• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.537-538
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• 2008

A step-down DC-DC converter with On-chip Compensation for battery-operated portable electronic devices which are designed in 0.18um CMOS standard process. In an effort to improve low load efficiency, this paper proposes the PFM (Pulse Frequency modulation) voltage mode 1MHz switching frequency step-down DC-DC converter with on-chip compensation. Capacitor multiplier method can minimize error amplifier compensation block size by 20%. It allows the compensation block of DC-DC converter be easily integrated on a chip and occupy less layout area. But capacitor multiplier operation reduces DC-DC converter efficiency. As a result, this converter shows maximum efficiency over 87% for the output voltage of 1.8V (input voltage : 3.3V), maximum load current 500mA, and 0.14% output ripple voltage. The total core chip area is $mm^2$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.10a
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• pp.404-407
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• 2011

This paper presents a design of current mode PWM/PFM DC-DC Boost converter. This DC-DC Boost Converter operates with PWM mode at the heavy loads and with PFM mode at light loads. The DC-DC boost converter is designed with CMOS 0.35${\mu}m$ technology. It operates at 500KHz and can drive a load current up to 600mA. It has a maximum power efficiency of 92.1%. The total chip area is $1300{\mu}m{\times}1070{\mu}m$ including pads. The DC-DC boost converter operates in a wide range of load currents while occupying a small chip area.

• IEIE Transactions on Smart Processing and Computing
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• v.4 no.2
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• pp.65-70
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• 2015

In this paper, we describe the world's first real-time ray-tracing chip architecture. Ray-tracing technology generates high-quality 3D graphics images better than current rasterization technology by providing four essential light effects: shadow, reflection, refraction and transmission. The real-time ray-tracing chip named RayChip includes a real-time ray-tracing graphics processing unit and an accelerating tree-building unit. An ARM Ltd. central processing unit (CPU) and other peripherals are also included to support all processes of 3D graphics applications. Using the accelerating tree-building unit named RayTree to minimize the CPU load, the chip uses a low-end CPU and decreases both silicon area and power consumption. The evaluation results with RayChip show appropriate performance to support real-time ray tracing in high-definition (HD) resolution, while the rendered images are scaled to full HD resolution. The chip also integrates the Linux operating system and the familiar OpenGL for Embedded Systems application programming interface for easy application development.

• Journal of Power Electronics
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• v.16 no.3
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• pp.1209-1217
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• 2016

This paper presents a novel charge pump scheme that combines the advantages of Fibonacci and Dickson charge pumps to obtain 30 V voltage for display driver integrated circuit application. This design only requires four external capacitors, which is suitable for a small-package application, such as smart card displays. High-amplitude (<6.6 V) clocks are produced to enhance the gate drive of a Dickson charge pump and improve the system's current drivability by using a voltage-doubler charge pump with a pulse skip regulator. This regulation engages many middle-voltage devices, and approximately 30% of chip size is saved. Further optimization of flying capacitors tends to decrease the total chip size by 2.1%. A precise and simple model for a one-stage Fibonacci charge pump with current load is also proposed for further efficiency optimization. In a practical design, its voltage error is within 0.12% for 1 mA of current load, and it maintains a 2.83% error even for 10 mA of current load. This charge pump is fabricated through a 0.11 μm 1.5 V/6 V/32 V process, and two regulators, namely, a pulse skip one and a linear one, are operated to maintain the output of the charge pump at 30 V. The performances of the two regulators in terms of ripple, efficiency, line regulation, and load regulation are investigated.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.4
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• pp.176-181
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• 2001

As the data rate between chip-to-chip gets high, the skin effect and load of pins deteriorate noise margin. With these, noise disturbances on the bus channel make it difficult for receiver circuits to read the data signal. This paper has proposed a new pre-emphasis driver circuit which achieves wide noise margin by enlarging the signal voltage range during data transition. When data is transferred from a memory chip to a controller, the output boltage of the driver circuit reaches the final values through the intermediate voltage level. The proposed driver supplies more currents applicable to a packet-based memory system, because it needs no additional control signal and realizes very small area. The circuit has been designed in a 0.18 ${\mu}m$ CMOS process, and HSPICE simulation results have shown that the data rate of 1.32 Gbps be achieved. Due to its result, the proposed driver can achieved higher speed than conventional driver by 10%.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.11
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• pp.108-116
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• 2013

