Korean Journal of Optics and Photonics (한국광학회지)

Optical Society of Korea (한국광학회)
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Thermal Stress Relief through Introduction of a Microtrench Structure for a High-power-laser-diode Bar

높은 광출력을 갖는 Laser Diode Bar의 열응력 개선: 마이크로-홈 도입을 통한 응력 분포 변화 분석

  • Jeong, Ji-Hun (Department of Information Communication Engineering, Inha University) ;
  • Lee, Dong-Jin (Department of Information Communication Engineering, Inha University) ;
  • O, Beom-Hoan (Department of Information Communication Engineering, Inha University)
  • 정지훈 (인하대학교 정보통신공학과 광소자 및 LED 연구실) ;
  • 이동진 (인하대학교 정보통신공학과 광소자 및 LED 연구실) ;
  • 오범환 (인하대학교 정보통신공학과 광소자 및 LED 연구실)
  • Received : 2021.08.25
  • Accepted : 2021.09.16
  • Published : 2021.10.25
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Abstract

Relief of thermal stress has received great attention, to improve the beam quality and stability of high-power laser diodes. In this paper, we investigate a microtrench structure engraved around a laser-diode chip-on-submount (CoS) to relieve the thermal stress on a laser-diode bar (LD-bar), using the SolidWorks® software. First, we systematically analyze the thermal stress on the LD-bar CoS with a metal heat-sink holder, and then derive an optimal design for thermal stress relief according to the change in microtrench depth. The thermal stress of the front part of the LD-bar CoS, which is the main cause of the "smile effect", is reduced to about 1/5 of that without the microtrench structure, while maintaining the thermal resistance.

열응력 완화 기술은 고출력 레이저 다이오드의 빔의 품질과 안정성을 향상시키기 위한 주요 요소기술로 큰 주목을 받고 있다. 본 연구에서는 레이저 다이오드 바(LD-bar) chip-on-submount (CoS)에 발생하는 열응력 분포 양상을 SolidWorks 소프트웨어를 사용하여 해석하고, 마이크로-홈 구조 도입에 따라 열응력 완화에 미치는 영향을 체계적으로 분석한다. 마이크로-홈 구조는 누적응력을 차단하는 효과가 있는 반면, 열흐름을 방해하는 역기능도 있으므로, 시스템 구조와 방열금속판 두께에 따라 홈 깊이를 최적화할 필요가 있다. 간단히 도입된 예시구조에 대하여, LD-bar CoS의 칩 홀더 금속판에 도입하는 마이크로-홈 구조 최적화를 통해 칩 전면부 표면 응력을 마이크로-홈 구조가 없는 경우의 약 1/5 정도로 낮추었다. 향후 초고출력 시스템에서 방열을 위한 열저항과 광출력 빔크기를 최소한으로 유지하면서, 열응력을 효과적으로 완화시키는 구조로 활용이 기대된다.

Keywords

Acknowledgement

이 연구는 고효율 레이저 특화연구실 프로그램의 일환으로 방위사업청과 국방과학연구소의 지원을 받아 수행되었음 (NO. UD190015ID).

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