at all case. On the other hand, in case of black oxide, quite different failure path was observed with respect to the distance from the tip of pre-crack and phase angle. Different failures occurred with oxide type is presumed to be due to the difference in microstructure of the oxides.

Design of Pretreatment Process of Lead Frame Etching Wastes Using Reduction-Oxidation Method (환원-산화법을 이용한 리드프레임 에칭폐액의 정제과정 설계)

  • Lee, Seung Bum;Jeon, Gil Song;Jung, Rae Yoon;Hong, In Kwon
    • Applied Chemistry for Engineering
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    • v.27 no.1
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    • pp.21-25
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    • 2016
  • When copper alloy is used in etching process for the production of lead frame, the high concentration of heavy metals, such as iron, nickel and zinc may be included in the etching waste. Those etching waste is classified as a specified one. Therefore a customized design was designed for the purification process of the lead frame etching waste liquid containing high concentrations of heavy metals for the production of an electroplating copper(II) oxide. Since the lead frame etching waste solution contains highly concentrated heavy metal species, an ion exchange method is difficult to remove all heavy metals. In this study, a copper(I) chloride was manufactured by using water solubility difference related to the reduction-oxidation method followed by the reunion of copper(II) chloride using sodium sulfate as an oxidant. The hydrazine was chosen as a reducing agent. The optimum added amount was 1.4 mol per 1.0 mol of copper. In the case of removal of heavy metals by using the combination of reduction-oxidation and ion exchange resin methods, 4.3 ppm of $Fe^{3+}$, 2.4 ppm of $Ni^{2+}$ and 0.78 ppm of $Zn^{2+}$ can be reused as raw materials for electroplating copper(II) oxide when repeated three times.

Comparative Study on the Failure of Polymer/Roughened Metal Interfaces under Mode-I Loading II: Adhesion Model (인장하중하에서의 고분자/거친금속 계면의 파손에 대한 비교연구 II: 접착모델)

  • Lee Ho-Young;Kim Sung-Ryong
    • Korean Journal of Materials Research
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    • v.15 no.1
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    • pp.6-13
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    • 2005
  • Copper based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or blackoxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. After fracture toughness testing, the fracture surface were analyzed by various equipment to investigate failure path. An adhesion model was suggested to explain the failure path formation. The adhesion model is based on the strengthening mechanism of fiber-reinforced composite. The present paper deals with the introduction of the adhesion model. The explanation of the failure path with the proposed adhesion model was introduced in the companion paper.

Effect of Temperature on the Adsorption of Pb(II), Cu(II), Zn(II), and Cd(II) onto Natural Clays Using Combined Adsorption-Sequential Extraction Analysis (혼합 흡착-연속추출법을 이용한 자연 점토의 납(Pb), 구리(Cu), 아연(Zn), 카드뮴(Cd) 흡착 시 온도 영향)

  • Dho, Nam Young;Lee, Seung Rae
    • Journal of the Korean GEO-environmental Society
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    • v.2 no.3
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    • pp.17-35
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    • 2001
  • In this study, we conducted a combined adsorption-sequential extraction analysis(CASA) to investigate temperature effects of single adsorption of lead, copper, zinc and cadmium on natural clays. As a result, it was found that in a single adsorption of lead and copper, about 50% of adsorption was occluded in carbonate phase, and in case of cadmium, about 80% of adsorption was occluded in exchangeable phase. At temperature below $25^{\circ}C$ about 60% of zinc was occluded in exchangeable phase but above $40^{\circ}C$ about 50% of zinc was occluded in carbonate phase. The effect of temperature on each occluded phase was largely observed in Fe-oxide, Mn-oxide and organic occluded phases. Besides, the adsorption of metals on natural clays was an endothermic reaction with the exception of exchangeable phase adsorption.

