• Journal of the Korean Institute of Telematics and Electronics S
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• v.35S no.9
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• pp.9-18
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• 1998

A single RF transceiver chip for an extended GSM handset application was designedm, fabricated and evaluated. A RFIC was fabricated by using silicon BiCMOS process, and then packaged in 80 pin TQFP of $10 {\times} 10 mm^{2}$ in size. As a result, it was achieved guite reasonable integraty and good RF performance at the operation voltage of 3.3V. This paper describes development results of RF receiver section of the RFIC, which includes LNA, down conversion mixer, AGC, switched capacitor filter and down sampling mixer. The test results show that RF receiver section is well operated within frequency range of 925 ~960 MHz, which is defined on the extended GSM specification (E-GSM). The receiver section also reveals moderate power consumption of 67 mA and minimum detectable signal of -105 dBm.

• Journal of the Korean Institute of Intelligent Systems
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• v.22 no.1
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• pp.87-93
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• 2012

In this paper, we proposed a faulty pattern detection algorithm of TCP(Tape Carrier Package)/COF(Chip On Film), and implemented a real-time system for inspecting TCP/COF. Since TCP/COF has very high resolution having several micro meters, the human operator should visually inspect all the parts through microscope. In this work, we implement an inspection system to detect the faulty pattern, so the operator can visually inspect only the designated parts by the inspection system through the monitor. The proposed defects detection algorithm for TCP/COF packages is implemented by the pattern matching method based on subtracting the reference image from test image. To evaluate performance of the proposal system. we made various experiments according to type of CCD camera and light source as well as illumination projection method. From experimental results, it is confirmed that the proposed system makes it possible to detect effectively the defective TCP/COF film.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.44 no.3
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• pp.23-30
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• 2007

RFID it reads information which is it writes, the semiconductor chip for and the radio frequency system which uses the hazard antenna it has built-in transmission of information it talks. Formation which is transmitted like this collection and America which it filtrates wey the RFID search service back to inform the location of the server which has commodity information which relates with an object past record server. The hazard where measurement analysis result the leader for electronic interference does not occur consequently together from with verification test the power level which is received from the antenna grade where it stands must maintain minimum -55dBm and the electronic interference will not occur with the fact that, antenna and reel his recognition distance the maximum 7m until the recognition which is possible but smooth hazard it must stand and and with the fact that it will do from within and and and 3-4m it must be used Jig it is thought.

• Journal of IKEEE
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• v.14 no.3
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• pp.190-198
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• 2010

This paper describes a auto focus piezo actuator driver IC for portable digital camera. The 80[V] DC voltage is generated by a DC-DC converter and supplied to power of piezo moving control circuit. The voltage of piezo actuator needs range -20[V] to 80[V] proportional to 1[Vp-p] input control voltages. The dimensions and number of external parts are minimized in order to get a smaller hardware size. IIC(Inter-IC) interface logic is designed for data interface and it makes debugging easy, test for mass productions. The power consumption is around 40[mW] with supply voltage of 3.6[V]. This device has been fabricated in a 0.6[um] double poly, triple metal 100[V] BCD MOS process and whole chip size is 1600*1500 [$um^2$].

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.21-28
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• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.1093-1096
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• 2003

본 논문에서는, CMOS APS Image Sensor 내에 포함되어 회로의 면적을 줄인 새롭게 제안된 CMOS Bandgap Reference Bias Generator (BGR)를 온도 및 방사능에 대한 응답을 실험하였다. 제안된 BGR 회로의 설계 목표는 V/sub DD/는 2.5V이상이고, V/sub ref/는 0.75V ± 0.5mV 마진을 가지게 하는 것이다. 제안된 BGR회로는 Level Shifter를 갖는 Differential OP-amp단과 Feedback-Loop를 가지는 Cascode Current Mirror를 사용하여 저전압에서도 동작을 가능하게 하였으며, 높은 출력저항 특성을 가지도록 하였다. 제안된 BGR회로는 하이닉스 0.18㎛ ( triple well two-poly five-metal ) CMOS 공정을 이용하여 Test Chip을 제작하였다. 온도의 변화와 Co-60 노출조건 하에서 Total ionization dose (TID) effect된 BGR회로의 V/sub ref/를 측정하여, 이를 평가하였다. 온도에 대한 반응은, 25℃ 일 때의 V/sub ref/에 대해, 각각 45 ℃에서 0.128%. 70℃에서 0.768% 변화하였다. 그리고 온도가 25℃일 때 50krad와 100krad의 방사능을 조사 하였을 경우, V/sub ref/는 각각 2.466%, 그리고 4.612% 변화하였다.

