1 |
S. M. Cho. S. Y. Cho and B. Han, "Observing Real-Time Thermal Deformations in Electronic Packaging", Experimental Techniques, 26(3), 25 (2002).
DOI
ScienceOn
|
2 |
S. J. Ham and S. B. Lee, "Measurement of Creep and Relaxation Behaviors of Wafer-level CSP Assembly Using Moire Interferometry", J. Electronic Packaging, Trans. of the ASME, 125(2), 282 (2003).
DOI
ScienceOn
|
3 |
L. Anand, "Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Tempertures", ASME Journal of Engineering Material Technology, 104(1), 12 (1982).
DOI
ScienceOn
|
4 |
E. Madenci, I. Guven and B. Kilic, Fatigue Life Predictions of Solder Joints in Electronic Packagrs with ANSYS, Kluwer Academic Publishers (2003).
|
5 |
F. Feustel, S. Wiese and E. Meusel, "Time-Dependent Material Modeling for Finite Element Analyses of Flip Chips", Proc. Electronic Components and Technology Conference, IEEE (2000).
|
6 |
J. Kang, N. Choi, J. Won, J. Choi and J. Joo, "An Inverse approach for material characterization of lead-free solder in Accelerated Thermal Cycling test of microelectronics package", 5th China-Japan-Korea Joint Symposium on optimization of structural and mechanical systems (2008).
|
7 |
J. W. Joo, S. Cho and B. Han, "Characterization of Flexural and Thermo- mechanical Behavior of Plastic Ball Grid Array Package Assembly Using Moire Interferometry", Micrelectronics Reliability, 45(4), 637 (2005).
DOI
ScienceOn
|
8 |
D. Pollack and B. Han, "Experimental Validation of Unified Constitutive Model of Eutectic Solder", Proc. of Society for Experimental Mechanics (2003).
|
9 |
J. W. Joo and D. H. Kim, "Thermo-mechanical Deformation Analysis of Flip Chip PBGA Packages subjected to Temperature Change", J. Microelectron. Packag. Soc., 13(4), 17 (2006).
과학기술학회마을
|
10 |
J. S. Corbin, "Finite Element Analysis for Solder Ball Connect(SBC) Structural design Optimization", IBM J. Research Development, 37(5), 585 (1993).
DOI
|
11 |
T. Lee and L. Jung, "Finite Element Analysis for Solder Ball Failures in Chip Scale Packages", Microelectronics and Reliability, 38(2), 1941 (1998).
DOI
ScienceOn
|
12 |
S. C. Chen, Y. C. Lin and C. H. Cheng, "The Numerical Analysis of Strain Behavior at the Solder Joint and Interface in a Flip Chip Package", J. Materials Processing Technology, 171(1), 125 (2006).
DOI
ScienceOn
|
13 |
J. W. Joo and N. J. Choi, "The Effect of Finite Element Models in Thermal Analysis of Electronic Packages", Trans. of the KSME(A), 33(4), 380 (2009).
과학기술학회마을
DOI
|
14 |
B. Han, "Recent Advancements of Moire and Microscopic MoireInterferometry for Thermal Deformation Analysis of Microelectronics Devices", Experimental Mechanics, 38(4), 278 (1998).
|
15 |
J. W. Joo, "Thermo-mechanical Behavior of Wire Bonding PBGA Packages with Different Sdder Ball Grid Patterns", J. Microelectron Packag. Soc., 16(2), 11 (2009).
과학기술학회마을
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