• Journal of Sensor Science and Technology
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• v.20 no.1
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• pp.19-24
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• 2011

Brain disorders such as epilepsy is a condition that affects an estimated 2.7 million Americans, 50,000,000 worldwide, approximately 200,000 new cases of epilepsy are diagnosed each year. Of the major chronic medical conditions, epilepsy is among the least understood. Scientists are conducting research to determine appropriate treatments, such as the use of drugs, vagus nerve stimulation, brain stimulation, and Peltier chip-based focal cooling. However, brain stimulation and Peltier chip-based stimulation processes cannot effectively stop seizures. This paper presents simulation of a novel heat enchanger network(HEN) technique designed to stop seizures by using a neural cooling probe to stop focal and spontaneous seizures by cooling the brain. The designed probe was composed of a U-shaped tube through which cold fluid flowed in order to reduce the temperature of the brain. The simulation results demonstrated that the neural probe could cool a 7 $mm^2$ area of the brain when the fluid was flowing atb a velocity of 0.55 m/s. It also showed that the neural cooling probe required 23 % less energy to produce cooling when compared to the Peltier chip-based cooling system.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.334-343
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• 2003

The discharge gap clearly is to order and to promote the improvement of processing feature of die-sinking electro discharge machining(EDM). If creation carbon, which generated by Pyrolysis of EDM oil and processing pace power which is generated in between an electrode and a workpiece, are overproduced, they will lower the processing speed and roughness of the surface. Therefore, it is gone through an experiment and the flow analysis of EDM oil in order to improve the treatment of processing chips, which is an important problem by contriving a new flushing method. The condition of an electric discharge is not considered to be a progressing of processing. It is assumed that the flow of processing fluid is equal to the flow of processing chip, which is remaining in the discharge gap, and thus, analyzing then comparing with the data of the experiment and investigate its correlation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1206-1209
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• 2005

In recent, injection molding process for features in sub-micron scale is under active development as patterning nano-scale features, which can provide the master or stamp for molding, and becomes available around the world. Injection molding has been one of the most efficient processes for mass production of the plastic product, and this process is already applied to nano-technology products successfully such as optical storage media like DVD or BD which is a large area plastic thin substrate with nano-scale features on its surface. Bio chip for like DNA sequencing may be another application of this plastic substrate. The DNA can be sequenced using order of 100 nm pore structure when making the DNA flow through the pore structure. Agarose gel and silicon based chip have been used to sequence the DNA, but injection molded plastic chip may have benefit in terms of cost. This plastic DNA sequencing chip has plenty of pillars in order of 100 nm in diameter on the substrate. When the usual features in case of DVD or BD have very low aspect ratio, even less than 0.5, but the DNA chip will have relatively high aspect ratio of about 2. It is not easy to injection mold the large area thin substrate with sub-micron features on its surface due to the characteristics of the molding process and it becomes much more difficult when the aspect ratio of the features becomes high. We investigated the effect of the molding parameters for injection molding with high aspect ratio nano-scale features and injection molded some plastic DNA sequencing chips. We also fabricated PR masters and Ni stamps of the DNA chip to be used for molding

• Journal of the Optical Society of Korea
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• v.10 no.3
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• pp.130-142
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• 2006

Lab-on-a-chip technology is attracting great interest because the miniaturization of reaction systems offers practical advantages over classical bench-top chemical systems. Rapid mixing of the fluids flowing through a microchannel is very important for various applications of microfluidic systems. In addition, highly sensitive on-chip detection techniques are essential for the in situ monitoring of chemical reactions because the detection volume in a channel is extremely small. Recently, a confocal surface enhanced Raman spectroscopic (SERS) technique, for the highly sensitive biological analysis in a microfluidic sensor, has been developed in our research group. Here, a highly precise quantitative measurement can be obtained if continuous flow and homogeneous mixing condition between analytes and silver nano-colloids are maintained. Recently, we also reported a new analytical method of DNA hybridization involving a PDMS microfluidic sensor using fluorescence energy transfer (FRET). This method overcomes many of the drawbacks of microarray chips, such as long hybridization times and inconvenient immobilization procedures. In this paper, our recent applications of the confocal Raman/fluorescence microscopic technology to a highly sensitive lab-on-a-chip detection will be reviewed.