The input buffer in Network on Chip (NoC) router plays a key role in on-chip-network performance, which is utilized in flow control and virtual channel. However, increase in area and power due to input buffers as the network size gets larger is becoming severe. To solve this problem, a bufferless deflection routing without input buffer was suggested. Since the bufferless deflection routing shows poor performance at high network load, other approaches which combine the deflection routing with small size side buffers were also proposed. Nonetheless these new methods still show deficiencies caused by frequent path collisions. In this paper, we propose a modified deflection routing technique using a location based priority. In comparison with existing deflection routers, experimental results show improvement by 12% in throughput with only 3% increase in area.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.34 no.7A
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• pp.568-573
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• 2009

This paper presents a step-down DC-DC converter with On-chip Compensation for battery-operated portable electronic devices which are designed in O.13um CMOS standard process. In an effort to decrease system volume, this paper proposes the on chip compensation circuit using capacitor multiplier method. Capacitor multiplier method can minimize error amplifier's compensation capacitor size by 10%. It allows the compensation block of DC-DC converter be easily integrated on a chip and occupy less layout area. But capacitor multiplier operation reduces DC-DC converter efficiency. As a result, this converter shows maximum efficiency over 87.2% for the output voltage of 1.2V (input voltage : 3.3V), maximum load current 500mA, and 25mA output ripple current. This voltage mode controled buck converter has 1MHz switching frequency.

• Korean Journal of Materials Research
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• v.5 no.8
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• pp.929-935
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• 1995

In order to develop COG (Chip On Glass) technology for LCD module interconnecting the driver IC to Al pad electrode on the glass substrate, Anisotropic Conductive Adhesive(ACA) process, the most promising one among COG technologies, was investigated. ACA process was carried out by two steps, dispensing of ACA resin in the bonding area and curing by W radiation. Load on the chip was ranged from 2.0 to 15kg and the chip was heated at about 12$0^{\circ}C$. In resin, the density of conductive particles coated with Au or Ni at the surface were 500, 1000, 2000 and 4000 particles/$\textrm{mm}^2$, and the diameter of particles were 5, 7 and 12${\mu}{\textrm}{m}$. As a result of the experiments, ACA process using ACA particle of diameter and density of 5${\mu}{\textrm}{m}$ and 4000 particles/$\textrm{mm}^2$ respectively shows optimum characteristic with the stabilzed bonding properties and contact resistance.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.4
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• pp.318-330
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• 2013

This paper presents a high-linearity low-noise small-size programmable gain amplifier (PGA) based on a new low-noise low-distortion differential amplifier and a proposed reconfiguration technique. The proposed differential amplifier combines an inverter-based differential pair with an adaptive biasing circuit to reduce noise and distortion. The reconfiguration technique saves the chip size by half by utilizing the same differential pair for the input transconductance and load-stage, interchangeably. Fabricated in $0.18-{\mu}m$ CMOS, the proposed PGA shows a dB-linear control range of 21dB in 16 steps from -11 dB to 10 dB with a gain error of less than ${\pm}0.33$ dB, an IIP3 of 7.4~14.5 dBm, a P1dB of -7~1.2 dBm, a noise figure of 13dB, and a 3-dB bandwidth of 270MHz at the maximum gain, respectively. The PGA occupies a chip area of $0.04mm^2$ and consumes only 1.3 mA from the 1.8 V supply.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.6
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• pp.697-705
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• 2014

A single chip Programmable AC to DC Power Converter, consisting of wide band gap SiC MOSFET and SiC diodes, has been proposed which converts high frequency ac voltage to a conditioned dc output voltage at user defined given power level. The converter has high conversion efficiency because of negligible reverse recovery current in SiC diode and SiC MOSFET. High frequency operation reduces the need of bigger size inductor. Lead inductors are enough to maintain current continuity. A complete electrical analysis, die area estimation and thermal analysis of the converter has been presented. It has been found that settling time and peak overshoot voltage across the device has reduced significantly when SiC devices are used with respect to Si devices. Reduction in peak overshoot also increases the converter efficiency. The total package substrate dimension of the converter circuit is only $5mm{\times}5mm$. Thermal analysis performed in the paper shows that these devices would be very useful for use as miniaturized power converters for load currents of up to 5-7 amp, keeping the package thermal conductivity limitation in mind. The converter is ideal for voltage requirements for sub-5 V level power supplies for high temperatures and space electronics systems.