• 한국정보전자통신기술학회논문지
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• 제11권6호
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• pp.742-750
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• 2018

본 논문에서는 $0.13{\mu}m$ BCD 공정 기반에서 5V MOS 소자만 사용하여 zero layer FTP 셀이 가능하도록 하기 위해 tunnel oxide 두께를 기존의 $82{\AA}$에서 5V MOS 소자의 gate oxide 두께인 $125{\AA}$을 그대로 사용하였고, 기존의 DNW은 BCD 공정에서 default로 사용하는 HDNW layer를 사용하였다. 그래서 제안된 zero layer FTP 셀은 tunnel oxide와 DNW 마스크의 추가가 필요 없도록 하였다. 그리고 메모리 IP 설계 관점에서는 designer memory 영역과 user memory 영역으로 나누는 dual memory 구조 대신 PMIC 칩의 아날로그 회로의 트리밍에만 사용하는 single memory 구조를 사용하였다. 또한 BGR(Bandgap Reference Voltage) 발생회로의 start-up 회로는 1.8V~5.5V의 전압 영역에서 동작하도록 설계하였다. 한편 64비트 FTP 메모리 IP가 power-on 되면 internal reset 신호에 의해 initial read data를 00H를 유지하도록 설계하였다. $0.13{\mu}m$ Magnachip 반도체 BCD 공정을 이용하여 설계된 64비트 FTP IP의 레이아웃 사이즈는 $485.21{\mu}m{\times}440.665{\mu}m$($=0.214mm^2$)이다.

• Journal of electromagnetic engineering and science
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• 제6권2호
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• pp.135-145
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• 2006

This paper presents the theory, design, fabrication and characterization of the novel low actuation voltage capacitive shunt RF-MEMS switch using a corrugated membrane with HRS MEMS packaging. Analytical analyses and experimental results have been carried out to derive algebraic expressions for the mechanical actuation mechanics of corrugated membrane for a low residual stress. It is shown that the residual stress of both types of corrugated and flat membranes can be modeled with the help of a mechanics theory. The residual stress in corrugated membranes is calculated using a geometrical model and is confirmed by finite element method(FEM) analysis and experimental results. The corrugated electrostatic actuated bridge is suspended over a concave structure of CPW, with sputtered nickel(Ni) as the structural material for the bridge and gold for CPW line, fabricated on high-resistivity silicon(HRS) substrate. The corrugated switch on concave structure requires lower actuation voltage than the flat switch on planar structure in various thickness bridges. The residual stress is very low by corrugating both ends of the bridge on concave structure. The residual stress of the bridge material and structure is critical to lower the actuation voltage. The Self-alignment HRS MEMS package of the RF-MEMS switch with a $15{\Omega}{\cdot}cm$ lightly-doped Si chip carrier also shows no parasitic leakage resonances and is verified as an effective packaging solution for the low cost and high performance coplanar MMICs.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2004년도 ICCAS
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• pp.956-959
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• 2004

Recently the monitoring system of tool setting in high speed precision machining center is required for manufacturing products that have highly complex and small shape, high precision and high function. It is very important to reduce time to setup tool in order to improve the machining precision and the productivity and to protect the breakage of cutting tool as the shape of product is smaller and more complex. Generally, the combination of errors that geometrical clamping error of fixing tool at the spindle of machining tool and the asynchronized error of driving mechanism causes that the run-out of tool reaches to 3$^{\sim}$20 times of the thickness of cutting chip. And also the run-out is occurred by the misalignment between axis of tool shank and axis of spindle and spindle bearing in high speed rotation. Generally, high speed machining is considered when the rotating speed is more than 8,000 rpm. At that time, the life time of tool is reduced to about 50% and the roughness of machining surface is worse as the run-out is increased to 10 micron. The life time of tool could be increased by making monitoring of tool-setup easy, quick and precise in high speed machining tool. This means the consumption of tool is much more reduced. And also it reduces the manufacturing cost and increases the productivity by reducing the tool-setup time of operator. In this study, in order to establish the concept of tool-setup monitoring the measuring method of the geometrical error of tool system is studied when the spindle is stopped. And also the measuring method of run-out, dynamic error of tool system, is studied when the spindle is rotated in 8,000${\sim}$60,000 rpm. The dynamic phenomena of tool-setup are analyzed by implementing the monitoring system of rotating tool system and the non-contact measuring system of micro displacement in high speed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1223-1227
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• 2005

