• Journal of the Korean Society of Industry Convergence
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• v.26 no.1
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• pp.193-199
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• 2023

In this study, an analysis was conducted to analyze the structural stability of the piezoelectric power generation module and to determine the optimal burying hole interval for concrete, the installation site of the power generation module. A piezoelectric element refers to a functional ceramic having a piezoelectric direct effect that converts mechanical energy into electrical energy and a piezoelectric reverse effect. In the analysis of the piezoelectric power generation module, the load condition was applied with about 16 tons and a total of 10 wheels in consideration of the container trailer. The purpose was to evaluate the stability of major components of the piezoelectric power generation module through finite element analysis. In order to determine the optimal burying location of the concrete ground for burying the piezoelectric power generation module, the stability of the ground structure according to the distance of the holes was determined. As a result of the analysis, the maximum stress of the piezoelectric power generation module was generated in the support spring, showing a stress of about 276.7 MPa. It was found that the spacing of holes for embedding the piezoelectric power generation module should be set to a minimum of 100 mm or more.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.239-242
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• 2003

Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.2
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• pp.67-73
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• 2017

Recently, macroporous ceramic materials with high electrical conductivity and mechanical strength are urgently needed for semiconductor and display manufacturing devices. In this work, we obtained electro-conducting macroporous aluminosilicate ceramics having surface resistivity of 108~1,010 ohm by dispersing electro-conducting carbon in ceramic matrix. By addition of 0.5~3.0 wt% frit glass, chemical bonding between grains was strengthened, and flexural strength was enhanced up to 160 MPa as a result. We evaluated the characteristics of present ceramics as vacuum chuck module for liquid crystal display display manufacturing devices.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.159-160
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• 2007

• Transactions of Materials Processing
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• v.16 no.5 s.95
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• pp.396-400
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• 2007

LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.

• Proceedings of the IEEK Conference
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• 2001.06a
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• pp.155-158
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• 2001

A 640Gb/s high-speed ATM switching system that is based on the technologies of advanced MCM, 0.25um CMOS and optical WDM interconnection is fabricated for future N-ISDN services. A 40 layer, 160mm$\times$114mm ceramic MCM realizes the basic ATM switch module with 80Gbps throughput. The basic unit ATM switch module with 80Gb/s throughput. The basic unit ATM switch MCM consists of in 8 chip advanced 0.25um CMOS VLSI and 32 chip I/O Bipolar VLSIs. The MCM employs an 40 layer, very thin layer ceramic MCM and a uniquely structured closed loop type liquid colling system is adopted to cope with the MCM's high-power dissipation of 230w. The MCM is Mounted on a 32cm$\times$50cm mother board. A three stage ATM switch is realized by optical WDM interconnection between the high-performance MCM.

• Journal of Electrical Engineering and Technology
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• v.8 no.4
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• pp.808-812
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• 2013

Multilayer capacitors with high ripple current and high capacitance were manufactured. The electrical properties of these capacitors were characterized for potential application for DC-link capacitors in hybrid electric vehicle inverters. Internal electrode structures were designed to achieve high capacitance and reliability. A single multilayer capacitor showed $0.46{\mu}F/cm^3$ of capacitance, 0.65% of dielectric loss, and 1450 V to 1650 V of dielectric breakdown voltage depending on the design of the internal electrode. The capacitor module designed with several multilayer capacitors gave a total capacitance of $450{\mu}F$, which is enough for hybrid electric vehicles. In particular, an equivalent series resistance of $4.5m{\Omega}$ or less will result in 60 $A_{rms}$, thereby reaching the allowed ripple current for hybrid electric vehicles.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.12
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• pp.943-948
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• 2012

A new water energy harvester module, which is composed of piezoelectric bimorph cantilevers, harvesting circuit and a shaft with 16 impellers at a center axis, was fabricated for energy harvesting application. High energy density $Pb(Zr_{0.54}Ti_{0.46})O_3$ + 0.2 wt% $Cr_2O_3$ + 1.0 wt% $Nb_2O_5$ (PZT-CN) thick film obtained by tape casting method was used for the bimorph cantilever. The PZT-CN bimorph cantilever with a proof mass of 49 g exhibited extremely high output power of 22.5 mW (24 $mW//cm^3$) at resonance frequency of 11 Hz. In addition, the fabricated water energy harvester has a cylindrical structure with 48 bimorph cantilevers clamped at inner surface. A significantly high output power of 433 mW was obtained at a rotation speed of 120 rpm with a resistive load of $500{\Omega}$ for the water energy harvester.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.271-271
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• 2007

LTCC 소재는 glass/ceramic composite로 구성된다. LTCC 소재에 embedding 되는 고유전율 소재 또한 이와 같은 소재설계를 통하여 무수축 접합이 가능할 것으로 판단된다. 그러나 이에 대한 연구결과가 보고된바 없고 몇몇 $Al_2O_3$의 infiltration에 대한 무수축 소성 관련 선행 연구를 바탕으로 고유전율 소재인 $BaTiO_3$의 무수축 소성이 연구되는 것이 필요한 시점이다. 따라서 본 연구는 저온에서의 glass infiltration에 의한 무수축 $BaTiO_3$ layer의 저온소성특성 및 유전특성을 평가하였다. 실험결과 $785^{\circ}C$에서 glass의 충분한 침투가 확인되며 결정구조에서는 glass/$BaTiO_3$ composite이 형성되었다. 무수축 접합 layer의 소성조건과 glass 두께 변화에 따른 유전특성 및 layer의 결정구조를 비교평가 하였다.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.15-22
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• 2019

In these days, importance of the power electronic devices and modules keeps increasing due to electric vehicles and energy saving requirements. However, current silicon-based power devices showed several limitations. Therefore, wide band gap (WBG) semiconductors such as SiC, GaN, and $Ga_2O_3$ have been developed to replace the silicon power devices. WBG devices show superior performances in terms of device operation in harsh environments such as higher temperatures, voltages and switching speed than silicon-based technology. In power devices, the reliability of the devices and module package is the critically important to guarantee the normal operation and lifetime of the devices. In this paper, we reviewed the recent trends of the power devices based on WBG semiconductors as well as expected future technology. We also presented an overview of the recent package module and fabrication technologies such as direct bonded copper and active metal brazing technology. In addition, the recent heat management technologies of the power modules, which should be improved due to the increased power density in high temperature environments, are described.