• 한국재료학회지
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• 제22권10호
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• pp.545-551
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• 2012

In semiconductor manufacturing, the circuit integrity of packaged BGA devices is tested by measuring electrical resistance using test sockets. Test sockets have been reported to often fail earlier than the expected life-time due to high contact resistance. This has been attributed to the formation of Sn oxide films on the Au coating layer of the probe pins loaded on the socket. Similar to contact failure, and known as "fretting", this process widely occurs between two conductive surfaces due to the continual rupture and accumulation of oxide films. However, the failure mechanism at the probe pin differs from fretting. In this study, the microstructural processes and formation mechanisms of Sn oxide films developed on the probe pin surface were investigated. Failure analysis was conducted mainly by FIB-FESEM observations, along with EDX, AES, and XRD analyses. Soft and fresh Sn was found to be transferred repeatedly from the solder bump to the Au surface of the probe pins; it was then instantly oxidized to SnO. The $SnO_2$ phase is a more stable natural oxide, but SnO has been proved to grow on Sn thin film at low temperature (< $150^{\circ}C$). Further oxidation to $SnO_2$ is thought to be limited to 30%. The SnO film grew layer by layer up to 571 nm after testing of 50,500 cycles (1 nm/100 cycle). This resulted in the increase of contact resistance and thus of signal delay between the probe pin and the solder bump.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1916-1918
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• 1999

The electrical conductive mechanism and temperature dependence of electrical resistivity of ${\beta}-SiC+ZrB_2$ composites with $Al_2O_3+Y_2O_3$ contents were investigated. The electrical resistivity of hot-pressed composites was measured by the Pauw method from $25^{\circ}C$ to $700^{\circ}C$. The electrical resistivity of the composites showed the PTCR(Positive Temperature Coefficient Resistivity) and follow the electrical conduction model for a homogeneous mixture of two kind of particles with different conductivity. Also, the electrical resistivity versus temperature curves indicate the formation of local chains of $ZrB_2$ particles.

• 대한기계학회논문집A
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• 제26권5호
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• pp.976-985
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• 2002

The purpose of this paper is that the roughness(Rrms = 31$\AA$, Rp-v = 270$\AA$) of ITO thin film deposited by sputtering method for OELD is improved to Rrms $\leq$ 10$\AA$, Rp-v $\leq$ 80$\AA$ by chemical mechanical polishing(CMP). First, ITO thin films are polished with a variety of consumables (Pads, Slurries) to choose proper some for the roughness improvement and the CMP mechanism of ITO thin films is demonstrated on the ground of the experiment results. Henceforth, the CMP characteristics (Removal rate, Non-uniformity) of chosen consumables are evaluated according to processing conditions (Polishing pressures, Table velocities) and suitable conditions for ITO film CMP are selected. Finally, the electrical and optical properties (Sheet resistance, Transmittance) of ITO thin films are investigated to verify whether or not ITO thin film are still suitable for OELD after polished.

• 한국연소학회지
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• 제21권4호
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• pp.48-60
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• 2016

Experimental and numerical studies were conducted to investigate flame behaviors near flammable limits for downstream-interacting SNG-air premixed flames in a counter-flow configuration. The SNG fuel consisted of a methane, a propane, and a hydrogen with volumetric ratios of 91, 6, and 3%, respectively. The most appropriate priority for some reliable reaction mechanisms examined was given to the mechanism of UC San diego via comparison of lean extinction limits attained numerically with experimental ones. Flame stability map was presented with a functional dependencies of lower and upper methane concentrations in terms of global strain rate. The results show that, at the global strain rate of $30s^{-1}$, lean extinction boundary is slanted while rich extinction one is relatively less inclined because of the dependency of such extinction boundary shapes on deficient reactant Lewis number governed by methane mainly. Further increase of global strain rate forces both extinction boundaries to be more slanted and to be shrunk, resulting in an island of extinction boundary and subsequently one flame extinction limit. Extinction mechanisms for lean and rich, symmetric and asymmetric extinction boundary were identified and discussed via heat losses and chemical interaction.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
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• pp.39-45
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• 2000

A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.

