• 전기학회논문지
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• 제61권1호
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• pp.94-98
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• 2012

The behavior of ozone micro bubble cleaning system was investigated to evaluate the solution as a new method of solar cell wafer cleaning in comparison with former conventional RCA cleaning. We have developed the ozone dissolution system in the ozonated water for more efficient cleaning conditions. The optimized cleaning conditions for solar cell wafer process were 10 ppm of ozone concentration and 12 minutes in cleaning periods, respectively. We have confirmed the cleaning reliability and cell efficiencies after ozone micro bubble cleaning. Using this new cleaning technology, it was possible to obtain higher efficiency, higher productivity, and fast tact time for applying cleaning in the fields on bare ingot wafer, LED wafers as well as the solar cell wafer.

• 청정기술
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• 제17권2호
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• pp.117-123
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• 2011

본 연구에서는 중고 디지털 레이저 복합기의 재제조 과정에 초음파세정공정을 도입하기 위하여 예비실험을 통하여 여러 가지 세정제의 세정성을 평가하고 초음파 세정공정의 공정 변수를 변화시키며 최적의 세정제와 공정변수를 도출하였다. 우선 기존에 현장에서 사용되어 지고 있던 세정제보다 세정효율이 뛰어나고 사용하기 좋은 제품을 찾고자 기존 세정제 (A)와 시판되고 있는 7종의 세정제(B~H)를 선정하여 육안판정법을 이용한 오염물질(유성오일, 토너가루, 구두약)에 대한 세정성 평가를 수행하였다. 또한 선별과정으로 물성 명가 및 거품성 실험을 진행하였다. 각 오염물질에 대한 세정제의 세정성 평가에서 기존에 사용되어지던 A세정제보다 G세정제가 뛰어난 세정효율을 보여주었고, 거품성 평가에서 기존 세정제와 유사한 거품성을 나타내었다. 실제 오염된 레이저 복합기 부품들을 대상으로 예비실험에서 우수한 세정능력을 보여준 세정제를 사용하고 초음파 주파수와 세정시간을 변화시키며 최적 공정변수들을 도출하였다. 28 kHz의 초음파 세정을 이용하여 현장적용을 한 결과 G세정제가 A세정제보다 뛰어난 세정효율을 보여주어 디지털 레이저 복합기 재제조 과정에서의 세정제로서 G세정제가 적합하다고 판단되며 전체적인 재제조 공정의 생산성 및 경제성 향상이 기대된다.

• 한국의류학회지
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• 제23권7호
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• pp.987-997
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• 1999

The purpose of this study was finding out the appropriate cleaning method for buried fabrics from old tombs focusing on the conservation of textiles. Cleaning effects and physical properties change depending on cleaning method have been analysed, The following results were obtained from this study : 1. Wet cleaning showed better effect on the cleaning of fabrics compared to solvent cleaning which meant more water-soluble soils existed than oily soils. 2. All the cleaning methods used did not cause any distorsion or shrinkage to the fabrics because fabrics had been stabilized for a long time 3. Addition of detergent to cleaning system decreased the friction of fiber during cleaning rocess so that the damage of fabrics could be minimized., 4. Ironing is an undesirable process because heat remarkably weakened fibers.

• 반도체디스플레이기술학회지
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• 제2권3호
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• pp.1-6
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• 2003

In the rapid changes of the semiconductor manufacturing technologies for early 21st century, it may be safely said that a kernel of terms is the size increase of Si wafer and the size decrease of semiconductor devices. As the size of Si wafers increases and semiconductor device is miniaturized, the units of cleaning processes increase. A present cleaning technology is based upon RCA cleaning which consumes vast chemicals and ultra pure water (UPW) and is the high temperature process. Therefore, this technology gives rise to environmental issue. To resolve this matter, candidates of advanced cleaning processes have been studied. One of them is to apply the electrolyzed water. In this work, electrolyzed water cleaning was compared with various chemical cleaning, using Si wafer surfaces by changing cleaning temperature and cleaning time, and especially, concentrating upon the contact angle. It was observed that contact angle on surface treated with Electrolyzed water cleaning was $4.4^{\circ}$ without RCA cleaning. Amine series additive of high pKa (negative logarithm of the acidity constant) was used to observe the property changes of cathode water.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.45-50
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• 2020

We investigated the Si_1-xGe_x surface properties when dry cleaning the films using NF₃ / H₂O remote plasma. After the dry cleaning process, it was found that about 80-250 nm wide bumps were formed on the SiGe surface regardless of Ge concentration in the rage of x = 0.1 ~ 0.3. In addition, effects of the dry cleaning processing parameters such as pressure, substrate temperature, and H₂O flow rates were examined. It was found that the surface bump is significantly dependent on the flow rate of H₂O. Based on these observations, we would like to provide additional guidelines for implementing the dry cleaning process to SiGe materials.

