• Title/Summary/Keyword: Circuit noise

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8.2-GHz band radar RFICs for an 8 × 8 phased-array FMCW receiver developed with 65-nm CMOS technology

  • Han, Seon-Ho;Koo, Bon-Tae
    • ETRI Journal
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    • v.42 no.6
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    • pp.943-950
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    • 2020
  • We propose 8.2-GHz band radar RFICs for an 8 × 8 phased-array frequency-modulated continuous-wave receiver developed using 65-nm CMOS technology. This receiver panel is constructed using a multichip solution comprising fabricated 2 × 2 low-noise amplifier phase-shifter (LNA-PS) chips and a 4ch RX front-end chip. The LNA-PS chip has a novel phase-shifter circuit for low-voltage operation, novel active single-to-differential/differential-to-single circuits, and a current-mode combiner to utilize a small area. The LNA-PS chip shows a power gain range of 5 dB to 20 dB per channel with gain control and a single-channel NF of 6.4 dB at maximum gain. The measured result of the chip shows 6-bit phase states with a 0.35° RMS phase error. The input P1 dB of the chip is approximately -27.5 dBm at high gain and is enough to cover the highest input power from the TX-to-RX leakage in the radar system. The gain range of the 4ch RX front-end chip is 9 dB to 30 dB per channel. The LNA-PS chip consumes 82 mA, and the 4ch RX front-end chip consumes 97 mA from a 1.2 V supply voltage. The chip sizes of the 2 × 2 LNA-PS and the 4ch RX front end are 2.39 mm × 1.3 mm and 2.42 mm × 1.62 mm, respectively.

Ball Grid Array Solder Void Inspection Using Mask R-CNN

  • Kim, Seung Cheol;Jeon, Ho Jeong;Hong, Sang Jeen
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.2
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    • pp.126-130
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    • 2021
  • The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

SSPA Development of 100W Class in Ka-band (Ka대역 100 W급 SSPA 개발)

  • Seo, Mihui;Jeong, Hae-Chang;Na, Kyoung-Il;Kim, Sosu
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.22 no.6
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    • pp.129-135
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    • 2022
  • In this paper, a 100 W SSPA in Ka-band was developed by combining 16 GaN MMICs which were 10 W amplifiers, respectively. The gate voltage of SSPA was controlled to minimize the effect of SSPA noise on the receiver during the receiving time. And the transmit power could be reduced about 20 dB to prevent the receiver from being saturated by a large signal from a nearby target. At 10%, 40% duty rato, the peak power and the power efficiency at center frequency were measured 52.4 dBm, 19.2%, and 51.6 dBm, 16.6% respectively.

Long range-based low-power wireless sensor node

  • Komal Devi;Rita Mahajan;Deepak Bagai
    • ETRI Journal
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    • v.45 no.4
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    • pp.570-580
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    • 2023
  • Sensor nodes are the most significant part of a wireless sensor network that offers a powerful combination of sensing, processing, and communication. One major challenge while designing a sensor node is power consumption, as sensor nodes are generally battery-operated. In this study, we proposed the design of a low-power, long range-based wireless sensor node with flexibility, a compact size, and energy efficiency. Furthermore, we improved power performance by adopting an efficient hardware design and proper component selection. The Nano Power Timer Integrated Circuit is used for power management, as it consumes nanoamps of current, resulting in improved battery life. The proposed design achieves an off-time current of 38.17309 nA, which is tiny compared with the design discussed in the existing literature. Battery life is estimated for spreading factors (SFs), ranging from SF7 to SF12. The achieved battery life is 2.54 years for SF12 and 3.94 years for SF7. We present the analysis of current consumption and battery life. Sensor data, received signal strength indicator, and signal-to-noise ratio are visualized using the ThingSpeak network.

Four-channel GaAs multifunction chips with bottom RF interface for Ka-band SATCOM antennas

  • Jin-Cheol Jeong;Junhan Lim;Dong-Pil Chang
    • ETRI Journal
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    • v.46 no.2
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    • pp.323-332
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    • 2024
  • Receiver and transmitter monolithic microwave integrated circuit (MMIC) multifunction chips (MFCs) for active phased-array antennas for Ka-band satellite communication (SATCOM) terminals have been designed and fabricated using a 0.15-㎛ GaAs pseudomorphic high-electron mobility transistor (pHEMT) process. The MFCs consist of four-channel radio frequency (RF) paths and a 4:1 combiner. Each channel provides several functions such as signal amplification, 6-bit phase shifting, and 5-bit attenuation with a 44-bit serial-to-parallel converter (SPC). RF pads are implemented on the bottom side of the chip to remove the parasitic inductance induced by wire bonding. The area of the fabricated chips is 5.2 mm × 4.2 mm. The receiver chip exhibits a gain of 18 dB and a noise figure of 2.0 dB over a frequency range from 17 GHz to 21 GHz with a low direct current (DC) power of 0.36 W. The transmitter chip provides a gain of 20 dB and a 1-dB gain compression point (P1dB) of 18.4 dBm over a frequency range from 28 GHz to 31 GHz with a low DC power of 0.85 W. The P1dB can be increased to 20.6 dBm at a higher bias of +4.5 V.

Novel Design of 8T Ternary SRAM for Low Power Sensor System

  • Jihyeong Yun;Sunmean Kim
    • Journal of Sensor Science and Technology
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    • v.33 no.3
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    • pp.152-157
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    • 2024
  • In this study, we propose a novel 8T ternary SRAM that can process three logic values (0, 1, and 2) with only two additional transistors, compared with the conventional 6T binary SRAM. The circuit structure consists of positive and negative ternary inverters (PTI and NTI, respectively) with carbon-nanotube field-effect transistors, replacing conventional cross-coupled inverters. In logic '0' or '2,' the proposed SRAM cell operates the same way as conventional binary SRAM. For logic '1,' it works differently as storage nodes on each side retain voltages of VDD/2 and VDD, respectively, using the subthreshold current of two additional transistors. By applying the ternary system, the data capacity increases exponentially as the number of cells increases compared with the 6T binary SRAM, and the proposed design has an 18.87% data density improvement. In addition, the Synopsys HSPICE simulation validates the reduction in static power consumption by 71.4% in the array system. In addition, the static noise margins are above 222 mV, ensuring the stability of the cell operation when VDD is set to 0.9 V.

