• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.9
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• pp.949-956
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• 2009

The C(t)-integral describes amplitude of stress and strain rate field near a tip of stationary crack under transient creep condition. Thus the C(t)-integral is a key parameter for the high-temperature crack assessment. Estimation formulae for C(t)-integral of the cracked component operating under mechanical load alone have been provided for decades. However, high temperature structures usually work under combined mechanical and thermal load. And no investigation has provided quantitative estimates for the C(t)-integral under combined mechanical and thermal load. In this study, 3-dimensional finite element analyses were conducted to calculate the C(t)-integral of elastic-creep material under combined mechanical and thermal load. As a result, redistribution time for the crack under combined mechanical and thermal load is re-defined through FE analyses to quantify the C(t)-integral. Estimates of C(t)-integral using this proposed redistribution time agree well with FE analyses results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.10
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• pp.1065-1073
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• 2009

In this paper, the estimation method of C(t)-integral for combined mechanical and thermal loads is proposed for elastic-plastic-creep material via 3-dimensional FE analyses. Plasticity induced by initial loading makes relaxation rate different from those produced elastically. Moreover, the interactions between mechanical and thermal loads make the relaxation rate different from those produced under mechanical load alone. To quantify C(t)-integral for combined mechanical and thermal loads, the simplified formula are developed by modifying redistribution time in existing work done by Ainsworth et al..

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.351-356
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• 2000

The mechanical stress due to the wheel-rail contact and thermal stress due to the drag braking increase the incidence of wheel failure. So, firstly, stress analyses(mechanical, thermal and combined stress) of wheel plate are performed using 3-dimensional finite element method(FEM). Secondly, the optimum design of wheel plate is investigated in order to reduce weight of the wheel based on results of stress analysis. The optimum design is peformed using 2-dimensional axisymmetric F.E. model and its results are verified by 3-dimensional F. E. model.

• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.3
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• pp.221-229
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• 2001

The mechanical stress due to the wheel-rail contact and thermal stress due to the drag braking increase the incidence of wheel failure. So, firstly, stress analyses(mechanical, thermal and combined stress) of wheel plate are performed using 3-dimensional finite element method(FEM). Secondly, the optimum design of wheel plate ;s investigated in order to reduce weight of the wheel based on results of stress analysis. The optimum design is peformed using 2-dimensional axisymmetric F.E. model and its results are verified by 3-dimensional F. E. model.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.12
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• pp.1123-1131
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• 2008

This paper provides V-factor estimation under combined mechanical and thermal load for circumferential cracks. Results are based on finite element analyses and effect of types and magnitudes of the thermal stress, crack geometry, the loading mode and plastic strain hardening on variations of the V-factor are investigated. The results of finite element analyses are compared with R6 values. As a result, it is shown that R6 gives generally conservative results. The conservatism is especially increased for the combination of large mechanical and thermal load. As a result, new estimation method which uses failure assessment line in R6 is proposed for V-factor and gives less conservative results.

• Journal of the Korean Society for Railway
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• v.5 no.3
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• pp.167-173
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• 2002

The influence of thermal stress at tread breaking in Korean High Speed Train wheel was investigated using the coupled thermal-mechanical analysis technique. The mechanical load or wheel-rail contract load and braking load were considered during FEM analysis. During the stop braking, the effect of mechanical stress on the combined stress is relatively larger than that of thermal stress in the rim of wheel. However, the effect of thermal stress is relatively larger than that of mechanical stress in the plate of wheel. When 300% of the block force was applied, the maximum von Mises stress of 61.0 MPa was found at the outside plate around 400 mm far away from the wheel center.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.43-48
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• 2004

When structures are loaded by a combination of primary and secondary stresses, plasticity effects occur which cannot be evaluated by a simple linear addition of the effects resulting from the two independent stress systems. Thermal stress due to temperature gradient is classified as secondary stress. It is known that secondary stress is released as increase of plastic zone. In this paper, two and three dimensional elastic-plastic finite element analyses are performed for the cracked plates and pipes under combined thermal and mechanical loading. And V-factor is introduced to account for plasticity effect. The present results provide that V-factor is function of thermal factor and loading and is consistent regardless of geometry. We developed the prediction method of elastic-plastic fracture mechanics parameter under combined primary and secondary loading from the present results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.6
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• pp.609-617
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• 2011

There is a trend towards the progressive use of higher operating temperatures and stresses to achieve improved efficiencies in power-generation equipment. It is important to perform the crack assessment under hightemperature and high-pressure conditions. The C(t)-integral is a key parameter in crack assessment for transient creep states. The estimation of the C(t)-integral is complex when considering the mechanical and thermal loads simultaneously. In this paper, we study estimation of C(t)-integral under combined mechanical and thermal load depending on loading conditions.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.11
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• pp.1207-1214
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• 2014

Under excessive plasticity, the fracture toughness of a material depends on its size and geometry. Under fully yielded conditions, the stresses in a material near its crack tip are not unique but rather depend on the geometry. Therefore, the single-parameter J-approach is limited to a high-constraint crack geometry. The JQ theory has been proposed for establishing the crack geometry constraints. This approach assumes that the crack-tip fields have two degrees of freedom. In this study, the crack-tip stress field of a fully circumferential surface-cracked pipe under combined loads is investigated on the basis of the JQ theory by using finite element analysis. The combined loads are a tensile axial force and the thermal gradient in the radial direction. Q-stresses of the crack geometry and its loading state are used to determine the constraint effects. The constraint effects of secondary loading are found to be greater than those of primary loading. Therefore, thermal shock is believed to be the most severe loading condition of constraint effects.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.10
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.