Fine microgroove is the key component to fabricate micro-grating, micro-grating lens and so on. Conventional groove fabrication methods such as etching and lithography have some problems in efficiency and surface integrity. This study deals with the creation of ultra-precision micro grooves using non-rotational diamond tool and CNC machining center. The shaping type machining method proposed in the study allows to produce V-shaped grooves of $40\mu{m}$ in depth with enough dimensional accuracy and surface. For the analysis of machining characteristics in micro V-grooving, three components of cutting forces and AE signal are measured and processed. Experimental results showed that large amplitude of cutting forces and AE appeared at the beginning of every cutting path, and cutting forces had a linear relation with the cross-sectional area of uncut chip thickness. From the results of this study, proposed micro V-grooving technique could be successfully applied to forming the precise optical parts like prism patterns on light guide panel of TFT-LCD.

• Journal of Welding and Joining
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• 제30권2호
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• pp.65-69
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• 2012

Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.

• 한국재료학회지
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• 제13권1호
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• pp.18-23
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• 2003

Properties of Ag thick films fabricated by using low temperature curable silver pastes were investigated. Ag pastes were consisted of polymer resins and silver powders. Ag pastes were used for conductive or fixing materials between board and various electrical and electronic devices. Low temperature curable Ag pastes have some advantages over high temperature curable types. In cases of chip mounting, soldering properties were required for screen printed Ag thick films. In this study, four types of Ag pastes were fabricated with different compositions. Screen printed Ag thick films on alumina substrates were fabricated at various curing temperatures and times. Thickness, resistivity, adhesive strength and solderability of fabricated Ag thick films were characterized. Finally, Ag thick films produced using Ag pastes, sample A and B, cured at $150^{\circ}C$ for longer than 6 h and $180^{\circ}C$ for longer than 2 h, and $150^{\circ}C$ for longer than 1 h and $180^{\circ}C$ for 1 h, respectively, showed low resistivities of $10^{-4}$ $∼10^{-5}$ Ωcm and good adhesive strength of 1∼5 Mpa. Soldering properties of those Ag thick films with curing temperatures at solder of 62Sn/36Pb/3Ag were also investigated.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.1066-1069
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• 2004

Recently the monitoring system of tool setup in high speed precision machining tool is required for manufacturing products that have highly complex and small shape, high precision and high function. It is very important to reduce time to setup tool in order to improve the machining precision and productivity and to protect the breakage of cutting tool as the shape of product is smaller and more complex. Generally, the combination of errors that geometrical clamping error of fixing tool at the spindle of machining center and the asynchronized error of driving mechanism causes that the run-out of tool reaches to 3∼20 times of the thickness of cutting chip. And also the run-out is occurred by the misalignment between axis of tool shank and axis of spindle and spindle bearing in high speed rotation. Generally, high speed machining is considered when the rotating speed is more than 8,000 rpm. At that time, the life time of tool is reduced to about 50％ and the roughness of machining surface is worse as the run-out is increased to 10 micron. The life time of tool could be increased by making monitoring of tool-setting easy, quick and precise in high speed machining center. This means the consumption of tool is much more reduced. And also it reduces the manufacturing cost and increases the productivity by reducing the tool-setup time of operator. In this study, in order to establish the concept of tool-setting monitoring the measuring method of the geometrical error of tool system is studied when the spindle is stopped. And also the measuring method of run-out, dynamic error of tool system, is studied when the spindle is rotated in 8,000 ∼ 60,000 rpm. The dynamic phenomena of tool-setup is analyzed by implementing the monitoring system of rotating tool system and the noncontact measuring system of micro displacement in high speed.

