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C. H. Toh, Mehta Gaurav, Tan Hua Hong and P. L. Ong Wilson, "Die attach adhesives for 3D same-sized dies stacked packages," Proc. of 58th Electronic Components and Technology Conference, Lake Buena Vista, FL, pp. 1538-1543. 2008. DOI: https://doi.org/10.1109/ECTC.2008.4550180
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M. Lee, Y. Lin, P. Pan, Y. Lin and C. Lin, "Film over wire (FOW) selection for copper wire application," Proc. of 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, pp. 306-309, 2013. DOI: https://doi.org/10.1109/IMPACT.2013.6706662
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C. L. Chung, C. W. Ku, H. C. Hsu and S. L. Fu, "Comparison between die attach film (DAF) and film over wire (FOW) on stack-die CSP application," Proc. of 2009 European Microelectronics and Packaging Conference, Rimini, pp. 1-3, 2009.
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Tee Swee Xian and P. P. Nanthakumar, "Dicing die attach challenges at multi die stack packages," Proc. of 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), Ipoh, pp. 1-5, 2012. DOI: https://doi.org/10.1109/IEMT.2012.6521797
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