• Journal of the Korea Institute of Information and Communication Engineering
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• v.25 no.11
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• pp.1581-1587
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• 2021

As embedded system are used widely and variously, multi-edge system, which multiple edges gather and perform complex operations together, is actively operating. In a multi-edge system, it often occurs that an abnormal operation at one edge is transferred to another edge or the entire system goes down. It is necessary to determine and control edge anomalies in order to prevent system down, but this can be a heavy burden on the resource-limited edge. As a solution to this, we use power consumption data to check the state of the edge device and transmit it based on a QRcode to check and control errors at the server. The architecture proposed in this paper is implemented using 'chip-whisperer' to measure the power consumption of the edge and 'Raspberry Pi 3' to implement the server. As a result, the proposed architecture server showed successful data transmission and error determination without additional load appearing at the edge.

• Korean Journal of Materials Research
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• v.34 no.3
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• pp.170-174
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• 2024

In this study, we report the microstructural evolution and shear strength of an Sn-Sb alloy, used for die attach process as a solder layer of backside metal (BSM). The Sb content in the binary system was less than 1 at%. A chip with the Sn-Sb BSM was attached to a Ag plated Cu lead frame. The microstructure evolution was investigated after die bonding at 330 ℃, die bonding and isothermal heat treatment at 330 ℃ for 5 min and wire bonding at 260 ℃, respectively. At the interface between the chip and lead frame, Ni₃Sn₄ and Ag₃Sn intermetallic compounds (IMCs) layers and pure Sn regions were confirmed after die bonding. When the isothermal heat treatment is conducted, pure Sn regions disappear at the interface because the Sn is consumed to form Ni₃Sn₄ and Ag₃Sn IMCs. After the wire bonding process, the interface is composed of Ni₃Sn₄, Ag₃Sn and (Ag,Cu)₃Sn IMCs. The Sn-Sb BSM had a high maximum shear strength of 78.2 MPa, which is higher than the required specification of 6.2 MPa. In addition, it showed good wetting flow.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.109-109
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• 2017

알지네이트 하이드로 젤은 해조류에서 추출되는 천연 고분자인 알지네이트가 칼슘 또는 마그네슘 양이온과 이온가교(Ioninc cross linking)를 형성할 때 알지네이트의 고분자 구조가 칼슘, 마그네슘 양이온을 감싸면서 형성되는 고분자이다. 알지네이트 하이드로 젤은 높은 생체적합성(Biocompatibility)으로 인해 세포 재생을 위한 조직공학 및 재생의학, 약물전달 등의 제약 관련 분야에 광범위하게 적용될 수 있는 물질로 많은 연구가 이루어지고 있다. 본 연구에서는 마이크로 플루이딕 칩을 이용하여 알지네이트 튜브를 제조하였다. 먼저 유동 포커싱 방식(flow focussing)을 유도할 수 있는 PDMS(Polydimethylsiloxane) 마이크로 플루이딕 칩을 제조하였다. 마이크로 플루이딕 칩은 CNC(Computer Numeric Control) milling machine을 이용한 template를 만들고 NOA mold를 이용하여 최종 PDMS 칩을 제작하였다. 튜브를 만들기 위한 마이크로 채널은 내부 채널 ($200{\times}200um$), 중간 채널 ($200{\times}200um$) 및 외부 채널 ($200{\times}200um$)로 구성되며 내부, 중간, 외부의 유체가 합류하는 수집채널은 폭 500 um, 깊이 200 um로 구성되었다. 운반체로는 5%의 acetic acid를 함유한 mineral oil를 이용하였으며 내부의 core flow는 $H_2O$로 하였다. 중간 유체인 2% 알지네이트 프리폴리머는 칼슘 이온의 존재 하에서 젤화 과정이 매우 빠르기 때문에 마이크로 채널 내부에서의 반응을 제어하고 막힘을 방지하기 위해 수용성 복합 칼슘-에틸렌 디아민 테트라 아세트산 (EDTA)을 사용하였다. 본 마이크로 플루이딕 칩에 각각의 유체를 이동시켰을 때, 운반체인 oil phase의 수소이온은 중간 유체인 알지네이트 프리폴리머와의 계면을 통해 확산되어 Ca-EDTA 복합체로부터 칼슘 양이온의 방출을 유발하게 된다. 방출된 칼슘 양이온은 알지네이트 고분자와의 이온 가교를 통해 알지네이트 하이드로 젤을 형성하여, 각 유체의 flow에 따라 알지네이트 튜브를 쉽고 빠르게 제조 가능하였다. 본 연구에서 제조된 알지네이트 튜브는 인체 내 장기간 약물 전달을 위한 나노섬유로 활용하거나 인공혈관을 구성하는 extracellular matrix로 활용될 잠재력을 가지고 있어 추후 활발한 연구개발이 진행될 예정이다.

• Journal of the Semiconductor & Display Technology
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• v.7 no.1
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• pp.1-5
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• 2008

In this paper, we fabricated pressure difference type gas flow sensor using only dry etching technology by ICP-RIE(inductive coupled plasma reactive ion etching). The sensor's structure consists of a common shear stress type piezoresistive pressure sensor with an orifice fabricated in the middle of the sensor diaphragm. Generally, structure like diaphragm is fabricated by wet etching technology using TMAH, but we fabricated diaphragm by only dry etching using ICP-RIE. To equalize the thickness of diaphragm we applied insulator($SiO_2$) layer of SOI(Si/$SiO_2$/Si-sub) wafer as delay layer of dry etching. Size of fabricated diaphragm is $1000{\times}1000{\times}7\;{\mu}m^3$ and overall chip $3000{\times}3000{\times}7\;{\mu}m^3$. We measured the variation of output voltage toward the change of gas pressure to analyze characteristics of the fabricated sensor. Sensitivity of fabricated sensor was relatively high as about 1.5mV/V kPa at 1kPa full-scale. Nonlinearity was below 0.5%F.S. Over-pressure range of the fabricated sensor is 100kPa or more.

