Browse > Article
http://dx.doi.org/10.4218/etrij.14.0113.0570

Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life  

Eom, Yong-Sung (Components & Materials Research Laboratory, ETRI)
Son, Ji-Hye (Components & Materials Research Laboratory, ETRI)
Jang, Keon-Soo (Department of Macromolecular Science and Engineering, Case Western Reserve University)
Lee, Hak-Sun (Components & Materials Research Laboratory, ETRI)
Bae, Hyun-Cheol (Components & Materials Research Laboratory, ETRI)
Choi, Kwang-Seong (Components & Materials Research Laboratory, ETRI)
Choi, Heung-Soap (Department of Mechanical & Design Engineering, Hongik University)
Publication Information
ETRI Journal / v.36, no.3, 2014 , pp. 343-351 More about this Journal
Abstract
For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable.
Keywords
Flip chip; underfill; micro-encapsulated catalyst; MEC; latent; pot life;
Citations & Related Records
Times Cited By KSCI : 8  (Citation Analysis)
연도 인용수 순위
1 Y.-S. Eom et al., "Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive," ETRI J., vol. 33, no. 6, Dec. 2011, pp. 864-870.   DOI
2 K.-S. Choi et al., "Novel Bumping Material for Solder-on-Pad Technology," ETRI J., vol. 33, no. 4, Aug. 2011, pp. 637-640.   DOI
3 K.-S. Choi et al., "Novel Maskless Bumping for 3D Integration," ETRI J., vol. 32, no. 2, Apr. 2010, pp. 342-344.   DOI
4 K.-J. Sung et al., "Novel Bumping and Underfill Technologies for 3D IC Integration," ETRI J., vol. 34, no. 5, Oct. 2012, pp. 706-712.   DOI   ScienceOn
5 Y.-S. Eom et al., "Optimization of Material and Process for Fine Pitch LVSoP Technology," ETRI J., vol. 35, no. 4, Aug. 2013, pp. 625-631.   DOI   ScienceOn
6 X. Zhang et al., "Latent Curing Agent Modified Epoxy Sizing Agent for High Modulus Carbon Fiber," The Open Mater. Sci. J., vol. 5, 2011, pp. 104-108.   DOI
7 J.-K. Lee et al., "Cationic Cure of Epoxy Resin by an Optimum Concentration of N-benzylpyrazinium Hexafluoroantimonate," Macromolecular Res., vol. 10, no. 1, Feb. 2002, pp. 34-39.   DOI   ScienceOn
8 M.-J. Shin et al., "Microencapsulation of Imidazole Curing Agents by Spray-Drying Method Using W/O Emulsion," J. Appl. Polymer Sci., vol. 126, no. S2, Nov. 25, 2012, pp. 108-115.   DOI   ScienceOn
9 Y.-R. Ham et al., "Microencapsulation of Imidazole Curing Agent for Epoxy Resin," J. Ind. Eng. Chemistry, vol. 16, no. 5, Sept. 25, 2010, pp. 728-733.   DOI   ScienceOn
10 K.P. Pang and J.K. Gillham, "Competition between Cure and Thermal Degradation in a High Tg Epoxy System: Effect of Time and Temperature of Isothermal Cure on the Glass Transition Temperature," J. Appl. Polymer Sci., vol. 39, no. 4, Feb. 20, 1990, pp. 909-933.   DOI
11 S.C. Johnson, "Flip-Chip Packaging Becomes Competitive," Semiconductor Int., May 2009.
12 Y.-S. Eom et al., "Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder," ETRI J., vol. 32, no. 3, June 2010, pp. 414-421.   DOI
13 Y.-S. Eom et al., "Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film," Microelectron. Eng., vol. 85, no. 2, Feb. 2008, pp. 327-331.   DOI   ScienceOn
14 K.-S. Choi et al., "Novel Bumping Process for Solder On Pad Technology," ETRI J., vol. 35, no. 2, Apr. 2013, pp. 340-343.   DOI   ScienceOn
15 J.-W. Baek et al., "Chemo-rheological Characteristic of a Selfassembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder," Microelectron. Eng., vol. 87, no. 10, Oct. 2010, pp. 1968-1972.   DOI   ScienceOn
16 K.-S. Jang et al., "Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing," J. Nanosci. Nanotechnol., vol. 9, no. 12, Dec. 2009, pp. 7461-7466.