• Title/Summary/Keyword: Chip Flow

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Flow Properties of Micro Column Packed with Perfusive Particles (투과성 입자로 이루어진 미세 칼럼의 유동 특성)

  • Kim, Duck-Jong;Hwang, Yun-Wook;Park, Sang-Jin;Heo, Pil-Woo;Yoon, Eui-Soo
    • 유체기계공업학회:학술대회논문집
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    • 2005.12a
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    • pp.89-93
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    • 2005
  • In this work, perfusive particles are used to form a micro column in a microfluidic chip and flow properties of the micro column are investigated. The packing flow velocity and the column/particle size ratio are shown to be important parameters affecting the packing density of the micro column. Experimental results show that the effect of the column/particle size ratio on the flow resistance of the micro column is negligible. This contrasts with previous works on the effect of the column/particle size ratio on the total pressure drop across the column.

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Design and Fabrication of Six-Degree of Freedom Piezoresistive Turbulent Water Flow Sensor

  • Dao, Dzung Viet;Toriyama, Toshiyuki;Wells, John;Sugiyama, Susumu
    • Journal of Sensor Science and Technology
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    • v.11 no.4
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    • pp.191-199
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    • 2002
  • This paper presents the design concept, theoretical investigation, and fabrication of a six-degree of freedom (6-DOF) turbulent flow micro sensor utilizing the piezoresistive effect in silicon. Unlike other flow sensors, which typically measure just one component of wall shear stress, the proposed sensor can independently detect six components of force and moment on a test particle in a turbulent flow. By combining conventional and four-terminal piezoresistors in Si (111), and arranging them suitably on the sensing area, the total number of piezoresistors used in this sensing chip is only eighteen, much fewer than the forty eight piezoresistors of the prior art piezoresistive 6-DOF force sensor.

A Study on the Conjugate Heat Transfer from Horizontal Plate with Protruding Heat Source (열원이 부착된 수평 평판에서 복합 열전달에 관한 연구)

  • 김병철;주동인
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.14 no.6
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    • pp.512-518
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    • 2002
  • The real chip and similarity model were used to investigate the thermal behavior and velocity distribution of air from the heat source with the location and the amount of heat experimentally and numerically, and compared. The heat generated in the block is not cooled by convection and show the high temperature by the stagnation of heat flow. After maintaining the high temperature of block by the natural convection, the sudden drop of temperature with the air flow was shown in the channel but the decreasing rate was small with the time. The inward block was effected by infinitesimal air flow generated between block and channel and outward block was effected by the entry condition.

Flow Visualization of the Flow inside the Droplet Passing through a Straight and a Diverging Channel (직선채널과 확대채널에서의 액적 내부 유동 가시화)

  • Jin, Byung-Ju;Kim, Young-Won;Yoo, Jung-Yul
    • 한국가시화정보학회:학술대회논문집
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    • 2007.11a
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    • pp.71-76
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    • 2007
  • Flow visualization of a droplet passing through a straight channel and a diverging channel has been carried out using micro-PIV. Diverging channel is frequently used in lab-on-a-chip and microfluidic devices, where flow pattern inside the droplet passing is quite different from that through a straight channel. In the present study, we visualized the droplet flow in three different regions. The first region is where the droplet has a wide contact area with the channel wall, the second region is characterized with a narrow contact area and the third region is where droplet is detached from the channel wall. Visualization results show that the internal flow inside the droplet passing through the straight channel moves in the opposite direction to the droplet velocity in the near wall exhibiting complex flow patterns. But in the diverging channel the internal flow inside the droplet moves in the same direction as the droplet velocity due to the shear induced by oil phase flow exhibiting rather simple flow pattern.

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PLC Optical Sensor for Contamination Monitoring on the Flow-Cell in the Water Quality Measurement System (수질 측정용 플로우 셀의 오염 모니터링을 위한 평면광도파로 센서)

  • Han, Seung Heon;Kim, Tae Un;Jung, Haeng Yun;Ki, Hyun Chul;Kim, Doo Gun;Kim, Seon Hoon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.6
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    • pp.472-476
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    • 2019
  • We have proposed a novel planar lightwave circuit (PLC) optical sensor to monitor the contamination in a flow-cell where water is continuously supplied through a water quality measurement system. We designed a PLC chip with a V-shape waveguide and the simulated its function as a sensor for monitoring contamination in a flow-cell using a numerical the FDTD (finite-difference time-domain) analysis. A novel cross type of waveguide was introduced to make the PLC chip of the V-shaped waveguide. The fabricated PLC was cut into the cross waveguide. A change in the optical propagation loss of the PLC sensor was observed after immersing the PLC sensor into city water. It was determined that the propagation loss of the PLC sensor was 3 dB at a wavelength of $1.55{\mu}m$ in the city water for 15 days.

