• Journal of Advanced Marine Engineering and Technology
• /
• v.28 no.1
• /
• pp.46-55
• /
• 2004

Thermal characteristics of the various cooling methods in electronic equipment are studied numerically. A common chip cooling system is modeled as a parallel channel with protruding heat sources. A two-dimensional model has been developed for the numerical analysis of compressible. viscous. laminar flow. and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The assembly consists of two channels formed by two covers and one printed circuit board that is assumed to have three uniform heat source blocks. Various cooling methods are considered to find out the efficient cooling method in a given geometry and heat sources. The velocity and the temperature fields. the local temperature distribution along the surface of blocks. and the maximum temperature in each block are obtained. The results are compared to examine the thermal characteristics of the different cooling methods both quantitatively and qualitatively.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.15 no.8
• /
• pp.667-673
• /
• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.

• Journal of the Korean Society for Precision Engineering
• /
• v.10 no.4
• /
• pp.216-226
• /
• 1993

Three dimensional cutting is considered as an equivalent orthogonal cutting through the plane containing both the cutting velocity vector and the chip flow velocity vector in dynamic cutting process. An analytical expression of dynamic cutting force is obtained from the cutting parameters determined by the static cutting. Particular attention is paid to the energy supplied to the vibratory system of cutting tool with two degree of freedom. In this approach, the phase lag of the horizontal vibration of the tool behind the vertical vibration and the direction angle of the fluctuating cutting force is considered in point of stability limits. Chatter vibration can be effectively suppressed by relatively increasing the spring constant and the damping coefficient of the cutting system in the vertical cutting force direction. A good agreement is found between the stability limits predicted by theoretical value and experimental results.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.4
• /
• pp.71-76
• /
• 2015

Recently, light emitting diodes (LEDs) have been studied to improve their efficiencies for the uses in various fields. Particularly in the aspect of chip structure, via hole type vertical LED chip is developed for improvement of light output power, and heat dissipations. However, current vertical type LEDs have still drawback, which is current concentration around the n-contact holes. In this research, to solve this phenomenon, we introduced isolation layer under n-contact electrodes. With this sub-electrode, even though the active area was decreased by about 2.7% compared with conventional via-hole type vertical LED, we could decrease the forward voltage by 0.2 V and wall-plug efficiency was improved approximately 4.2%. This is owing to uniform current flow through the area of n-contact.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.39 no.12
• /
• pp.921-925
• /
• 2015

The number of people suffering from renal disease increases every year. One of the most common treatments (clinical care options) for renal diseases is hemodialysis. However it takes a long time and has a high cost. Therefore, the importance of artificial kidney research has risen. Filtering creatinine from blood is one of the prime renal functions. Thus, we designed a novel two channel microfluidic chip focused on that function. In order to bond the individual polydimethylsiloxane layers, we have developed a housing system using acrylic plastic frame. This method has significant advantages in changing filter membranes. We use anodic aluminum oxide for the filter membrane. We analyzed the difference in the absorbance values for various creatinine concentrations using the Jaffe reaction. For the purpose of acquiring a standard equation to quantify the creatinine concentration, we interpolated the measured data and confirmed the concentration of the filtered solution. Through this experiment, we determined how the filtration efficiency depended on the flow rate and creatinine concentration.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.5 no.2
• /
• pp.89-101
• /
• 2005

Research on highly abstracted system modeling and simulation has received a great deal of attention as of the concept of platform based design is becoming ubiquitous. From a practical design point of view, such modeling and simulation must consider the following: (i) fast simulation speed and cycle accuracy, (ii) early availability for early stage software development, (iii) inter-operability with external tools for software development, and (iv) reusability of the models. Unfortunately, however, all of the previous works only partially addresses the requirements, due to the inherent conflicts among the requirements. The objective of this study is to develop a new system design methodology to effectively address the requirements mentioned above. We propose a new transaction-level system modeling methodology, called ViP (Virtual Platform). We propose a two-step approach in the ViP method. In phase 1, we create a ViP for early stage software development (before RTL freeze). The ViP created in this step provides high speed simulation, lower cycle accuracy with only minor modeling effort.(satisfying (ii)). In phase 2, we refine the ViP to increase the cycle accuracy for system performance analysis and software optimization (satisfying (i)). We also propose a systematic ViP modeling flow and unified interface scheme based on utilities developed for maximizing reusability and productivity (satisfying (ii) and (iv)) and finally, we demonstrate VChannel, a generic scheme to provide a connection between the ViP and the host-resident application software (satisfying (iii)). ViP had been applied to several System-on-a-chip (SoC) designs including mobile applications, enabling engineers to improve performance while reducing the software development time by 30% compared to traditional methods.