• 상하수도학회지
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• 제25권2호
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• pp.177-184
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• 2011

Membrane fouling is an unavoidable phenomenon in operation of seawater reverse osmosis (SWRO) and major obstacle for economic and efficient operation. When fouling occurs on the membrane surface, the permeate flux is decreased, on the contrary, the trans-membrane pressure (TMP) is increased, therefore operation and maintaining costs and potential damage of membranes are able to the pivotal risks of the process. Chemical cleaning process is essential to prevent interruptions for effective RO membrane filtration process. This study focused on proper chemical cleaning condition for polyamide RO membranes of 4 companies. Several chemical agents were applied for chemical cleaning under numbers of operating conditions. Additionally, a monitoring tool of FEEM as autopsy analysis method is adapted for the prediction of organic bio-fouling.

• 청정기술
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• 제10권2호
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• pp.61-72
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• 2004

본 연구에서는 물성, 세정성, 헹굼액의 유수분리성을 고려하여 유기용매의 종류 및 함량, 계면활성제의 종류 및 함량, 부조계면활성제/계면활성제 (cosurfactant/surfactant, A/S) 비율 등의 변수로 하여 수계/준수계 세정제를 개발하였다. 개발된 세정제들은 대부분 평균 액적크기가 10 ~ 20 nm의 미세 나노입자를 형성 하였으며, 30.2~32.5 dyne/cm의 낮은 표면장력과 낮은 점도 값을 보여 주었다. 플럭스에 대한 용해력은 계면활성제의 소수성이 증가할수록 높게 나타났으며 terpene을 함유한 세정제들이 hydrocarbon 함유 세정제와 대응 시판세정제에 비해 우수한 용해력을 보여 terpene계 세정제가 대체세정제로의 적합성을 보여주었다. 또한, 개발된 세정제들을 함유한 헹굼액은 시판세정제에 비하여 우수한 유수분리성을 보여 헹굼액의 재활용이 가능하여 경제적인 부담과 수질오염을 줄일 수 있음을 보여주었다. 그리고 이렇게 개발된 세정제를 L 전자 회사의 전자부품 생산라인 SMT(surface mount technology) 세정공정에 적용시켜 보았다. 그 결과 solder cream 제거에 있어서 에탄올, 이소프로필알콜(IPA), glycol ether과 같은 물질이 함유된 기존의 세정제에 비하여 세정성능이 2 배이상 향상되었고 생산현장에서 악취와 VOC의 문제를 해결시킬 수 있었다.

• Korean Chemical Engineering Research
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• 제59권4호
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• pp.632-638
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• 2021

반도체 공정에서 구리 배선 공정의 도입에 따라 플라즈마 식각에 의해 배선의 형성과정에서 구리 산화물, 불화물 및 불화탄소 등을 포함한 복합 잔류물을 형성하게 된다. 본 연구에서는 아민기(-NH₂)와 카르복실기(-COOH)를 갖는 성분으로 세정액을 제조하여 구리 배선 공정에서의 식각 잔류물 제거 특성을 분석하였다. 아민기를 포함한 세정액은 질소에 치환된 성분 및 탄소결합의 길이에 따라 세정효과에 차이를 보이며, 세정액의 pH가 증가함에 따라 구리 산화물의 식각 속도가 증가하는 경향성을 보였다. 아민기의 활성은 염기성 영역에서, 카르복실기의 활성은 산성 영역에서 이루어지며, 각각의 영역에서 구리 또는 구리 산화물과의 complex 형성을 통하여 세정공정이 진행되었다.

• 한국막학회:학술대회논문집
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• 한국막학회 1999년도 Energy Saving Membrane Separtion Systems 에너지 절약형 막분리 시스템
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• pp.93-116
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• 1999

MF membrane element was specially designed for water purification and VSA process which can solve the fouling problem. Especially VSA process is developed for the SK Chemicals' asymmetric microfiltration hollow fiber membranes. In case of outside-to-in filtration process, MF membrane element showed the excellent flux stability caused by cleaning ability of VSA process . Simultaneous back-washing with VSA consideratbly enhances cleaning efficiency. From the result the possibility of the replacement of chemical coagulation and sand filtration process with newly developed VSA process was revealed.

• 한국막학회:학술대회논문집
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• 한국막학회 1999년도 The 7th Summer Workshop of the Membrane Society of Korea
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• pp.63-66
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• 1999

MF membrane element was specially designed for water purification and VSA process which can solve the fouling problem. Especially VSA process is developed for the SK Chemical's asymmetric microfiltration hollow fiber membranes. In case of outside-to-in filtration process, MF membrane element showed the excellent flux stability caused by cleaning ability of VSA process. Simultaneous back- washing with VSA considerably enhances cleaning efficiency. Form the result, the possibility of the replacement of chemical coagulation and sand filtration process with newly developed VSA process was revealed.