Fabrication of Through-hole Interconnect in Si Wafer for 3D Package (3D 패키지용 관통 전극 형성에 관한 연구)

  • Kim, Dae-Gon;Kim, Jong-Woong;Ha, Sang-Su;Jung, Jae-Pil;Shin, Young-Eui;Moon, Jeong-Hoon;Jung, Seung-Boo
    • Journal of Welding and Joining
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    • v.24 no.2
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    • pp.64-70
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    • 2006
  • The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

A Deflection Routing using Location Based Priority in Network-on-Chip (위치 기반의 우선순위를 이용한 네트워크 온 칩에서의 디플렉션 라우팅)

  • Nam, Moonsik;Han, Tae Hee
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.11
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    • pp.108-116
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    • 2013
  • The input buffer in Network on Chip (NoC) router plays a key role in on-chip-network performance, which is utilized in flow control and virtual channel. However, increase in area and power due to input buffers as the network size gets larger is becoming severe. To solve this problem, a bufferless deflection routing without input buffer was suggested. Since the bufferless deflection routing shows poor performance at high network load, other approaches which combine the deflection routing with small size side buffers were also proposed. Nonetheless these new methods still show deficiencies caused by frequent path collisions. In this paper, we propose a modified deflection routing technique using a location based priority. In comparison with existing deflection routers, experimental results show improvement by 12% in throughput with only 3% increase in area.

Development of Micro-chip Removal Equipment Using Bubble (버블을 이용한 미세칩 제거장치의 개발)

  • Choi, Sung-Yun;Kwon, Dae-Gyu;Lee, Sea-Han;Park, Tae-hyun;Wang, Duck Hyun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.10
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    • pp.88-94
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    • 2021
  • Machining operations require the removal of chips to keep the water-soluble cutting oil clean and fresh throughout the operation time. Water-soluble cutting oil for metal processing is diluted using a 3-8% solution in water which is generally replaced every three to six months. This study aims to develop multiple purification devices to efficiently remove fine contaminating particles from water-soluble cutting oil. The 2D concept designs were created using AutoCAD. The designs were drawn using the 3D modelling feature of CATIA. Flow analysis was performed in a bubble purifier using Ansys computational fluid dynamics (CFD). This analysis has aided in improving the design and structure of the device to create the final prototype. Experiments were conducted to check the prototype's performance. Comparisons of the effects of each process variable on the experiment was carried out using ANOVA.

Inertial Microfluidics-Based Cell Sorting

  • Kim, Ga-Yeong;Han, Jong-In;Park, Je-Kyun
    • BioChip Journal
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    • v.12 no.4
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    • pp.257-267
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    • 2018
  • Inertial microfluidics has attracted significant attention in recent years due to its superior benefits of high throughput, precise control, simplicity, and low cost. Many inertial microfluidic applications have been demonstrated for physiological sample processing, clinical diagnostics, and environmental monitoring and cleanup. In this review, we discuss the fundamental mechanisms and principles of inertial migration and Dean flow, which are the basis of inertial microfluidics, and provide basic scaling laws for designing the inertial microfluidic devices. This will allow end-users with diverse backgrounds to more easily take advantage of the inertial microfluidic technologies in a wide range of applications. A variety of recent applications are also classified according to the structure of the microchannel: straight channels and curved channels. Finally, several future perspectives of employing fluid inertia in microfluidic-based cell sorting are discussed. Inertial microfluidics is still expected to be promising in the near future with more novel designs using various shapes of cross section, sheath flows with different viscosities, or technologies that target micron and submicron bioparticles.

Environment-Friendly Metal Cutting Technology using Cooled Air (냉각공기에 의한 환경 친화적 절삭가공기술)

  • Lee, Jong-Hang;Cho, Woong-Shik;Chung, Joon-Ki;Park, Ceol-Woo;Kim, Young-Jung
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.6
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    • pp.114-120
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    • 2001
  • It is necessary to develop a new metal cutting technology which does not use cutting fluid, since cutting fluid can have undesirable effect on workers's health and working environment. For this to be possible, it is necessary to replace the conventional method of using cutting fluid, whose basic functions are removing chip and heat, and providing lubrication between tool and chip. In this work, cooled air is utilized in order to replace cutting fluid. Experiments were carried out while cutting workpiece with HSS flat endmill under a variety of supply conditions for cooled air. Also the performance characteristics of the air cooling system. which was built for the experiments, were carefully analyzed. For the reliable operation of air cooling system. moisture contained in the cooled air had to be removed before being supplied to the workpiece and tools. It was found that depending on the amount of its flow rate the temperature of cooled air changes at the time of injection from the nozzle. The flow rate of cooled air also plays an important role in removing the accumulated chip on the workpiece. After comparing the flank wear for the three cases of using cooled air, cutting fluid, and pure dry technique, it was demonstrated that the level of flank wear was similar for the cases of cooled air and cutting fluid. The pure dry technique, however, showed higher level of flank wear than cooled air.

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