Design of Low-Noise and High-Reliability Differential Paired eFuse OTP Memory (저잡음 · 고신뢰성 Differential Paired eFuse OTP 메모리 설계)

  • Kim, Min-Sung;Jin, Liyan;Hao, Wenchao;Ha, Pan-Bong;Kim, Young-Hee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.10
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    • pp.2359-2368
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    • 2013
  • In this paper, an IRD (internal read data) circuit preventing the reentry into the read mode while keeping the read-out DOUT datum at power-up even if noise such as glitches occurs at signal ports such as an input signal port RD (read) when a power IC is on, is proposed. Also, a pulsed WL (word line) driving method is used to prevent a DC current of several tens of micro amperes from flowing into the read transistor of a differential paired eFuse OTP cell. Thus, reliability is secured by preventing non-blown eFuse links from being blown by the EM (electro-migration). Furthermore, a compared output between a programmed datum and a read-out datum is outputted to the PFb (pass fail bar) pin while performing a sensing margin test with a variable pull-up load in consideration of resistance variation of a programmed eFuse in the program-verify-read mode. The layout size of the 8-bit eFuse OTP IP with a $0.18{\mu}m$ process is $189.625{\mu}m{\times}138.850{\mu}m(=0.0263mm^2)$.

Design and Fabrication of the Cryogenically Cooled LNA Module for Radio Telescope Receiver Front-End (전파 망원경 수신기 전단부용 극저온 22 GHz 대역 저잡음 증폭기 모듈 설계 및 제작)

  • Oh Hyun-Seok;Lee Kyung-Im;Yang Seong-Sik;Yeom Kyung-Whan;Je Do-Heung;Han Seog-Tae
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.3 s.106
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    • pp.239-248
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    • 2006
  • In this paper, the cryogenically cooled low noise amplifier module for radio telescope receiver front-end using pHE-MT MMIC is designed and fabricated. In the selection of MMIC, the MMIC fabricated with the pHEMTS providing successful cryogenic operation are chosen. They are mounted in the housing using the thin film substrate. In the design of the housing, the absorber and the elimination of the gap between the carrier and the housing as well removed the unnecessary oscillations by its structure. The mismatch is improved by ribbon-tuning to provide the best performance at room temperature. The fabricated module shows the gain of $35dB{\pm}1dB$ and the noise figure of $2.37{\sim}2.57dB$ at room temperature over $21.5{\sim}23.5GHz$. In the cryogenic temperature of $15^{\circ}K$ cooled by He gas, the measured gain was above 35 dB and flatness ${\pm}2dB$ and the noise temperatures of $28{\sim}37^{\circ}K$.

A Study on the Pixel-Paralled Image Processing System for Image Smoothing (영상 평활화를 위한 화소-병렬 영상처리 시스템에 관한 연구)

  • Kim, Hyun-Gi;Yi, Cheon-Hee
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.39 no.11
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    • pp.24-32
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    • 2002
  • In this paper we implemented various image processing filtering using the format converter. This design method is based on realized the large processor-per-pixel array by integrated circuit technology. These two types of integrated structure are can be classify associative parallel processor and parallel process DRAM(or SRAM) cell. Layout pitch of one-bit-wide logic is identical memory cell pitch to array high density PEs in integrate structure. This format converter design has control path implementation efficiently, and can be utilize the high technology without complicated controller hardware. Sequence of array instruction are generated by host computer before process start, and instructions are saved on unit controller. Host computer is executed the pixel-parallel operation starting at saved instructions after processing start. As a result, we obtained three result that 1)simple smoothing suppresses higher spatial frequencies, reducing noise but also blurring edges, 2) a smoothing and segmentation process reduces noise while preserving sharp edges, and 3) median filtering, like smoothing and segmentation, may be applied to reduce image noise. Median filtering eliminates spikes while maintaining sharp edges and preserving monotonic variations in pixel values.

Accuracy Evaluation of the FinFET RC Compact Parasitic Models through LNA Design (LNA 설계를 통한 FinFET의 RC 기생 압축 모델 정확도 검증)

  • Jeong, SeungIk;Kim, SoYoung
    • Journal of the Institute of Electronics and Information Engineers
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    • v.53 no.11
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    • pp.25-31
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    • 2016
  • Parasitic capacitance and resistance of FinFET transistors are the important components that determine the frequency performance of the circuit. Therefore, the researchers in our group developed more accurate parasitic capacitance and resistance for FinFETs than BSIM-CMG. To verify the RF performance, proposed model was applied to design an LNA that has $S_{21}$ more than 10dB and center frequency more than 60GHz using HSPICE. To verify the accuracy of the proposed model, mixed-mode capability of 3D TCAD simulator Sentaurus was used. $S_{21}$ of LNA was chosen as a reference to estimate the error. $S_{21}$ of proposed model showed 87.5% accuracy compared to that of Sentaurus in 10GHz~100GHz frequency range. The $S_{21}$ accuracy of BSIM-CMG model was 56.5%, so by using the proposed model, the accuracy of the circuit simulator improved by 31%. This results validates the accuracy of the proposed model in RF domain and show that the accuracies of the parasitic capacitance and resistance are critical in accurately predicting the LNA performance.