• Applied Science and Convergence Technology
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• v.24 no.5
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• pp.196-202
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• 2015

Human blood consists of 55% of plasma and 45% of blood cells such as white blood cell (WBC) and red blood cell (RBC). In plasma, there are many kinds of promising biomarkers, which can be used for the diagnosis of various diseases and biological analysis. For diagnostic tools such as a lab-on-a-chip (LOC), blood plasma separation is a fundamental step for accomplishing a high performance in the detection of a disease. Highly efficient separators can increase the sensitivity and selectivity of biosensors and reduce diagnostic time. In order to achieve a higher yield in blood plasma separation, we propose a novel fluid wing structure that is optimized by COMSOL simulations by varying the fluidic channel width and the angle of the bifurcation. The fluid wing structure is inspired by the inertial particle separator system in helicopters where sand particles are prevented from following the air flow to an engine. The structure is ameliorated in order to satisfy biological and fluidic requirements at the micro scale to achieve high plasma yield and separation efficiency. In this study, we fabricated the fluid wing structure for the efficient microfluidic blood plasma separation. The high plasma yield of 67% is achieved with a channel width of $20{\mu}m$ in the fabricated fluidic chip and the result was not affected by the angle of the bifurcation.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.286-289
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• 2003

We investigated the influence of the properties of substrate material on the separation efficiency in microchip electrophoresis. We fabricated the various microchips and studied separation efficiency in microchannels composed of a single material such as quartz, glass, polydimethylsiloxane (PDMS), and polymethylmetha crylate (PMMA), as well as hybrid micro channels composed of different materials. New fabrication process for glass chip was suggested and some treatment is added to improve fabrication process in other chip. Separation efficiency was compared by measuring migration times and bandwidths of EOF and analytes in each microchip. The efficiency is the function of migration time, which is affected by the electroosmotic flow (EOF), and bandwidth of an analyte. EOF is highly dependent upon the characteristics of a microchannel wall surface. Migration time was more reproducible in silica chips than that of PDMS chip and more band broadening was observed in the microchip composed of hybrid material due to non-uniformity of surface charge density at the walls of the channel.

• ETRI Journal
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• v.35 no.6
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• pp.1152-1155
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• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.4
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• pp.320-329
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• 2007

Electrokinesis and dielectrophoresis are important transport phenomena produced by external electric field applied to a microchannel containing a conductive fluid. We developed a CFD code to predict electrokinetic and dielectrophoretic flows in a microchannel with a uniform circular post array. Using the code, we calculated particle velocities driven by electrokinesis and dielectrophoresis, and conducted Monte Carlo simulations to visualize the particle motions. The code was validated by comparing the results with those from previous studies in literature. At a low electric field, electrokinesis and diffusion is the dominant transport mechanism. At a moderate electric field, dielectrophoresis is balanced with electrokinesis and diffusion, resulting in flowing filaments of particles in the microchannels. However, dielectrophoresis overwhelms the flow at a high electric field and traps particles locally. These results provide useful insight for optimizing design parameters of a microfluidic chip for biochemical analysis, especially for development of on-chip sample pretreatment techniques using electrokinetic and dielectrophoretic effects.

• Journal of information and communication convergence engineering
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• v.14 no.4
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• pp.258-267
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• 2016

Three-dimensional integrated circuits (3D ICs) experience die-to-die variations in addition to the already challenging within-die variations. This adds an additional design complexity and makes variation estimation and full-chip optimization even more challenging. In this paper, we show that the industry standard on-chip variation (AOCV) tables cannot be applied directly to 3D paths that are spanning multiple dies. We develop a new machine learning-based model and methodology for an accurate variation estimation of logic paths in 3D designs. Our model makes use of key parameters extracted from existing GDSII 3D IC design and sign-off simulation database. Thus, it requires no runtime overhead when compared to AOCV analysis while achieving an average accuracy of 90% in variation evaluation. By using our model in a full-chip variation-aware 3D IC physical design flow, we obtain up to 16% improvement in critical path delay under variations, which is verified with detailed Monte Carlo simulations.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.06a
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• pp.481-484
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• 2007

This paper presents a method of constructing the system-on-chip(SoC) based on embedded systems. The proposed method is more compact and effectiveness than former methods. The requirements generation start high level performance simulation and then passes to an executable specification suitable for implementation using a hardware/software co-design tool. The reuse of pre-exiting components is supported, as well as synthesis of the system interface, but only after much work is done to program the hardware/software co-design tool. The actual design flow described allows feedback among all design levels, e.g. from implementation up to requirements, throughout the process. In the future, it is necessary to development the advanced method of constructing system-on-chip based on embedded systems.