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Liquid Cooling System Using Planar ECF Pump for Electronic Devices  

Seo, Woo-Suk (한국기계연구원 나노기계연구본부)
Ham, Young-Bog (한국기계연구원 나노기계연구본부)
Park, Jung-Ho (한국기계연구원 나노기계연구본부)
Yun, So-Nam (한국기계연구원 나노기계연구본부)
Yang, Soon-Young (울산대학교 기계자동차공학부)
Publication Information
Journal of the Korean Society for Precision Engineering / v.24, no.12, 2007 , pp. 95-103 More about this Journal
Abstract
This paper presents a liquid cooling concept for heat rejection of high power electronic devices existing in notebook computers etc. The design, fabrication, and performance of the planar ECF pump and farced-liquid cooling system are summarized. The electro-conjugate fluid (ECF) is a kind of dielectric and functional fluids, which generates jet flows (ECF-jets) by applying static electric field through a pair of rod-like electrodes. The ECF-jet directly acts on the working fluid, so the proposed planar ECF pump needs no moving part, produces no vibration and noise. The planar ECF pump, consists of a pump housing and electrode substrate, achieves maximum flow rate and output pressure of $5.5\;cm^3/s$ and 7.2 kPa, respectively, at an applied voltage of 2.0 kV. The farced-liquid cooling system, constructed with the planar ECF pump, liquid-cooled heat sink and thermal test chip, removes input power up to 80 W keeping the chip surface temperature below $70\;^{\circ}C$. The experimental results demonstrate that the feasibility of forced-liquid cooling system using ECF is confirmed as an advanced cooling solution on the next-generation high power electronic devices.
Keywords
Electro-Conjugate Fluid; Planar ECF Pump; Functional Fluids; Liquid Cooling System; Electronics Cooling;
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Times Cited By KSCI : 1  (Citation Analysis)
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