• Title/Summary/Keyword: Ceramic deposition

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Chemical Beam Deposition of $MgF_2$ Thin Films (화학선 증착법에 의한 $MgF_2$ 박막제조)

  • 박보현;백성기
    • Journal of the Korean Ceramic Society
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    • v.33 no.3
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    • pp.299-306
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    • 1996
  • We invesgated the fesibility of thin films deposition by pyrolysis of metalorganic precursors using chemical beam deposition (CBD) process. We attempted to understand the effects of deposition variables such as substrate temperature operating pressure effusion cell temperature and H2 partial pressure on the properties of MgF2 grown by CBD. Mg(tfac)2 was used as a precursor. MgF2 thin films were always grown in an amorphous state and crystallized bypost-annealing. he higher the substrate temperature and the lower the operating pressure the less the impurities I the deposited MgF2 thin films. H2 gas has to be supplied for the pyrolitic reaction of Mg(tfac)2 decomposition. MgF2 films annealed in H2 have lower C impurity than those annealed in O2. But their crysatllinity was independent of annealing atmosphere. The optimum conditions for the prepara-tion of MgF2 films by CBD process were as following : The substrate temperature 55$0^{\circ}C$ the operating pressure 10-4 torr; effusion cell temperature 21$0^{\circ}C$ the percentage of H2 100% Post-annealing in H2 gas was required to remove residual carbon and to form MgF2 crystalline phase.

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Interfacial Characteristics of $\beta$-SiC Film Growth on (100) Si by LPCVD Using MTS (MTS를 사용한 LPCVD 법에 의한 (100)Si 위의 $\beta$-SiC 증착 및 계면특성)

  • 최두진;김준우
    • Journal of the Korean Ceramic Society
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    • v.34 no.8
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    • pp.825-833
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    • 1997
  • Silicon carbide films were deposited by low pressure chemical vapor deposition(LPCVD) using MTS(CH3SICl3) in hydrogen atmosphere on (100) Si substrate. To prevent the unstable interface from being formed on the substrate, the experiments were performed through three deposition processes which were the deposition on 1) as received Si, 2) low temperature grown SiC, and 3) carbonized Si by C2H2. The microstructure of the interface between Si substrates and SiC films was observed by SEM and the adhesion between Si substrates and SiC films was measured through scratch test. The SiC films deposited on the low temperature grown SiC thin films, showed the stable interfacial structures. The interface of the SiC films deposited on carbonized Si, however, was more stable and showed better adhesion than the others. In the case of the low temperature growth process, the optimum condition was 120$0^{\circ}C$ on carbonized Si by 3% C2H2, at 105$0^{\circ}C$, 5 torr, 10 min, showed the most stable interface. As a result of XRD analysis, it was observed that the preferred orientation of (200) plane was increased with Si carbonization. On the basis of the experimental results, the models of defect formation in the process of each deposition were compared.

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Development of Highly Conductive and Corrosion-Resistant Cr-Diamond-like Carbon Films

  • Ko, Minjung;Jun, Yee Sle;Lee, Na Rae;Kang, Suhee;Moon, Kyoung Il;Lee, Caroline Sunyong
    • Journal of the Korean Ceramic Society
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    • v.56 no.3
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    • pp.317-324
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    • 2019
  • Cr-diamond-like carbon (Cr-DLC) films were deposited using a hybrid method involving both physical vapor deposition and plasma-enhanced chemical vapor deposition. DLC sputtering was carried out using argon and acetylene gases. With an increase in the DC power, the Cr content increased from 14.7 to 29.7 at%. The Cr-C bond appeared when the Cr content was 17.6 at% or more. At a Cr content of 17.6 at%, the films showed an electrical conductivity of > 363 S/cm. The current density was 9.12 × 10-2 ㎂/㎠, and the corrosion potential was 0.240 V. Therefore, a Cr content of 17.6 at% was found to be optimum for the deposition of the Cr-DLC thin films. The Cr-DLC thin films developed in this study showed high conductivity and corrosion resistance, and hence, are suitable for applications in separators.

Silicon Carbide Coating by Thermal Decomposition of tetramethylsilane

  • YOON Kyung-Hoon
    • Proceedings of the Korean Ceranic Society Conference
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    • 1986.12a
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    • pp.211-225
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    • 1986
  • Silicon carbide coating has been studied using a graphite substrate, a mixture of tetramethylsilane and hydrogen or argon at deposition temperature (T) of 950 to $1200^{\circ}C$ total pressure of 20 to 50 torr and carrier gas flow rate of 0 to 901/h. Deposition kinetic study has shown that a transition, from a surface reaction limited process to a diffusion limited one, takes place near $1100^{\circ}C$. Deposition rate depends directly upon the experimental parameters. The influence of the main process parameters is also discussed to relate the physiochemical properties of the coating to the deposition conditions.

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Numerical Simulation: Effects of Gas Flow and Heat Transfer on Polymer Deposition in a Plasma Dry Etcher

  • Joo, Junghoon
    • Applied Science and Convergence Technology
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    • v.26 no.6
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    • pp.184-188
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    • 2017
  • Polymer deposition pattern on the ceramic lid surface is analyzed by numerical modeling. Assumption was made that is affected by gas flow pattern from the horizontal and vertical nozzles, temperature profile from the finger-like branches made of graphite and electrostatic potential effect. Calculated results showed gas flow dynamics is less relevant than two others. Temperature and electrostatic effects are likely determining the polymer deposition pattern based on our numerical simulation results.

