• ETRI Journal
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• v.42 no.4
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• pp.491-504
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• 2020

We present AB9, a neural processor for inference acceleration. AB9 consists of a systolic tensor core (STC) neural network accelerator designed to accelerate artificial intelligence applications by exploiting the data reuse and parallelism characteristics inherent in neural networks while providing fast access to large on-chip memory. Complementing the hardware is an intuitive and user-friendly development environment that includes a simulator and an implementation flow that provides a high degree of programmability with a short development time. Along with a 40-TFLOP STC that includes 32k arithmetic units and over 36 MB of on-chip SRAM, our baseline implementation of AB9 consists of a 1-GHz quad-core setup with other various industry-standard peripheral intellectual properties. The acceleration performance and power efficiency were evaluated using YOLOv2, and the results show that AB9 has superior performance and power efficiency to that of a general-purpose graphics processing unit implementation. AB9 has been taped out in the TSMC 28-nm process with a chip size of 17 × 23 ㎟. Delivery is expected later this year.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.31-36
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• 2015

The demand for multi-functionality, high density, high performance, and miniaturization of IC devices has caused the technology paradigm shift for electronic packaging. So, thermal management of new packaged chips becomes a bottleneck for the performance of next generation devices. Among various thermal solutions such as heat sink, heat spreader, TIM, thermoelectric cooler, etc. on-chip liquid cooling module was investigated in this study. Micro-channel was fabricated on Si wafer using a deep reactive ion etching, and 3 different micro-channel designs (straight MC, serpentine MC, zigzag MC) were formed to evalute the effectiveness of liquid cooling. At the heating temperature of $200^{\circ}C$ and coolant flow rate of 150ml/min, straight MC showed the high temperature differential of ${\sim}44^{\circ}C$ after liquid cooling. The shape of liquid flowing through micro-channel was observed by fluorescence microscope, and the temperarue differential of liquid cooling module was measuremd by IR microscope.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.5
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• pp.542-549
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• 2016

This paper presents a SoC (System-on-a-Chip) dedicated for a single-chip smart capsule which can be used to continuously monitor human alimentary canal pH and temperature values. The SoC is composed of the pH and temperature sensor interface circuit, a wireless transceiver, the power management circuit and the flow control logic. Fabricated in $0.18{\mu}m$ standard CMOS technology, the SoC occupies a die area of ${\sim}9 mm^2$. The SoC consumes 6.15 mW from a 3 V power supply, guaranteeing the smart capsule battery life is no less than 24 hours when using 50 mAh coin batteries. The experimental results show that measurement accuracy of the smart capsule is ${\pm}0.1$ pH and ${\pm}0.2^{\circ}C$ for pH and temperature sensing, respectively, which meets the requirement of in-body pH and temperature monitoring in clinical practice.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.196-201
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• 2004

In biometric and biomedical applications, a special transporting mechanism must be designed for the ${\mu}$TAS (micro total analysis system) to move samples and reagents through the microchannels that connect the unit procedure components in the system. An important issue for this miniaturization and integration is microfluid management technique, i.e., microfluid transportation, metering, and mixing. In view of this, this study presents an optimal fuzzy sliding-mode control (OFSMC) design based on the 8051 microprocessor and implementation of a complete microfluidic manipulated system implementation of biochip system with a pneumatic pumping actuator, a feedback-signal photodiodes and flowmeter. The new microfluid management technique successfully improved the efficiency of molecular biology reaction by increasing the velocity of the target nucleic acid molecules, which increases the effective collision into the probe molecules as the target molecules flow back and forth. Therefore, this hybridization chip was able to increase hybridization signal 6-fold and reduce non-specific target-probe binding and background noises within 30 minutes, as compared to conventional hybridization methods, which may take from 4 hours to overnight. In addition, the new technique was also used in DNA extraction. When serum existed in the fluid, the extraction efficiency of immobilized beads with solution flowing back and forth was 88-fold higher than that of free-beads.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.2457-2460
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• 2003

There is a great demand to manipulate biological cell autonomously since biologist should spend much time to obtain skillful manipulation techniques. For this purpose, we propose a cell chip to control, carry, fix and locate the cell. In this paper, we focus on the cell rotator to rotate individual biological cell based on a micro fluidics technology. The cell rotator consists of injection hole and rotation well to rotate a biological cell properly. Under the variation of flow rate in injection hole, the angular velocity of a biological cell is evaluated to find the feasibility of the proposed rotation method. As a practical experiment, Zebrafish egg is employed. Based on this research, we find the possibility of non-contact rotation way that can highly reduce the damage of the biological cell during manipulation. To realize an autonomous biological cell manipulation, a cell chip with manipulation well and micro channel in this research will be utilized effectively in near future.

