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http://dx.doi.org/10.6117/kmeps.2015.22.4.031

Study of On-chip Liquid Cooling in Relation to Micro-channel Design  

Won, Yonghyun (Graduate School of NID Fusion Technology, Seoul National Univ. of Science and Technology)
Kim, Sungdong (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology)
Kim, Sarah Eunkyung (Graduate School of NID Fusion Technology, Seoul National Univ. of Science and Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.22, no.4, 2015 , pp. 31-36 More about this Journal
Abstract
The demand for multi-functionality, high density, high performance, and miniaturization of IC devices has caused the technology paradigm shift for electronic packaging. So, thermal management of new packaged chips becomes a bottleneck for the performance of next generation devices. Among various thermal solutions such as heat sink, heat spreader, TIM, thermoelectric cooler, etc. on-chip liquid cooling module was investigated in this study. Micro-channel was fabricated on Si wafer using a deep reactive ion etching, and 3 different micro-channel designs (straight MC, serpentine MC, zigzag MC) were formed to evalute the effectiveness of liquid cooling. At the heating temperature of $200^{\circ}C$ and coolant flow rate of 150ml/min, straight MC showed the high temperature differential of ${\sim}44^{\circ}C$ after liquid cooling. The shape of liquid flowing through micro-channel was observed by fluorescence microscope, and the temperarue differential of liquid cooling module was measuremd by IR microscope.
Keywords
Liquid cooling; Thermal management; Micro-channel; direct cooing;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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