Effect of Working Pressure and Substrate Bias on the Tribology Properties of the Cr-Al-N Coatings (Cr-Al-N 코팅의 마찰마모 특성에 미치는 공정압력과 바이어스 전압의 영향)

  • Choi, Seon-A;Kim, Seong-Won;Lee, Sungmin;Kim, Hyung-Tae;Oh, Yoon-Suk
    • Journal of the Korean institute of surface engineering
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    • v.50 no.6
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    • pp.473-479
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    • 2017
  • CrN coatings have been used as protective coatings for cutting tools, forming tools, and various tribological machining applications because these coatings have high hardness. Cr-Al-N coatings have been investigated to improve the properties of CrN coatings. Cr-Al-N coatings were fabricated by a hybrid physical vapor deposition method consisting of unbalanced magnetron sputtering and arc ion plating with different working pressure and substrate bias voltage. The phase analysis of the composition was performed using XRD (x-ray diffraction). Cr-Al-N coatings were grown with textured CrN phase and (111), (200), and (220) planes. The adhesion strength of the coatings tested by scratch test increased. The friction coefficient and removal rate of the coatings were measured by a ball-on-disk test. The friction coefficient and removal rate of the coatings decreased from 0.46. to 0.22, and from $2.00{\times}10^{-12}m^2/N$ to $1.31{\times}10^{-13}m^2/N$, respectively, with increasing bias voltage. The tribological properties of the coatings increased with increasing substrate bias voltage.

Low Temperature Consolidation of Silica Film by Flame Hydrolysis Deposition (FHD 공정으로 제조한 실리카 막의 저온 고밀화)

  • Kim, Tae-Hong;Yoon, Ki-Hyun
    • Journal of the Korean Ceramic Society
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    • v.39 no.3
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    • pp.278-285
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    • 2002
  • For planar optical devices, silica film deposited by FHD was fabricated at low temperature. To prepare silica film at low temperature, we have changed B, P amounts and investigated consolidation effect with varying consolidation temperature and atmosphere on microstructural change, and also observed optical property. The optimum consolidation temperature in He was lower than that of other atmosphere, its temperature could be lowered to 1050$^{\circ}C$. As a result, the roughness of flat silica film prepared at 1050$^{\circ}C$ showed 5, 6nm.

Electrical Properties of DC Sputtered Titanium Nitride Films with Different Processing Conditions and Substrates

  • Jin, Yen;Kim, Young-Gu;Kim, Jong-Ho;Kim, Do-Kyung
    • Journal of the Korean Ceramic Society
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    • v.42 no.7 s.278
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    • pp.455-460
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    • 2005
  • Deposition of TiN$_{x}$ film was conducted with a DC sputtering technique. The effect of the processing parameters such as substrate temperature, deposition time, working pressure, bias power, and volumetric flowing rate ratio of Ar to N$_{2}$ gas on the resistivity of TiN$_{x}$ film was systematically investigated. Three kinds of substrates, soda-lime glass, (100) Si wafer, and 111m thermally grown (111) SiO$_{2}$ wafer were used to explore the effect of substrate. The phase of TiN$_{x}$ film was analyzed by XRD peak pattern and deposition rate was determined by measuring the thickness of TiNx film through SEM cross-sectional view. Resistance was obtained by 4 point probe method as a function of processing parameters and types of substrates. Finally, optimum condition for synthesizing TiN$_{x}$ film having lowest resistivity was discussed.

High Density Silver Nanowire Arrays using Self-ordered Anodic Aluminum Oxide(AAO) Membrane

  • Kim, Yong-Hyun;Han, Young-Hwan;Lee, Hyung-Jik;Lee, Hyung-Bock
    • Journal of the Korean Ceramic Society
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    • v.45 no.4
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    • pp.191-195
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    • 2008
  • Highly ordered silver nanowire with a diameter of 10 nm was arrayed by electroless deposition in a porous anodic aluminum oxide(AAO) membrane. The AAO membrane was fabricated electrochemically in an oxalic acid solution via a two-step anodization process, while growth of the silver nanowire was initiated by using electroless deposition at the long-range-ordered nanochannels of the AAO membrane followed by thermal reduction of a silver nitrate aqueous solution by increasing the temperature up to $350^{\circ}C$ for an hour. An additional electro-chemical procedure was applied after the two-step anodization to control the pore size and channel density of AAO, which enabled us to fabricate highly-ordered silver nanowire on a large scale. Electroless deposition of silver nitrate aqueous solution into the AAO membrane and thermal reduction of silver nanowires was performed by increasing the temperature up to $350^{\circ}C$ for 1 h. The morphologies of silver nanowires arrayed in the AAO membrane were investigated using SEM. The chemical composition and crystalline structure were confirmed by XRD and EDX. The electroless-deposited silver nanowires in AAO revealed a well-crystallized self-ordered array with a width of 10 nm.