• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.2
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• pp.149-155
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• 2016

The purpose of this study is to develop special tools used to extend the tool life for the boom of heavy equipment. The boom of heavy equipment is manufactured by cutting the inner and outer surface with respect to the assembly site essential. In particular, when cutting the inner surface, entry of the tool is difficult owing to the limited size of the inner diameter and non circular cutting. In addition, the productivity is poor because the use of the cutting tool made of the SKH material. Therefore, it is necessary to develop a special tool for machining heavy equipment boom to extend tool life and to improve productivity. The special tool developed this study has the form of a holder and tip. The tip was created by applying a commercially available tungsten carbide insert.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2407-2409
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• 2005

본 논문에서는 다양한 생물분자 감지를 위한 센서로 마이크로캔틸레버를 제안하였고 이것을 이용해 여러 생물 분자들을 광학적, 전기적으로 분석하였다. 마이로캔틸레버는 표면 미세 가공 기술로 제작되었고, 이러한 제작 방식은 공정이 간단하고 비용이 적게 들며 센서 array가 가능하다는 장점을 갖는다. 생물분자를 포함하는 용액을 주입하기 위하여 PDMS와 fused silica glass를 이용해 fluid cell system을 제작하였다. 마이크로캔틸레버 상단의 gold가 코팅된 부분에서 생물분자의 자기조립 (self assembly)현상이 일어나고 이는 마이크로캔틸레버 상, 하단의 표면 스트레스 차이를 야기 시킨다. 이로 인해 마이크로캔틸레버 자체의 휘어짐 현상이 일어나게 되고 이러한 휘어진 정도를 측정함으로써 마이크로캔틸레버의 생물분자 감지능을 확인할 수 있었다. Cystamine dihydrochloride와 glutaraldehyde 분자를 분석하였고 각기 다른 농도의 cystamine dihydrochloride 용액에서도 실험함으로써 농도별 감지능 또한 확인하였다. 이러한 생물분자 감지를 위한 마이크로캔틸레버의 센서로써의 성능은 u-TAS 와 lab-on-a-chip에서 유용히 이용될 수 있으리라 확신한다.

• Journal of Microbiology and Biotechnology
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• v.13 no.2
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• pp.317-320
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• 2003

Genome-wide systematic deletion mutants were generated using a PCR-based targeted mutagenesis of Schizosacchaaromyces pombe. In a drug-sensitivity assay using thiabendazole(TBZ), an inhibitor of microtubule assembly, a heterozygous nda2 mutant ($nda2^+/nda2^-$), deleting one copy of nda2 encoding the microtubule subunit alpha1 demonstrated a distinct sensitivity to TBZ, indicating TBZ-induced haploinsufficiency. This result suggests that profiling drug-induced haploinsufficiency can be exploited to identify target genes for drugs and discover new drugs.

• Proceedings of the KOSOMBE Conference
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• v.1996 no.05
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• pp.260-265
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• 1996

The purpose of this study was to implemented a general purpose programmable nerve stimulator system as a research tool for studying psychophysiological performance associated with various stimulation waveform. This system is composed of hardware and software, the former are the personal computer(180586) and control unit(one-chip microprocessor, D/A converter, digital output), the latter are programmed in VISUAL BASIC and ASSEMBLY Which are programmed for the programmable nerve stimuli pattern editor and communication interface, waveform preprocessing, and stimuli generator. The control unit which is entrolled by the personal computer is capable of delivering the programmable nerve stimuli waveform. This system has research potential for determining the effect of various neuromuscular blockade in alternated physiological stat is.

