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Electronics and Telecommunications Research Institute (한국전자통신연구원)
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Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life

  • Eom, Yong-Sung (Components & Materials Research Laboratory, ETRI) ;
  • Son, Ji-Hye (Components & Materials Research Laboratory, ETRI) ;
  • Jang, Keon-Soo (Department of Macromolecular Science and Engineering, Case Western Reserve University) ;
  • Lee, Hak-Sun (Components & Materials Research Laboratory, ETRI) ;
  • Bae, Hyun-Cheol (Components & Materials Research Laboratory, ETRI) ;
  • Choi, Kwang-Seong (Components & Materials Research Laboratory, ETRI) ;
  • Choi, Heung-Soap (Department of Mechanical & Design Engineering, Hongik University)
  • Received : 2013.06.14
  • Accepted : 2013.11.21
  • Published : 2014.06.01
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Abstract

For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable.

Keywords

References

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