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Elastoplastic Behavior and Creep Analysis of Solder in a FC-PBGA Package  

Choi, Nam-Jin (Department of Mechanical Engineering, Chungbuk National University)
Lee, Bong-Hee (Department of Mechanical Engineering, Chungbuk National University)
Joo, Jin-Won (Department of Mechanical Engineering, Chungbuk National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.2, 2010 , pp. 21-28 More about this Journal
Abstract
Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.
Keywords
FC-PBGA package; Thermal deformation analysis; Finite element model; Viscoplastic analysis; Creep analysis; Moir$\acute{e}$ interferometry;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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