• The Transactions of the Korea Information Processing Society
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• v.6 no.12
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• pp.3662-3674
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• 1999

This paper addresses some design issues for establishing the optimal number of spare units in array systems manufactured using fault-tolerant multichip modules(MCM's) for massively parallel computing(MPC). We propose a new quantitative approach to an optimal cost-effective MCM system design under yield and reliability constraints. In the proposed approach, we analyze the effect of residual redundancy on operational reliability of fault-tolerant MCM's. In particular, the issues of imperfect support circuitry, chip assembly yield and array topology are investigated. Extensive parametric results for the analysis are provided to show that our scheme can be applied to design ways using MCM's for MPC applications more efficiently, subject to yield and reliability constraints.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.3
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• pp.699-707
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• 2016

This paper proposes a low-complexity central processing unit (CPU) that is suitable for deeply embedded systems, including Internet of things (IoT) applications. The core features a 16-bit instruction set architecture (ISA) that leads to high code density, as well as a multicycle architecture with a counter-based control unit and adder sharing that lead to a small hardware area. A co-processor, instruction cache, AMBA bus, internal SRAM, external memory, on-chip debugger (OCD), and peripheral I/Os are placed around the core to make a system-on-a-chip (SoC) platform. This platform is based on a modified Harvard architecture to facilitate memory access by reducing the number of access clock cycles. The SoC platform and CPU were simulated and verified at the C and the assembly levels, and FPGA prototyping with integrated logic analysis was carried out. The CPU was synthesized at the ASIC front-end gate netlist level using a $0.18{\mu}m$ digital CMOS technology with 1.8V supply, resulting in a gate count of merely 7700 at a 50MHz clock speed. The SoC platform was embedded in an FPGA on a miniature board and applied to deeply embedded IoT applications.

• Journal of Sensor Science and Technology
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• v.7 no.4
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• pp.263-270
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• 1998

Surface Plasmon Resonance (SPR) sensor system, has rapid response and high sensitivity, can be applicable for detecting reaction times of many biospecific interactions. A SPR sensor system was constructed to detect the antigen-antibody reactions of salmonella and hIgG (human immunoglobulin G). Sensor chips made of gold thin film were used for detecting biological bindings of antigen and antibody reactions. The antigen and antibody reactions for salmonella and hIgG were carried out with various time intervals to observed characteristics of these reactions using SPR sensor system. The resonance angle shift changes were clearly observed at the time of salmonella or hIgG antibody injection into sample cell since each antibody was self-assembled on gold chip surface of the sensor. It was found that the antibodies of salmonella and hIgG reacted with its sensor chip surface in 10 minutes and 60 minutes respectively. And the antigens of both salmonella and hIgG were bound to its antibody within 1 minute.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.503-509
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• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.12
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• pp.261-267
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• 2020

The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).

• Journal of electromagnetic engineering and science
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• v.18 no.3
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• pp.188-198
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• 2018

In this study, we propose an approach for the design and satisfy the requirements of the fabrication of a small, lightweight, reliable, and stable ultra-wideband receiver for millimeter-wave bands and the contents of the approach. In this paper, we designed and fabricated a stable receiver with having low noise figure, flat gain characteristics, and low noise characteristics, suitable for millimeter-wave bands. The method uses the chip-and-wire process for the assembly and operation of a bare MMIC device. In order to compensate for the mismatch between the components used in the receiver, an amplifier, mixer, multiplier, and filter suitable for wideband frequency characteristics were designed and applied to the receiver. To improve the low frequency and narrow bandwidth of existing products, mathematical modeling of the wideband receiver was performed and based on this spurious signals generated from complex local oscillation signals were designed so as not to affect the RF path. In the ultra-wideband receiver, the gain was between 22.2 dB and 28.5 dB at Band A (input frequency, 18-26 GHz) with a flatness of approximately 6.3 dB, while the gain was between 21.9 dB and 26.0 dB at Band B (input frequency, 26-40 GHz) with a flatness of approximately 4.1 dB. The measured value of the noise figure at Band A was 7.92 dB and the maximum value of noise figure, measured at Band B was 8.58 dB. The leakage signal of the local oscillator (LO) was -97.3 dBm and -90 dBm at the 33 GHz and 44 GHz path, respectively. Measurement was made at the 15 GHz IF output of band A (LO, 33 GHz) and the suppression characteristic obtained through the measurement was approximately 30 dBc.