• KIEE International Transactions on Electrophysics and Applications
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• 제4C권4호
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• pp.145-148
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• 2004

In this study, a DNA chip with a microelectrode array was fabricated using microfabrication technology. Several probe DNAs consisting of mercaptohexyl moiety at their 5' end were immobilized on the gold electrodes by a DNA arrayer. Then target DNAs were hybridized and reacted with Hoechst 33258, which is a DNA minor groove binder and electrochemically active dye. Linear sweep voltammetry or cyclic voltammetry showed a difference between target DNA and control DNA in the anodic peak current values. It was derived from Hoechst 33258 and concentrated at the electrode surface through association with the formed hybrid. This suggested that this DNA chip could recognize the sequence specific genes.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 C
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• pp.2125-2127
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• 2004

In this paper, a DNA chip with a microelectrode array was fabricated using microfabrication technology. Several probe DNAs consisting of mercaptohexyl moiety at their 5 end were immobilized on the gold electrodes by DNA arrayer. Then target DNAs were hybridized and reacted with Hoechst 33258, which is a DNA minor groove binder and electrochemically active dye. Linear sweep voltammetry or cyclic voltammetry showed a difference between target DNA and control DNA in the anodic peak current values. It was derived from Hoechst 33258 concentrated at the electrode surface through association with formed hybrid. It suggested that this DNA chip could recognize the sequence specific genes.

• ETRI Journal
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• 제32권2호
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• pp.327-329
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• 2010

A fully integrated small form-factor HBT power amplifier (PA) was developed for UMTS Tx applications. For practical use, the PA was implemented with a well configured bottom dimension, and a CMOS control IC was added to enable/disable the HBT PA. By using helix-on-pad integrated passive device output matching, a chip-stacking technique in the assembly of the CMOS IC, and embedding of the bulky inductive lines in a multilayer substrate, the module size was greatly reduced to 2 mm ${\times}$ 2.2 mm. A stage-bypass technique was used to enhance the efficiency of the PA. The PA showed a low idle current of about 20 mA and a PAE of about15% at an output power of 16 dBm, while showing good linearity over the entire operating power range.

• 산업기술연구
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• 제22권A호
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• pp.89-94
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• 2002

In this paper, a Exhaust Flow Controller (EFC) technology for uniform application of film coater and developer device is introduced that spread and remove photo resister at semiconductor manufacturing process. Because developed EFC device uses differential pressure sensing method as a differential flow meter and embodied smart A/D conversion by using a one chip microprocessor and devised by feedback Servo control, It has shown excellent performance and stability evaluation, as maximum 2000L/min flow, capability of installation to actual semiconductor equipment.

• ETRI Journal
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• 제36권3호
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• pp.343-351
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• 2014

For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable.

• BMB Reports
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• 제35권5호
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• pp.532-535
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• 2002

To establish a method to evaluate the quality of the printed microarray and DNA fragments' immobilization. The target gene fragments that were made with the restriction display PCR (RD-PCR) technique were printed on a superamine modified glass slide, then immobilized with UV cross-linking and heat. This chip was hybridized with universal primers that were labeled with cy3-dUTP, as well as cDNA that was labeled with cy3-dCTP, as the conventional protocol. Most of the target gene fragments on the chip showed positive signals, but the negative control showed no signal, and vice versa. We established a method that enables an effective evaluation of the quality of the microarrays.

• 한국산업안전학회:학술대회논문집
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• 한국안전학회 2000년도 추계 학술논문발표회 논문집
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• pp.39-45
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• 2000

In recent years, composite materials such as fiber reinforced plastics (FRP) have gained considerable attention in the aircraft and automobile industries due to their light weight, high modulus and specific strength. In practice, control of chip formation appears to be the most serious problem since chip formation mechanism in composite machining has significant effects on the finished surface ［1,2,3,4,5］. Current study will discuss frequency analysis based on autoregressive (AR) time series model and process characterization in orthogonal cutting of a fiber-matrix composite materials. A sparsely distributed idealized model composite material, namely a glass reinforced polyester (GFRP) was used as workpiece. Analysis method employs a force sensor and the signals from the sensor are processed using AR time series model. The experimental correlation between the different chip formation mechanisms and model coefficients are established.(omitted)

• 전기학회논문지P
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• 제58권2호
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• pp.142-147
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• 2009

Conventional HP(high pressure) sodium or Metal-halide lamps have a life span of around one year requiring at least annual replacement and maintenance. High Power LED lights require no regular maintenance further increasing savings on replacement bulbs, access equipment and labour costs. New installations benefit from a substantial reduction in the cost of expensive heavy duty cable required for sodium lighting. Especially, LED light can achieve variable color temperature, high functional performance in the field of street light. There are two main method to achieve variable color temperature function of the street light. one method is using RGB multi-chip LED, the other is using Orange-White LED method. In this paper, it was compare RGB Multi-chip LED with white-orange LED for there characteristics performance.

• 한국조명전기설비학회지:조명전기설비
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• 제3권2호
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• pp.63-68
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• 1989

정지형 전원(Static Power Supply) 설계를 위한 다중 PAM 인버터에 관하여 논한다. 인버터의 제어부는 원칩 마이크로 컴퓨터(One-chip Microcomputer)로 구성하여 간단히 제어신호를 얻었고, 종단 구성은 더블 브리지 인버터와 3상 3권선 변압기로 구성하였다. 출력 파형은 제어기와 변압기를 이용하여 1주기당 22 스텝의 전압레벨로 다중 PAM파형을 합성하였으며, 저역 여파기(Low Pass Filter)에 의해 정현파에 가까운 파형을 얻었다.

• 천문학회지
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• 제29권spc1호
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• pp.381-383
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• 1996

A new CCD camera equipped with a large format chip is now under construction for the Kiso 105-cm Schmidt telescope. We use SITe TK2048E, of which pixel size is 24 ${\mu}m$ and chip size is 48 mm square. TK2048E is thinned back-illuminated so that it has high sensitivity in U-band. The chip is cooled by a refrigerator instead of liquid nitrogen. MESSIA III is used as CCD control system.