• 전자공학회논문지 IE
• /
• v.48 no.2
• /
• pp.6-11
• /
• 2011

This paper describes the design of new method of propagation delay measurement in micro and nanostructures during characterization of ASIC standard library cell. Providing more accuracy timing information about library cell (NOR, AND, XOR, etc.) to the design team we can improve a quality of timing analysis inside of ASIC design flow process. Also, this information could be very useful for semiconductor foundry team to make correction in technology process. By comparison of the propagation delay in the CMOS element and result of analog SPICE simulation, we can make assumptions about accuracy and quality of the transistor's parameters. Physical implementation of phase error accumulation method(PHEAM) can be easy integrated at the same chip as close as possible to the device under test(DUT). It was implemented as digital IP core for semiconductor manufacturing process($0.11{\mu}m$, GL130SB). Specialized method helps to observe the propagation time delay in one element of the standard-cell library with up-to picoseconds accuracy and less. Thus, the special useful solutions for VLSI schematic-to-parameters extraction (STPE), basic cell layout verification, design simulation and verification are announced.

• Applied Chemistry for Engineering
• /
• v.29 no.6
• /
• pp.645-651
• /
• 2018

Lung cancer has the highest death rate of any cancer diseases in Koreans. However, patients often feel difficult to recognize their disease before facing the terminal diagnosis due to the absence of any significant symptoms. Furthermore, the clear detection of an early cancer stage is usually obscure with existing diagnostic methods. For this reason, extensive research efforts have been made on introducing a wide range of biochemical diagnostic tools for the molecular level analysis of biological fluids for lung cancer diagnoses. A chip-based biosensor, one type of the analytical devices, can be a great potential for the diagnosis, which can be used without any further expensive analytical equipments nor skilled analysts. In this mini review, we highlight recent research trends on searching biomarker candidates and bio-chip sensors for lung cancer diagnosis in addition to discussing their future aspects.

• Korean Journal of Optics and Photonics
• /
• v.32 no.5
• /
• pp.230-234
• /
• 2021

Relief of thermal stress has received great attention, to improve the beam quality and stability of high-power laser diodes. In this paper, we investigate a microtrench structure engraved around a laser-diode chip-on-submount (CoS) to relieve the thermal stress on a laser-diode bar (LD-bar), using the SolidWorks® software. First, we systematically analyze the thermal stress on the LD-bar CoS with a metal heat-sink holder, and then derive an optimal design for thermal stress relief according to the change in microtrench depth. The thermal stress of the front part of the LD-bar CoS, which is the main cause of the "smile effect", is reduced to about 1/5 of that without the microtrench structure, while maintaining the thermal resistance.

• Journal of Veterinary Science
• /
• v.21 no.5
• /
• pp.78.1-78.15
• /
• 2020

Background: Enteritis is one of the most frequently reported symptoms in piglets infected with porcine circovirus type 2 (PCV2), but the immunopathogenesis has not been reported. Objectives: This study examined the effect of a PCV2 infection on the intestinal mucosal immune function through morphological observations and immune-related molecular detection. Methods: Morphological changes within the ileum of piglets during a PCV2 infection were observed. The expression of the related-molecules was analyzed using a gene chip. The immunocyte subsets were analyzed by flow cytometry. The secretory immunoglobulin A (SIgA) content was analyzed by enzyme-linked immunosorbent assay. Results: The PCV2 infection caused ileal villus damage, intestinal epithelial cells exfoliation, and an increase in lymphocytes in the lamina propria at 21 days post-infection. Differentially expressed genes occurred in the defense response, inflammatory response, and the complement and coagulation cascade reactions. Most of them were downregulated significantly at the induction site and upregulated at the effector site. The genes associated with SIgA production were downregulated significantly at the induction site. In contrast, the expression of the Toll-like receptor-related genes was upregulated significantly at the effector site. The frequencies of dendritic cells, B cells, and CD8⁺T cells were upregulated at the 2 sites. The SIgA content decreased significantly in the ileal mucosa. Conclusions: PCV2 infections can cause damage to the ileum that is associated with changes in immune-related gene expression, immune-related cell subsets, and SIgA production. These findings elucidated the molecular changes in the ileum after a PCV2 infection from the perspective of intestinal mucosal immunity, which provides insights into a further study for PCV2-induced enteritis.