• 한국정보통신학회논문지
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• 제16권4호
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• pp.759-764
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• 2012

고밀도집적을 위하여 전기도금과 무전해도금법을 적용하여 구리기둥주석범프(CPTB)를 제작하고, 그 특성을 분석하였다. CPTB는 ${\sim}100{\mu}m$의 피치를 갖도록 KM-1250 건식감광필름(DFR)을 사용하여 먼저 구리기둥범프(CPB)를 도금 전착시킨 다음, 구리의 산화억제를 위하여 그 위에 주석을 무전해 도금하였다. 열-압력에 따른 산화효과와 접합특성을 위하여 전기저항계수와 기계적 층밀림 전단강도를 측정하였다. 전기저항계수는 산화두께의 증가에 따라서 증가하였고, 전단강도는 $330^{\circ}C$에서 500 N의 열-압력일 때 최고치를 나타냈다. 시뮬레이션 결과에 따르면, CPTB는 시간이 경과됨에 따라 통전면적의 크기 감소의 결과를 나타냈으며, 그것은 구리의 산화에 의해 크게 영향을 받는 것으로 확인되었다.

• Journal of Microbiology and Biotechnology
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• 제16권12호
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• pp.1968-1976
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• 2006

Recombinant E. coli ACV 1003 (recA:: lacZ) was used to measure low concentrations of DNA-damaging chemicals, which produce $\beta$-galactosidase via an SOS regulon system. Very low $\beta$-galactosidase activities of less than 0.01 unit/ml, $\beta$-galactosidase produced through an SOS response corresponding to the 10 ng/ml (ppb) of DNA damaging chemicals in the environment, can be rapidly determined by using an alternative interferometric biosensor with optically flat thin films of porous silicon rather than by the conventional time-consuming Miller's enzyme assay as well as the ELISA method. fu order to enhance the sensitivity in the interferometry, it needs to obtain more uniform distribution and higher biolinking efficiency, whereas interferometric sensing is rapid, cheap, and advantageous in high throughput by using a multiple-well-type chip. In this study, pore size adjusted to 60 nm for the target enzyme $\beta$-galactosidase to be bound on both walls of a Si pore and a calyx crown derivative was apllied as a more efficient biolinker. Furthermore, anti-$\beta$-galactosidase was previously functionalized with the biolinker for the target $\beta$-galactosidase to be specifically bound. When anti-$\beta$-galactosidase was bound to the calyx-crown derivative-linked surface, the effective optical thickness was found to be three times as high as that obtained without using anti-$\beta$-galactosidase. The resolution obtained was very similar to that afforded by the time-consuming ELISA method; however, the reproducibility was still unsatisfactory, below 1 unit $\beta$-galactosidase/ml, owing to the microscopic non-uniform distribution of the pores in the etched silicon surface.

• Asian-Australasian Journal of Animal Sciences
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• 제25권1호
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• pp.17-21
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• 2012

The purpose of this study was to improve mapping power and resolution for the QTL influencing carcass quality in Hanwoo, which was previously detected on the bovine chromosome (BTA) 6. A sample of 427 steers were chosen, which were the progeny from 45 Korean proven sires in the Hanwoo Improvement Center, Seosan, Korea. The samples were genotyped with the set of 2,535 SNPs on BTA6 that were imbedded in the Illumina bovine 50 k chip. A linkage disequilibrium variance component mapping (LDVCM) method, which exploited both linkage between sires and their steers and population-wide linkage disequilibrium, was applied to detect QTL for four carcass quality traits. Fifteen QTL were detected at 0.1% comparison-wise level, for which five, three, five, and two QTL were associated with carcass weight (CWT), backfat thickness (BFT), longissimus dorsi muscle area (LMA), and marbling score (Marb), respectively. The number of QTL was greater compared with our previous results, in which twelve QTL for carcass quality were detected on the BTA6 in the same population by applying other linkage disequilibrium mapping approaches. One QTL for LMA was detected on the distal region (110,285,672 to 110,633,096 bp) with the most significant evidence for linkage (p< $10^{-5}$). Another QTL that was detected on the proximal region (33,596,515 to 33,897,434 bp) was pleiotrophic, i.e. influencing CWT, BFT, and LMA. Our results suggest that the LDVCM is a good alternative method for QTL fine-mapping in detection and characterization of QTL.