• Journal of the Korean Institute of Telematics and Electronics T
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• v.36T no.4
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• pp.115-122
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• 1999

The Y2K bug, what is called "millennium bug" or "2000 year bug", take place because the year after 2000 year is not recognize as the year marking method of the computer designed for take up two-digit number. This takes place because the RTC chip architecture of PC can not change the century information to the operating together with date. In this paper, we make an analysis about Y2K hardware bug of RTC in the IBM compatible PC, and make a Y2K compensation board in order to solve Y2K hardware bug. And the test results by various Y2K diagnosis program is bug before put in Y2K compensation board, but is not bug after put in Y2K compensation board. Therefore, we suggest a solution method for Y2K hardware bug of RTC in the IBM compatible PC.

• Asian Pacific Journal of Cancer Prevention
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• v.17 no.3
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• pp.879-894
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• 2016

In micro-fluid systems, fluids are injected into extremely narrow polymer channels in small amounts such as micro-, nano-, or pico-liter scales. These channels themselves are embedded on tiny chips. Various specialized structures in the chips including pumps, valves, and channels allow the chips to accept different types of fluids to be entered the channel and along with flowing through the channels, exert their effects in the framework of different reactions. The chips are generally crystal, silicon, or elastomer in texture. These highly organized structures are equipped with discharging channels through which products as well as wastes of the reactions are secreted out. A particular advantage regarding the use of fluids in micro-scales over macro-scales lies in the fact that these fluids are much better processed in the chips when they applied as micro-scales. When the laboratory is miniaturized as a microchip and solutions are injected on a micro-scale, this combination makes a specialized construction referred to as "lab-on-chip". Taken together, micro-fluids are among the novel technologies which further than declining the costs; enhancing the test repeatability, sensitivity, accuracy, and speed; are emerged as widespread technology in laboratory diagnosis. They can be utilized for monitoring a wide spectrum of biological disorders including different types of cancers. When these microchips are used for cancer monitoring, circulatory tumor cells play a fundamental role.

• Journal of IKEEE
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• v.19 no.3
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• pp.440-446
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• 2015

This study has examined susceptibility of LNA(Low Noise Amplifier) due to Front-Door Coupling under Narrow-Band high power electromagnetic wave. M/DFR(Malfunction/Destruction Failure Rate) was measured to investigate the diagnostic of IC test. In addition, decapsulation analysis was used to understand the inside of the chip state in LNA devices. The experiments is employed as an open-ended waveguide to study the destruction effects of LNA using a 2.45 GHz Magnetron as a high power electromagnetic wave. The susceptibility level of LNA was assessed by electric field strength, and its failure modes were observed. The malfunction of LNA device has showed as the type of self-reset and power-reset. The electric field strength of malfunction threshold is 524 V/m and 1150 V/m respectively. Also, he electric field of destruction threshold is 1530 V/m. Three types of damaged LNA were observed by decapsulation analysis: component, onchipwire, and bondwire destruction. Based on these results, the susceptibility of the LNA can be applied to a database to help elucidate the effects of microwaves on electronic equipment.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.1
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• pp.49-58
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• 1999

This paper describes an integrated low pass filter fabricated by using $0.8{\mu}m$ single poly CMOS ASIC technology. The filter has been designed for a 5th-order elliptic switched capacitor filter with cutoff frequency of 5khz, 0.1dB passband ripple. The filter consists of MOS swiches poly capacitors and five CMOS op-amps. For the realization of the SC filter, continuous time transfer function H(s) is obtained from LC passive type, and transfered as discrete time transfer H(z) through bilinear-z transform. Another filter has been designed by capacitor scaling for reduced chip area, considering dynamic range of the op-amp. The test results of two fabricated filters are cutoff frequency of 4.96~4.98khz, 35~38dB gain attenuation and 0.72~0.81dB passband ripple with the ${\pm}2.5V$power supply clock of 50KHz.