Numerical Study on the Thermal Characteristics of the Various Cooling Methods in Electronic Equipment |
Son, Young-Seok
(동의대학교 기계공학부)
Shin, Jee-Young (동의대학교 기계공학부) |
1 |
Forced Convection Cooling across Rectangular Blocks
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2 |
Analysis of Three-Dimensional Mixed Convection Flow about Uniformly Distributed Heat-Generating Blocks on a Conductive Wall
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3 |
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4 |
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5 |
High Heat from a Small Package
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6 |
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7 |
Recent Japanese Thermal Solutions for Portable Computers
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8 |
Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled with a Fluorinert Liquid
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ScienceOn |
9 |
Thermally Optimum Spacing of Vertical Natural Convection Cooled Parallel Plates
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10 |
Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips with Detachable Heat Sinks, Heat Transfer in Electronic Equipment
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11 |
Thermal Characteristics of a Multichip Module Using PF-5060 and Water
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12 |
Analysis of Laminar Forced Convection for Optimal Design of Parallel Plates with Protrusions
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과학기술학회마을 |
13 |
Enhancements of the SIMPLE Method for Predicting Incompressible Fluid Flows
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14 |
Thermal Solutions to Pentium Processors in TCP in Notebooks and Sub-Notebooks
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ScienceOn |
15 |
Convection Heat Transfer in Electronic Equipment Cooling
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16 |
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