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Fabrication of Copper(II) Oxide Plated Carbon Sponge for Free-standing Resistive Type Gas Sensor and Its Application to Nitric Oxide Detection (프리스탠딩 저항형 가스 센서용 산화구리 무전해 도금 탄소스펀지 제조 및 일산화질소 감지)

  • Kim, Seokjin;Ha, Seongmin;Myeong, Seongjae;Lee, Young-Seak
    • Applied Chemistry for Engineering
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    • v.33 no.6
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    • pp.630-635
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    • 2022
  • Copper(II) oxide (CuO), electroless plated on a nitrogen-containing carbon sponge prepared by a melamine sponge thermal treatment, was developed as a nitric oxide (NO) gas sensor that operates without a wafer. The CuO content on the surface of the carbon sponge increased as the plating time increased, but the content of nitrogen known to induce NO gas adsorption decreased. The untreated carbon sponge showed a maximum resistance change (5.0%) at 18 min. On the other hand, the CuO plated sample (CuO30s-CS) showed a maximum resistance change of 18.3% in 8 min. It is considered that the improvement of the NO gas sensing capability was caused by the increase in hole carriers of the carbon sponge and improved movement of electrons due to CuO. However, the NO gas detection resistance of the CuO electroless plated carbon sponge for 60 s decreased to 1.9%. It is considered that the surface of the carbon sponge was completely plated with CuO, resulting in a decrease in the NO gas adsorption capacity and resistance change. Thus, CuO-plated carbon sponge can be used as an effective NO gas sensor because it has fast and excellent resistance change properties, but CuO should not be completely plated on the surface of the carbon sponge.

Fabrication and Characterization of Highly Reactive Al/CuO Nano-composite using Graphene Oxide (산화그래핀을 적용한 고반응성 Al/CuO 나노복합재 제조 및 분석)

  • Lim, YeSeul
    • Journal of Powder Materials
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    • v.26 no.3
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    • pp.220-224
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    • 2019
  • The aluminum (Al)/copper oxide (CuO) complex is known as the most promising material for thermite reactions, releasing a high heat and pressure through ignition or thermal heating. To improve the reaction rate and wettability for handling safety, nanosized primary particles are applied on Al/CuO composite for energetic materials in explosives or propellants. Herein, graphene oxide (GO) is adopted for the Al/CuO composites as the functional supporting materials, preventing a phase-separation between solvent and composites, leading to a significantly enhanced reactivity. The characterizations of Al/CuO decorated on GO(Al/CuO/GO) are performed through scanning electron microscopy, transmission electron microscopy, and energy dispersive X-ray spectroscopy mapping analysis. Moreover, the functional bridging between Al/CuO and GO is suggested by identifying the chemical bonding with GO in X-ray photoelectron spectroscopy analysis. The reactivity of Al/CuO/GO composites is evaluated by comparing the maximum pressure and rate of the pressure increase of Al/CuO and Al/CuO/GO. The composites with a specific concentration of GO (10 wt%) demonstrate a well-dispersed mixture in hexane solution without phase separation.

Failure Path of the Brown-oxide-coated Copper-based Leadframe/EMC Interface under Mixed-Mode Loading (혼합하중 조건하에서 갈색산화물이 입혀진 구리계 리드프레임/EMC 계면의 파손경로)

  • 이호영
    • Journal of the Korean institute of surface engineering
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    • v.36 no.6
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    • pp.491-499
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    • 2003
  • Copper-based leadframe sheets were oxidized in a hot alkaline solution to form brown-oxide layer on the surface and molded with epoxy molding compound (EMC). The brown-oxide-coated leadframe/EMC joints were machined to form sandwiched double-cantilever beam (SDCB) specimens and sandwiched Brazil-nut (SBN) specimens for the purpose of measuring the fracture toughness of leadframe/EMC interfaces. The SDCB and the SBN specimens were designed to measure the fracture toughness of the leadframe/EMC interfaces under nearly mode-I loading and mixed-mode (mode I + mode II) loading conditions, respectively. Fracture surfaces were analyzed by various equipment such as glancing-angle XRD, SEM, AES, EDS and AFM to elucidate failure path. Results showed that failure occurred irregularly in the SDCB specimens, and oxidation time of 2 minutes divided the types of irregular failures into two classes. The failure in the SBN specimens was quite different from that in the SDCB specimens. The failure path in the SBN specimens was not dependent on the phase angle as well as the distance from tips of pre-cracks.

Characteristics of photo-thermal reduced Cu film using photographic flash light

  • Kim, Minha;Kim, Donguk;Hwang, Soohyun;Lee, Jaehyeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.293.1-293.1
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    • 2016
  • Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.

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