• 대한기계학회논문집B
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• 제34권1호
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• pp.53-59
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• 2010

본 논문에서는, 자기유체역학(MHD)을 기반으로 마이크로 채널 내부에 다중 와류 유동을 발생시키는 새로운 형태의 카오스 마이크로 믹서를 제안한다. 제안된 마이크로 믹서의 마이크로 채널 내부에는 양측면과 바닥면에 전극들이 배치되어 있다. 배치된 전극들에 인가되는 전압 조건에 따라 다양한 형태로 로렌츠 힘이 유도되며, 이렇게 유도된 로렌츠 힘은 마이크로 채널 내부 유체의 추진 및 혼합을 야기할 수 있다. 제안된 MHD 마이크로 믹서의 혼합 양상을 평가하기 위해 3 차원 전산유체역학 시뮬레이션을 수행하였다. 이를 통해 다양한 유동 조건에 대해 MHD 마이크로 믹서의 혼합 성능을 평가하였다.

• 한국전기전자재료학회논문지
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• 제21권10호
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• pp.923-929
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• 2008

On the piezoelectric polymer, PVDF (poly vinylidene fluoride), the transparent conducting oxide (TCO) electrode material thin film was deposited by roll to roll sputtering process mentioned as a mass product-friendly process for display application. The deposition method for ITO Indium Tin Oxides) as our TCO was DC magnetron sputtering optimized for polymer substrate with the low process temperature. As a result, a high transparent and good conductive ITO/PVDF film was prepared. During the process, especially, the gas mixture ratio of Ar and Oxygen was concluded as an important factor for determining the film's physical properties. There were the optimum ranges for process conditions of mixture gas ratio for ITO/PVDF From these results, the doping mechanism between the oxygen atom and the metal element, Indium or Tin was highly influenced by oxygen partial pressure condition during the deposition process at ambient temperature, which gives the conductivity to oxide electrode, as generally accepted. With our studies, the process windows of TCO for display and other application can be expected.

• Advanced Composite Materials
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• 제16권1호
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• pp.1-10
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• 2007

Composite materials consisting of crushed carbon fiber reinforced plastics (CFRP) pieces and acrylonitrile-butadiene-styrene (ABS) resin were prepared by an injection mold method to solve the problem of recycling of CFRP. The electrical properties, such as electrical resistivity, alternating current impedance and electromagnetic interference (EMI) shielding effect, were measured for the composites. The electrical resistivity of the composites showed a percolation type of conduction behavior and no difference between parallel and perpendicular to the injection direction was observed for CFRP content higher than the critical value. Measurement of alternating current impedance revealed that the conduction mechanism is attributed to the direct conductive paths generated by distributed carbon fibers; however, strong frequency dependence of the impedance was observed for the CFRP content near the critical one. The frequency dependence of the impedance is caused by the inter-fiber connection and can be expressed as a simple equivalent circuit. The absorption component of shielding effect (SE) was smaller than the expected value estimated from its resistivity. The decline of SE is thought to be caused by the decrease in effective thickness due to fiber orientation.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

• 한국사회복지학
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• 제46권
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• pp.427-458
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• 2001

The present study is designed to trace the successful reform steps taken within the employment support system in the UK and to extract a set of instructive implications for Korea's future reform path towards an efficient employment support system conductive to youth employment by setting out an analytical framework that links the British experience to the Korean context. To this end, this study focuses on three major aspects of employment support system: delivery mechanism, method of delivery, and programs. Implications drawn from the comparative analysis are as follows. First, the current employment support services in Korea-including job placement service, vocational training, and public works-should be more tightly integrated and delivered in a more consistent fashion in order to become highly accessible to the unemployed. Second, the cooperative network between employment service providers and the corporate sector as demander of labor should be institutionalized in order to make the employment support system more responsive to labor demand. Third, to create an enhanced employment support system that counts in individual differences of the unemployed would require continued, in-depth consultation and case management services along with fully specialized employment caseworkers who would provide them. Fourth, the government should take the initiative and be unflaggingly supportive both institutionally and financially in making future efforts to continuously improve the employment support system on the basis of the implications mentioned above.