• Journal of Magnetics
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• v.19 no.1
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• pp.10-14
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• 2014

In this study, we fabricate an integrated microfluidic chip with a planar Hall effect (PHE) sensor for single magnetic bead detection. The PHE sensor was constructed with a junction size of $10{\mu}m{\times}10{\mu}m$ using a trilayer structure of Ta(3 nm)/NiFe(10 nm)/Cu(1.2 nm)/IrMn(10 nm)/Ta(3 nm). The sensitivity of the PHE sensor was 19.86 ${\mu}V/Oe$. A diameter of 8.18 ${\mu}m$ magnetic beads was used, of which the saturation magnetization was ~2.1 emu/g. The magnetic susceptibility ${\chi}$ of these magnetic beads was calculated to be ~0.14. The diluted magnetic beads solution was introduced to the microfluidic channel attributing a single bead flow and simultaneously the PHE sensor voltage was measured to be 0.35 ${\mu}V$. The integrated microchip was able to detect a magnetic moment of $1.98{\times}10^{-10}$ emu.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.396-401
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• 2001

Heat transfer analysis of a iron core type linear motor for surface mounting device applications was considered in this study. In order to avoid the complex conjugate problem a fluid flow regime and a solid regime were considered separately. First, film coefficients of the moving parts were evaluated from computational fluid dynamic analysis and those of the stationary parts from the existing empirical or analytic correlations. And then, by applying them, internal and external temperatures of the linear motor pal1s were computed through finite element analysis. Both computation and measurement were carried out with respect to motor driving power. The measurement did not exhibit a linear temperature variation trend with respect to motor power while the computation revealed a linear correlation. Nonetheless, the computations agreed with the measurements within an error range of 20%. It indicates that an adequate heat transfer model for the reciprocative coil assembly may help more exact prediction.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1680-1681
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• 2011

In this paper, particle counting system using a CMOS image sensor is demonstrated. The system utilizes a linear photodetector array as a detection element. Therefore, the particles are detected by large detection region, in contrast to a single detector in conventional particle counting devices, while maintaining the sensitivity. The advantage of proposed system is that particles are detected in a relatively large area without using the particle focusing method. Also, proposed system can be easily integrated with a microfluidic chip by attaching the device underneath the bottom plate of the microfluidic chip. Detection of polystyrene microbeads has been tested at a flow rate of 4.89mm/s. For 21 measurements, proposed system showed an average count error of 7.29% and a standard deviation of 4.74%. Potentially, the proposed system can detect even smaller particles simply by utilizing a higher resolution CMOS image sensor.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.12
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• pp.95-103
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• 2007

This paper presents a liquid cooling concept for heat rejection of high power electronic devices existing in notebook computers etc. The design, fabrication, and performance of the planar ECF pump and farced-liquid cooling system are summarized. The electro-conjugate fluid (ECF) is a kind of dielectric and functional fluids, which generates jet flows (ECF-jets) by applying static electric field through a pair of rod-like electrodes. The ECF-jet directly acts on the working fluid, so the proposed planar ECF pump needs no moving part, produces no vibration and noise. The planar ECF pump, consists of a pump housing and electrode substrate, achieves maximum flow rate and output pressure of $5.5\;cm^3/s$ and 7.2 kPa, respectively, at an applied voltage of 2.0 kV. The farced-liquid cooling system, constructed with the planar ECF pump, liquid-cooled heat sink and thermal test chip, removes input power up to 80 W keeping the chip surface temperature below $70\;^{\circ}C$. The experimental results demonstrate that the feasibility of forced-liquid cooling system using ECF is confirmed as an advanced cooling solution on the next-generation high power electronic devices.