• Journal of the Institute of Electronics Engineers of Korea SP
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• v.43 no.4 s.310
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• pp.55-65
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• 2006

Most of fast block motion estimation algorithms reported so far in literatures aim to reduce the computation in terms of the number of search points, thus do not fit well with multimedia processors due to their irregular data flow. For multimedia processors, proper reuse of data is more important than reducing number of absolute difference operations because the execution cycle performance strongly depends on the number of off-chip memory access. Therefore, in this paper, we propose a Hexagon-shape line search (HEXSLS) algorithm using line search pattern which can increase data reuse from on-chip local buffer, and check sub-sampling points in line search pattern to reduce unnecessary SAD operation. Our experimental results show that the prediction error (MAE) performance of the proposed HEXSLS is similar to that of the full search block matching algorithm (FSBMA), while compared with the hexagon-based search (HEXBS), the HEXSLS outperforms. Also the proposed HEXSLS requires much lesser off-chip memory access than the conventional fast motion estimation algorithm such as the hexagon-based search (HEXBS) and the predictive line search (PLS). As a result, the proposed HEXSLS algorithm requires smaller number of execution cycles on media processor.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.11
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• pp.688-694
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• 2018

The mixture ratio of two-component liquid silicone is important for the inherent physical characteristics of the finished product. Therefore, it is necessary to uniformly control the ratio of the main material and the sub-material. In this paper, a mixing-ratio control system was designed, which consists of a digital flow meter and a flow control system to measure the flow rate of the raw materials and a pumping system to maintain constant pressure and transfer of the raw materials. In addition, a program was developed to control the organic interlocking and mixing ratio. For the verification of the developed system, we compared the actual weight of raw material with the value measured by the flow meter during pumping, and we measured the physical properties of the mixed material by making test samples with and without the application of the mixing-ratio improvement algorithm. The measured value was close to the reference value with a hardness range of 46-47 and tensile strength of 9.3-9.5 MPa. These results show that the mixing ratio of the liquid silicone is controlled within an error range of ${\pm}0.5%$.

• Korean Journal of Optics and Photonics
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• v.26 no.3
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• pp.168-171
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• 2015

The heat flow characteristics of a high-power optical semiconductor source have been analyzed using a 3D CFD commercial tool, and the thermal resistance values for each of the layers revealed the places for thermal bottlenecks to be improved. As the heat source of a LD (Laser Diode) has a small volume and a narrow surface, the effective thermal cross-sectional area near it is also quite small. It was possible to expand the cross-sectional area effectively by using graphene layers on the TIM (Thermal Interface Material) layers of a LD chip. The effective values of heat resistance for the layers are compared to confirm the improvement effect of the graphene layers before and after, which can be considered to expand the thermal cross section of the heat transfer path.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.2
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• pp.858-867
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• 2013

Hardware and software field are developed by environment of MPSOC. Also it is still working with economic world and academic world. This study focus on software side and try to classify from parallel programming design world. It can be divided by three; Data, Tasks, and Data flow model. Then we used Petri Net to CUDA and HOPES programmer and found how much they understand parallel programming for each side. We focus on two sides and what is different between their experience. Petri Net is easy to descript parallel program or parallel design pattern for Task, Data, and Hybird. This research can explain how they know and how much they know about parallel programming.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.7
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• pp.1497-1501
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• 2005

Branch instructions which make the sequential instruction flow changed cause pipeline stalls in microprocessor. The pipeline hazard due to branch instructions are the most serious problem that degrades the performance of microprocessors. Branch target buffer predicts whether a branch will be taken or not and supplies the address of the next instruction on the basis of that prediction. If the hanch target buffer predicts correctly, the instruction flow will not be stalled. This leads to the better performance of microprocessor. In this paper, the architecture of a ta8 memory that branch target buffer and TLB can share is presented. Because the two tag memories used for branch target buffer and TLB each is replaced by single combined tag memory, we can expect the smaller chip size and the faster prediction. This shared tag architecture is more advantageous for the microprocessors that uses more bits of address and exploits much more instruction level parallelism.

• Journal of Welding and Joining
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• v.28 no.6
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• pp.35-39
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• 2010

Generally, ceramic material is very difficult to machine due to high strength and hardness. However, ceramic material can be machined at high temperature by plastic flow as metallic material due to the deterioration of the grain boundary glassy phase. Recently, a new method was developed to execute cutting process with CBN cutting tool by local heating of surface with laser. There are various parameters in LAM because it is a complex process with laser treatment and machining. During laser assisted machining, high power results in reducing of cutting force and increasing tool life, but excessive power brings oxidation of the surface. The effect of laser power, feed rate, cutting depth and etc. were investigated on the life of cutting tool. Chips were observed to find out suitable machining conditions. Chips of SSN had more flow-types than HIPSN. It means SSN is easier to machining. The life of cutting tool was increased with increasing laser power and decreasing feed rate and cutting depth.